Index of Authors

A list of all persons who contribute to the sessions of this conference. Please select a letter below to list all persons with the corresponding last name. Select the presentation in the right-hand column to access session and presentation details.

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Author(s) Organisation(s) Session
Abdel Razzaq, MohammedThe University of Texas at Austin, Austin, TX 78758, USAPoster Session A
Abo Ras, MohamadBerliner Nanotest & Design GmbH, Germany;
Berliner Nanotest und Design GmbH, Berlin, Germany;
Nanotest, Berlin, Germany		Cooling Concepts & Thermal Technologies
High-Performance Computing
High-Performance Computing
Thermal Materials Innovations
Thermal Materials Innovations
Thermal Simulations 1
Thermo-Mechanical Reliability 1
Ahern, CiaraTechnological University Dublin, IrelandCooling Concepts & Thermal Technologies
Ajul, EIndian Institute of Technology, Kanpur, India; Indian Institute of Technology, Palakkad, IndiaPoster Session A
Al Moussawi, Houssain3 School of Engineering, Lebanese International University – LIU, Beirut, LebanonPoster Session A
Alimohammadi, SajadTechnological University Dublin, IrelandCooling Concepts & Thermal Technologies
Cooling Concepts & Thermal Technologies
Poster Session B
Aniel, FrédéricC2N CNRS, FranceThermal Characterization Methods 2
Annathurai, KantharuphanTrinity College Dublin, IrelandPoster Session A  Presenter
Poster Session B
Ansean, DavidUniversity of Oviedo (Uniovi)Poster Session A
Arendt, PiotrGdynia Maritime University, Department of Power Electronics, PolandPoster Session B
Arnold, JörgTU Chemnitz, Germany;
Chemnitz University of Technology, Dept. Materials & Reliability of Microsystems, Chemnitz, Germany		Cooling Concepts & Thermal Technologies
Thermo-Mechanical Reliability 1
Arumugam, AanandsundarUniversita' degli Studi della Campania "Luigi Vanvitelli", ItalyPoster Session A
Atalay, OzanASELSAN, UGES Sector Directorate, Ankara, TürkiyePoster Session A
Athalla, ReyhanEW JET PRDUCTS Co., Ltd., TaiwanPoster Session B
Ayas, CankatAselsan Inc., Turkey (Türkiye)Poster Session B
Ayaz, MahamChemnitz University of Technology, Germany; Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, GermanyThermo-Mechanical Reliability 2  Presenter
Baek, JuheeKorea Electronics Technology Institute, Korea, Republic of (South Korea)Poster Session A
Bahman, Amir SajjadAalborg University, DenmarkPoster Session B
Balikci, CagriCARIAD SE, GermanyPoster Session A  Presenter
Barathula, SreeramSchool of Mechanical and Aerospace Engineering, Nanyang Technological University, SingaporeTwo-Phase Cooling Solutions 1
Barbosa Henriques Mantelli, MarciaHeat Pipe Laboratory, Federal University of Santa Catarina, Florianopolis/SC, BrazilTwo-Phase Cooling Solutions 1
Barrau, JérômeUniversitat de Lleida, SpainTwo-Phase Cooling Solutions 1
Batikh, AhmadICAM, FrancePoster Session B
Bauduin, HadrienOVHcloud, 155 Avenue Georges Hannart, 59170 Croix, France.Poster Session A
Beberide, DavidUniversitat de Lleida, SpainTwo-Phase Cooling Solutions 1
Bechtold, TamaraUniversity of Rostock, Albert-Einstein-Str. 2, 18059 Rostock, Germany; Jade University of Applied Sciences, Friedrich-Paffrath-Str. 101, 26386 Wilhelmshaven, GermanyPoster Session B  Presenter
Becker, Karl FriedrichFraunhofer IZM, Berlin, GermanyThermo-Mechanical Reliability 1
High-Performance Computing
Beé, Maria E.Heat Pipe Laboratory, Federal University of Santa Catarina, BrazilPoster Session B
Berg, TobiasSynopsys Inc., SwedenComputational Fluid Dynamics
Betak, Petronsemi, Power Solution GroupThermal Simulations 2
Bhattacharya, AnandaroopIndian Institute of Technology Kharagpur, IndiaPoster Session A  Presenter
Bianco, NicolaUniversità degli Studi di Napoli Federico IIThermal Simulations 1
Bogard, FabienITheMM, University of Reims Champagne-Ardenne, 51100 Reims, FrancePoster Session A
