Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Please note that all times are shown in the time zone of the conference. The current conference time is: 17th Sept 2026, 11:51:07am CEST

 
Date: Thursday, 17/Sept/2026
8:30am
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9:15am		 Keynote 2
Location: Conference 1 + 2
Chair: Lorenzo Codecasa, Politecnico di Milano

"The Power of Light – Hot Stuff"
Stefan Groetsch, ams-OSRAM International GmbH
9:15am
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10:35am		 S 4: Thermal Materials Innovations
Location: Conference 1 + 2
Chair: Mohamad Abo Ras, NANOTEST
 

Laser Powder Bed Fusion (LPBF) of Copper-graphene Metal Matrix Composites for Enhanced Heat Transfer

Wessel W. Wits1,2, Hyunjong Lee1, Leonore van Goor1, Bernard Geurts1, Davoud Jafari3

1: Faculty of Electrical Engineering, Mathematics and Computer Science, University of Twente, Netherlands; 2: Royal Netherlands Aerospace Centre (NLR), Marknesse, Netherlands; 3: Faculty of Engineering Technology, University of Twente, Netherlands


Lightweight Thermal Management in Electric Vehicle Body Components: Injection‑Molded Thermoplastic Sandwiches with Embedded Electronics

Peter Meszmer1,4, Sandy Klengel2, Marcus Schulz3, Steffen Müller2, Ralph Schacht5, Masoumeh Zarrabian3, Mohamad Abo Ras3, Bernhard Wunderle1,4

1: Chair Materials and Reliability of Microsystems, TU Chemnitz, Germany; 2: Fraunhofer Institute for Microstructure of Materials and Systems: Halle, Germany; 3: Berliner Nanotest und Design GmbH, Germany; 4: Center for Materials, Architectures and Integration of Nanomembranes, TU Chemnitz, Germany; 5: Brandenburg University of Technology Cottbus-Senftenberg


Influence of Surface Roughness on the Thermal and Reliability Performance of Thermal Interface Materials

Aron Reinke, Antonio Harder, Santiago Campos, Teresa Bräuer, Mohamad Abo Ras, Pattric Zimon

Nanotest, Germany


Temperature-dependent Switching Current Density and Thermal-shock Response of Patterned Niobium Thin-film Structures for Cryogenic 3D Integration

Awais Qadir1,3, Klaus Vogel2, Nathanael Jöhrmann1,2, Christian Hofmann2, Uwe Zschenderlein1, Matthias Prinz2, Bernhard Wunderle1,2,3,4

1: Professorship Materials and Reliability of Microsystems, Chemnitz University of Technology, Chemnitz, Germany; 2: Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany; 3: Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology Chemnitz, Germany; 4: Micro Materials Centre Fraunhofer Institute for Electronic Nano Systems – ENAS Chemnitz, Germany
10:35am
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10:55am		 Vendor Session 2
Location: Conference 1 + 2
Chair: Corinna Grosse-Kockert, Berliner Nanotest und Design GmbH

Johannes Gentz (Optris GmbH & Co. KG):
Measurement Accuracy and Spatial Resolution in Infrared Thermography of Electronic Components
Balancing Bolometer Pixel Pitch, Camera Performance, and Optics 

Pierre Everaere (INSIDIX):
TDM by INSIDIX: Multiscale Warpage Measurement from Wafer to Package
10:55am
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11:20am		 Coffee Break 1
11:20am
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1:00pm
Live Now 		S 5: Cooling Concepts & Thermal Technologies
Location: Conference 1 + 2
Chair: Ralph Schacht, BTU Cottbus-Senftenberg
 

CuBrick: A Novel Vertical Dielectric Immersion Cooling Approach for Power Semiconductors

Johann Renner, Cuong Hoang, Till Huesgen

University of Applied Sciences Kempten, Germany


Design and Implementation of an Autonomous Sensor-driven Control Framework for Benchmarking Air-based Server Cooling

Eoin Oude Essink1, Md Robiul Hossain1,3, Ciara Ahern1, Tim Persoons2, Sajad Alimohammadi1

1: Technological University Dublin, Ireland; 2: Trinity College Dublin, the University of Dublin, Ireland; 3: Digital Futures Research Hub, Technological University Dublin, Ireland


Optimisation of Overmolded PowerModules for EV Energy Conversion

Jérôme Hélie1, Federicoie Ghioldi2, Federico Piscaglia2, Alexandre Marie3, Jean-Pierre Fradin3

1: Schaeffler, France; 2: Dept. of Aerospace Science and Technology, Politecnico di Milano, Milano, Italy; 3: ICAM school of Engineering, Toulouse, France