Boianceanu, CristianInfineon Technologies Romania & Co, RomaniaPoster Session A
Bojita, AdrianTechnical University of Cluj-Napoca, RomaniaPoster Session A
Bounib, MeriemUniversita' degli Studi della Campania "Luigi Vanvitelli", ItalyPoster Session A  Presenter
Bouslama, MohamedIII-V Lab (Thales), FranceThermal Characterization Methods 2
Bozkurt, DuruSabanci UniversityPoster Session B  Presenter
Bozzoli, FabioDepartment of Industrial Engineering, University of Florence 50139, Florence, ItalyTwo-Phase Cooling Solutions 2
Brandelero, JulioSTMicroelectronics SAPoster Session B  Presenter
Bräuer, TeresaNanotest, GermanyThermal Materials Innovations
Braun, TanjaFraunhofer IZM, Germany; TU Berlin, GermanyHigh-Performance Computing
Bruggeman, JohnVinci4d.ai, United States of AmericaThermal Simulations 1
Buburuzan, Alexandru-DumitruFaculty of Electrical Engineering, Technical University of Cluj-Napoca, RomaniaPoster Session A  Presenter
Buonomo, BernardoDepartment of Engineering,Università degli Studi della Campania “Luigi Vanvitelli”, Italy; International Centre for Sustainable Energy Resource Management (iCERM), UNICAMPANIA Division.;
Universita' degli Studi della Campania "Luigi Vanvitelli", Italy		Poster Session A
Poster Session A
Burenkov, AlexanderFraunhofer IISB, GermanyThermal Simulations 2  Presenter
Burky, JeremieALTER TECHNOLOGY TUV NORD FRANCE, FrancePoster Session A  Presenter
Buzo, AndiInfineon Technologies AG, Munich, GermanyPoster Session A
Çadırcı, SertaçIstanbul Technical University, Mechanical Engineering Department, Istanbul, TürkiyePoster Session A
Camarasa, JaumeUniversitat de Lleida, SpainTwo-Phase Cooling Solutions 1  Presenter
Campos, SantiagoNanotest, GermanyThermal Materials Innovations
Carta, CorradoIHP-Leibniz Institute for High Performance Microelectronics, GermanyPoster Session B
Catalano, Antonio PioDepartment of Electrical Engineering and Information Technology, University of Naples Federico II, ItalyPoster Session B  Presenter
Thermal Simulations 2
Cattani, LucaDepartment of Engineering for Industrial Systems and Technologies, University of Parma, ItalyPoster Session A
Two-Phase Cooling Solutions 2  Presenter
Cavallini, AndreaDepartment of Electrical, Electronic, and Information Engineering, University of Bologna, Bologna, ItalyThermo-Mechanical Reliability 2
Thermo-Mechanical Reliability 2
Chanda, SamajeetIndian Institute of Technology, Palakkad, IndiaPoster Session A
Charaf, HusseinOVHcloud, 155 Avenue Georges Hannart, 59170 Croix, France; ITheMM, University of Reims Champagne-Ardenne, 51100 Reims, FrancePoster Session B  Presenter
Chehade, AliOVHcloud, 155 Avenue Georges Hannart, 59170 Croix, France.Poster Session A
Poster Session A
Poster Session B
Choi, BongkeonFuture Technology Convergence Institute, Hyundai Mobis, Republic of KoreaPoster Session B
Choi, Gyeong EunAccuOptotec Col,, Korea, Republic of (South Korea)Thermal Characterization Methods 2
Choisel, NicolasINSIDIX, FrancePoster Session B
Cimmino, SalvatoreMicroelectronics Division, MBDA Italia S.p.A., Bacoli, ItalyPoster Session B
Cnudde, Lander LodeGhent University, Belgium; FlandersMake@UGent – Core lab MIRO, BelgiumPoster Session A  Presenter
Poster Session A  Presenter
Codecasa, LorenzoPolitecnico di Milano, ItalyThermal Simulations 1  Presenter
Çömez, AhmetASELSAN, UGES Sector Directorate, Ankara, TürkiyePoster Session A  Presenter
Cugini, FrancescoDepartment of Mathematical, Physical and Computer Sciences, University of Parma, ItalyTwo-Phase Cooling Solutions 2
d'Alessandro, VincenzoDepartment of Electrical Engineering and Information Technology, University of Naples Federico II, ItalyPoster Session B
d'Alessandro, VincenzoUniversity of Naples Federico II, ItalyThermal Simulations 2
D'Amore, DarioPolitecnico di Milano, ItalyThermal Simulations 1
Dancila, DragosUppsala University, SwedenCooling Concepts & Thermal Technologies
DasGupta, SunandoIndian Institute of Technology Kharagpur, IndiaPoster Session A
Davidoiu, ValentinaInfineon Technologies, Bucharest, RomaniaPoster Session A
De Paepe, MichelGhent University, Belgium; FlandersMake@UGent – Core lab MIRO, Belgium; University of Cape Town, South AfricaPoster Session A
Poster Session A
Poster Session A
Poster Session B
De Paepe, MichielGhent University, Belgium; FlandersMake@UGent – Core lab MIRO, BelgiumPoster Session A
Poster Session A
Poster Session B  Presenter
De Paola, Francesco Mariaonsemi, Analog and Mixed-Signal GroupThermal Simulations 2
Demian, DavidDepartment of Electrical, Electronic, and Information Engineering, University of Bologna, Bologna, ItalyThermo-Mechanical Reliability 2
Thermo-Mechanical Reliability 2
Demir, CanerASELSAN, UGES Sector Directorate, Ankara, TürkiyePoster Session A
Dobre, LuizaTechnical University of Cluj-Napoca, RomaniaPoster Session A  Presenter
Doğu, OrkunAselsan Inc., Turkey (Türkiye)Poster Session B
Domiciano, Kelvin G.Heat Pipe Laboratory, Federal University of Santa Catarina, BrazilPoster Session B
Dubey, VikasFraunhofer Institute for Electronic Nano Systems, Chemnitz, GermanyHigh-Performance Computing
Elhagali, IbrahimDepartment of Mechanical Power Engineering, Menoufia University, Menoufia, Egypt; Power and Wide-Band-Gap Electronics Research Laboratory (POWERlab), EPFL, Lausanne, SwitzerlandPoster Session A
Eliseo, GiorgioUniversity of Naples Federico II, Italy; onsemi, Analog and Mixed-Signal GroupThermal Simulations 2  Presenter
Elkholy, MohamedDepartment of Mechanical Power Engineering, Menoufia University, Menoufia, EgyptPoster Session A
Elogb, RanimUniversité polytechnique haut de France, FrancePoster Session A  Presenter
Ender, FerencDepartment of Electron Devices, Budapest University of Technology and Economics, Budapest, HungaryThermo-Mechanical Reliability 2
Thermo-Mechanical Reliability 2
Enmark, MarkusChalmers University of Technology, SwedenComputational Fluid Dynamics  Presenter
Ernst, PlamenHENSOLDT Sensors GmbH, GermanyTwo-Phase Cooling Solutions 2  Presenter
Erol, BarisTU Chemnitz, GermanyHigh-Performance Computing  Presenter
Eshagh Nimvari, MajidTrinity College Dublin, the University of Dublin, Ireland, IrelandComputational Fluid Dynamics
Essink, Eoin OudeTechnological University Dublin, IrelandCooling Concepts & Thermal Technologies
Everaere, PierreINSIDIX, FrancePoster Session B  Presenter
Fabian, BenjaminHeraeus Electronics GmbH & Co. KGThermo-Mechanical Reliability 2
Fardoun, FaroukDoctoral School of Science and Technology Lebanese UniversityPoster Session A
Farkas, GáborSIEMENS DI SW, Budapest, HungaryThermal Characterization Methods 2
Fénot, MatthieuPprime Institut/ENSMA, FrancePoster Session A
Fischer, FelixFraunhofer IZM, GermanyTwo-Phase Cooling Solutions 2
Foresti, SamueleABB S.p.A.Thermal Simulations 1
Fradin, Jean-PierreDepTH-Lab ICAM Toulouse, France;
ICAM, France		Cooling Concepts & Thermal Technologies
Poster Session B
Fragnito, AndreaUniversità degli Studi di Napoli Federico IIThermal Simulations 1
Frigo, MatteoVinci4d.ai, United States of AmericaThermal Simulations 1
Fritzsche, SebastianHeraeus Electronics GmbH & Co. KGThermo-Mechanical Reliability 2
Gabbi, SimoneDepartment of Mathematical, Physical and Computer Sciences, University of Parma, ItalyTwo-Phase Cooling Solutions 2
García, Victor M.University of Oviedo (Uniovi)Poster Session A
Gauthier, GildasIII-V Lab (Thales), FranceThermal Characterization Methods 2
Geurts, BernardFaculty of Electrical Engineering, Mathematics and Computer Science, University of Twente, NetherlandsThermal Materials Innovations
Ghioldi, FedericoiePolitecnico di Milano, ItalyCooling Concepts & Thermal Technologies