Development of a Test Bed to Analyse the Cooling Capability of an Air Amplifier for Data Centre Server Thermal Management

David W. Salter1, Tim Persoons2, Sajad Alimohammadi1

1: School of Mechanical Engineering, Technological University Dublin, City Campus, Ireland; 2: Department of Mechanical, Manufacturing & Biomedical Engineering, Trinity College Dublin, Ireland


Packaging and Thermal Management Concept of Power Antenna-in-substrate (AiS) Chip-on-flex Assemblies on Curved Surfaces

Bernhard Wunderle1,2,3,4, Jannik Haseloff5, Jörg Arnold1, Jens Heilmann1, Dragos Dancila6, George Konstantinidis7, Afshin Ziaei8, Mohamad Abo Ras5

1: TU Chemnitz, Germany; 2: Fraunhofer ENAS, Chemnitz, Germany; 3: Center for Materials, Architectures and Integration of Nanomembranes at TU Chemnitz, Germany; 4: Centre for Micro-and Nanotechnologies at TU Chemnitz, Germany; 5: Berliner Nanotest & Design GmbH, Germany; 6: Uppsala University, Sweden; 7: Foundation for Research and Technology Hellas (FORTH), Greece; 8: Thales Research and Technology, Palaiseau, France
1:00pm
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2:00pm		 Lunch
 Steering Committee Meeting
Location: NYX 1
2:00pm
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3:00pm		 PS_B: Poster Session B
Location: Conference 1 + 2
Chair: András Poppe, Budapest University of Technology and Economics
 

Innovative Solution for Multiscale Warpage Measurement of Complex Integrated Packages

Pierre Everaere, Nicolas Choisel, Pierre Vernhes

INSIDIX, France


Lumped‑parameter Modelling of PCM‑integrated Heat Sinks with Experimental Validation

Michiel De Paepe1,2, Maité Goderis1,2, Jana Rogiers1,2, Wito Plas1,2, Michel De Paepe1,2,3

1: Ghent University, Belgium; 2: FlandersMake@Ugent; 3: University of Cape Town, South Africa


Two-Phase Pool Boiling Immersion Cooling for Prismatic Lithium-Ion Batteries Subjected to Higher Discharge Rates

Rajesh Nimmagadda, Kantharuphan Annathurai, Daniel Trimble, Seamus M. O’Shaughnessy

Trinity College Dublin, Ireland


Electro-thermal Simulation of aSi0.33Ge0.665Sn0.005 Reconfigurable Field-effect Transistor

Duru Bozkurt1, Andrea Malignaggi2, Ignatii Zaitsev2, Masiar Sistani3, Andreas Fuchsberger3, Nikolas Thomas Knaller3, Corrado Carta2, Costanza Lucia Manganelli2

1: Sabanci University; 2: IHP-Leibniz Institute for High Performance Microelectronics, Germany; 3: Institute of Solid State Electronics, Technische Universit¨at Wien, Austria


Experimental and Numerical Investigation of an SLA-Manufactured Alumina Ceramic Heat Sink for Wide-Bandgap Power Modules

Lucie Teulet1, Jean-Pierre Fradin2, Ahmad Batikh2, Alexandre Marie2, Benjamin Périé2, Virgile Puel2, Emmanuel Marcault1, Lucile Mage1, Patrick Tounsi3

1: CEA, France; 2: ICAM, France; 3: LAAS-CNRS, France


Thermal Optimization of UVC LED Cooling Solutions Using a Combination of Thermal Simulations and Microthermography

Zygimantas Staliulionis, Rita Plaipaitė-Nalivaiko, Marjan Monshi

Lithuanian university of Applied Engineering Sciences, Lithuania


Parametric Model Order Reduction of an IGBT Module for System-level Electro-thermal Simulation

Shashwat Kamal Gogoi1, Aliakbar Taghdiri1,2, Philipp Hickisch1, Dennis Hohlfeld1, Tamara Bechtold1,2

1: University of Rostock, Albert-Einstein-Str. 2, 18059 Rostock, Germany; 2: Jade University of Applied Sciences, Friedrich-Paffrath-Str. 101, 26386 Wilhelmshaven, Germany


Thermal Performance Evaluation of Aluminum-ammonia Heat Pipes for High-power Electronics Cooling

Reyhan Athalla, Van-Hoan Vu, Ho-Chuan Lin

EW JET PRODUCTS Co., Ltd., Taiwan


CFD-Based Thermal Analysis of a TPMS-Integrated Cooling Architecture for Battery Thermal Management System