Gibbons, Michael JTrinity College Dublin, the University of Dublin, Ireland, IrelandComputational Fluid Dynamics
Goderis, MaitéGhent University, Belgium; FlandersMake@UgentPoster Session B
Gogoi, Shashwat KamalUniversity of Rostock, Albert-Einstein-Str. 2, 18059 Rostock, GermanyPoster Session B
Gordon, ElgerTechnische Hochschule Ingolstadt, GermanyThermal Simulations 2
Górecki, KrzysztofGdynia Maritime University, Department of Power Electronics, PolandPoster Session B
Grosse-Kockert, CorinnaBerliner Nanotest und Design GmbH, Berlin, Germany;
Nanotest Berlin, Germany		High-Performance Computing  Presenter
Thermal Characterization Methods 1
Gruen, TobiasBerliner Nanotest and Design GmbH, GermanyTwo-Phase Cooling Solutions 2
Grzes, ThomasALTER TECHNOLOGY TUV NORD FRANCE, FrancePoster Session A
Guessi Domiciano, KelvinHeat Pipe Laboratory, Federal University of Santa Catarina, Florianopolis/SC, BrazilTwo-Phase Cooling Solutions 1  Presenter
Guillot, LaurentALTER TECHNOLOGY TUV NORD FRANCE, FrancePoster Session A
Haase, DanielSynopsys Inc., SwedenComputational Fluid Dynamics
Hantos, GusztávDepartment of Electron Devices, Budapest University of Technology and Economics, Budapest, HungaryThermo-Mechanical Reliability 2
Thermo-Mechanical Reliability 2  Presenter
Harder, AntonioNanotest, GermanyThermal Materials Innovations
Harmand, SouadUniversité polytechnique haut de France, FrancePoster Session A
Haseloff, JannikBerliner Nanotest & Design GmbH, GermanyCooling Concepts & Thermal Technologies
Hassan, MuhammadSHT Smart High-Tech AB, SwedenComputational Fluid Dynamics
He, LijieSHT Smart High-Tech AB, SwedenComputational Fluid Dynamics
Hegedüs, JánosDepartment of Electron Devices, Budapest University of Technology and Economics, Budapest, HungaryThermo-Mechanical Reliability 2  Presenter
Thermo-Mechanical Reliability 2
Heilmann, JensTU Chemnitz, GermanyCooling Concepts & Thermal Technologies
Heinickel, PatrickHeraeus Electronics GmbH & Co. KGThermo-Mechanical Reliability 2
Heldt, ChristophHeraeus Electronics GmbH & Co. KGThermo-Mechanical Reliability 2
Hélie, JérômeSchaeffler, FranceCooling Concepts & Thermal Technologies  Presenter
Herath, DinukaHuawei Nuremberg Research Center, Germany; Technical University Munich, GermanyPoster Session B  Presenter
Hickisch, PhilippUniversity of Rostock, Germany;
University of Rostock, Albert-Einstein-Str. 2, 18059 Rostock, Germany		Poster Session A  Presenter
Poster Session B
Hiller, KarlaTU Chemnitz, Center for Micro and Nano Technologies, Chemnitz, GermanyHigh-Performance Computing
Hnayno, MohamadOVHcloudPoster Session A
Ho, Jin YaoSchool of Mechanical and Aerospace Engineering, Nanyang Technological University, SingaporeTwo-Phase Cooling Solutions 1
Hoang, CuongUniversity of Applied Sciences Kempten, GermanyCooling Concepts & Thermal Technologies
Hoene, EckartFraunhofer IZM, GermanyTwo-Phase Cooling Solutions 2
Hofmann, ChristianFraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, GermanyThermal Characterization Methods 1
Hofmann, EricHeraeus Electronics GmbH & Co. KGThermo-Mechanical Reliability 2
Hohlfeld, DennisUniversity of Rostock, Germany;
University of Rostock, Albert-Einstein-Str. 2, 18059 Rostock, Germany		Poster Session A
Poster Session B
Hölck, OleFraunhofer IZM, GermanyHigh-Performance Computing
Hossain, Md RobiulTechnological University Dublin, IrelandCooling Concepts & Thermal Technologies  Presenter
Huesgen, TillUniversity of Applied Sciences Kempten, GermanyCooling Concepts & Thermal Technologies
Hussain, TanweerTrinity College Dublin, the University of Dublin, Ireland, IrelandComputational Fluid Dynamics  Presenter
Iasiello, MarcelloUniversità degli Studi di Napoli Federico IIThermal Simulations 1
Ibáñez, ManelUniversitat de Lleida, SpainTwo-Phase Cooling Solutions 1
Ibarra, EdortaUniversity of the Basque Country (UPV/EHU)Poster Session A