Faisal Iqbal, Muhammad Sajid

University College Dublin, Ireland


Harvesting Electricity using Thermoelectric Cells

Przemyslaw Ptak, Piotr Arendt, Krzysztof Górecki

Gdynia Maritime University, Department of Power Electronics, Poland


Environmental Impact on Server Computational Performance

Eoin H. Oude Essink1, Tim Persoons2, Xiangjie Chen3, Sajad Alimohammadi1

1: Technological University Dublin, Ireland; 2: Trinity College Dublin, Ireland; 3: Loughborough University


Analysis of Heat Transfer Coefficient Values and Temperature Distribution in Power Hybrid Electronic Circuits Cooled by Natural Convection

Marcin Janicki

Lodz University of Technology, Poland


High-Order ECM-Based Electro-Thermal Model for Lithium-Ion Batteries Incorporating Diffusion-Induced Concentration Polarization

Samuel Yu1, Eonhyo Kim2, Seungmin Lee1, Jinwon Seo1, Kisoo Yoo2, Bongkeon Choi1

1: Future Technology Convergence Institute, Hyundai Mobis, Republic of Korea; 2: School of Mechanical Engineering, Yeungnam University, Republic of Korea


A Method for Measuring Junction-to-Case Thermal Resistance in Bottom-Side-Cooling Packages

Julio Brandelero, Robin Jung, Alfio Pappalardo, Christale Crouard

STMicroelectronics SA


Experimental Thermo-Hydraulic Investigation of the Transition Toward Fully Direct Liquid-Cooled Server Architectures

Hussein Charaf1,2, Michael Maalouly1, Ali Chehade1, Henryk Klaba1, Tala Moussa2, Chadi Maalouf2, Guillaume Polidori2

1: OVHcloud, 155 Avenue Georges Hannart, 59170 Croix, France; 2: ITheMM, University of Reims Champagne-Ardenne, 51100 Reims, France


Thermal-aware Floor-planning and Optimization Workflow

Miroslav Valka

Synopsys Inc, Germany


Numerical Study of the Self- and Mutual-heating in GaAs pHEMT for MMIC Low-noise Amplifiers

Antonio Pio Catalano1, Miriana Marino2, Ciro Scognamillo1, Salvatore Cimmino2, Vincenzo d'Alessandro1

1: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2: Microelectronics Division, MBDA Italia S.p.A., Bacoli, Italy


Experimental Performance Validation of Flow Guider Structures for Direct Cooling of Prismatic Battery Cells Under Asymmetric Heating Conditions

Lander Lode Cnudde1,2, Jana Rogiers1,2, Michiel De Paepe1,2, Jasper Nonneman1,2,3, Michel De Paepe1,2,4

1: Ghent University, Belgium; 2: FlandersMake@UGent – Core lab MIRO, Belgium; 3: University of Antwerp, Belgium; 4: University of Cape Town, South Africa


Thermo-hydraulic Performance of Tetrahedral Lattice Cores under Laminar Flow: Effects of Strut and End Wall Material and Coolant Media

Ali Riaz, Mohammadreza Kadivar, John Lohan, David Tromey, Gerard McGranaghan

Atlantic Technological University, Ireland
3:00pm
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4:40pm		 Coffee Break 2 and Poster Viewing
4:40pm
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6:00pm		 S 6: Thermal Characterization Methods 1
Location: Conference 1 + 2
Chair: Daniel May, TU Chemnitz
 

Heat Spreading from a Small Source on a Thick Plate

Wendy Luiten

WLC, Netherlands, The


Guideline for Thermal Characterization of Multi-chip Packages Using Linear Superposition – A New JEDEC Standard

Dirk Schweitzer

Infineon Technologies AG, Germany


Cryogenic 3ω Platform for Thermal Conductivity Measurement of Thermal Interface Materials

Carlos Rincon-Ruiz1,2, Corinna Grosse-Kockert5, Daniel May1,5, Nathanael Joehrmann1,2, Uwe Zschenderlein1, Sven Zimmermann1,3,4, Marcel Melzer1,3,4, Matthias Prinz3, Bernhard Wunderle1,2,3,4

1: Technische Universität Chemnitz, Germany; 2: Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN); 3: Fraunhofer ENAS, Chemnitz, Germany; 4: Center for Micro- and Nanotechnologies (ZfM), Chemnitz, Germany; 5: Berliner Nanotest und Design GmbH, Berlin, Germany


Two-Phase Pool Boiling Immersion Cooling for Prismatic Lithium-Ion Batteries Subjected to Higher Discharge Rates

Rajesh Nimmagadda, Kantharuphan Annathurai, Daniel Trimble, Seamus M. O’Shaughnessy

Trinity College Dublin, Ireland
7:00pm
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9:30pm		 Social Event "Boat Trip"