Imran, MuhammadAston University, United KingdomPoster Session A
Iqbal, FaisalUniversity College Dublin, IrelandPoster Session B  Presenter
Ismail-zade, Mamed R.National Research University Higher School of Economics (Moscow Institute of Electronics and Mathematics), Russian FederationThermal Simulations 2
Jacquet, Jean-ClaudeIII-V Lab (Thales), FranceThermal Characterization Methods 2
Jafari, DavoudFaculty of Electrical Engineering, Mathematics and Computer Science, University of Twente, NetherlandsThermal Materials Innovations
Jagadish, MonicaSchaeffler AG, Germany; Technical University Chemnitz, Chemnitz, GermanyPoster Session B  Presenter
Jakani, AnassIII-V Lab (Thales), FranceThermal Characterization Methods 2  Presenter
Janicki, MarcinLodz University of Technology, PolandPoster Session B  Presenter
Joehrmann, NathanaelTechnische Universität Chemnitz, Germany; Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN)Thermal Characterization Methods 1
Jöhrmann, NathanaelProfessorship Materials and Reliability of Microsystems, Chemnitz University of Technology, Chemnitz, Germany; Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, GermanyThermal Characterization Methods 1
Jung, RobinSTMicroelectronics SAPoster Session B
Kabaria, HardikVinci4d.ai, United States of AmericaThermal Simulations 1  Presenter
Kadivar, MohammadrezaAtlantic Technological University, IrelandComputational Fluid Dynamics
Kakou, N'doua Luc ArnaudXLIM CNRS, FranceThermal Characterization Methods 2  Presenter
Kapidzic, FarukSilicon Austria Labs GmbH, AustriaPoster Session B
Kerreneur, HugoALTER TECHNOLOGY TUV NORD FRANCE, FrancePoster Session A
Khaled, AshrafFaculty of Engineering, Alexandria University, Alexandria, EgyptPoster Session A
Khalid, YoussefMechanical Power Department, Faculty of Engineering, Cairo University, Cairo, EgyptPoster Session A
Kim, EonhyoSchool of Mechanical Engineering, Yeungnam University, Republic of KoreaPoster Session B
Kim, JaesunAccuOptotec Col,, Korea, Republic of (South Korea)Thermal Characterization Methods 2
Kim, JeminKorea Electronics Technology Institute, Korea, Republic of (South Korea)Poster Session A
Klengel, SandyFraunhofer Institute for Microstructure of Materials and Systems: Halle, GermanyThermal Materials Innovations
Koch, MathiasFraunhofer IZM, Germany;
Fraunhofer IZM, Berlin, Germany		High-Performance Computing
Thermo-Mechanical Reliability 1
Koné, KarnonSafran SA; Pprime Institut/ENSMA, FrancePoster Session A  Presenter
Konstantinidis, GeorgeFoundation for Research and Technology Hellas (FORTH), GreeceCooling Concepts & Thermal Technologies
Köse, Haluk AnılAselsan Inc., Turkey (Türkiye)Poster Session B
Koyuncu, AhmetAselsan Inc., Turkey (Türkiye)Poster Session B  Presenter
Kozhukhov, Maxim V.National Research University Higher School of Economics (Moscow Institute of Electronics and Mathematics), Russian FederationThermal Simulations 2
Kraker, ElkeMaterials Center Leoben Forschung GmbH, AustriaThermo-Mechanical Reliability 2
Krambeck, LarissaHeat Pipe Laboratory, Federal University of Santa Catarina, Brazil; Department of Civil Engineering and Architecture, University of Pavia, PaviaPoster Session B  Presenter
Two-Phase Cooling Solutions 1
Krischel, FinnFraunhofer IZM, GermanyTwo-Phase Cooling Solutions 2
Krishnaswamy, SivasubramaniSynopsys Inc., SwedenComputational Fluid Dynamics
Küttler, SulivanSafran SAPoster Session A
Lambert, BenoitUMS - United Monolithic Semiconductors, FranceThermal Characterization Methods 2
Leadbetter, LeonieFraunhofer IZM, GermanyHigh-Performance Computing
Lee, GuesukKorea Electronics Technology Institute, Korea, Republic of (South Korea)Poster Session A
Lee, HyunjongFaculty of Electrical Engineering, Mathematics and Computer Science, University of Twente, NetherlandsThermal Materials Innovations
Lee, SeungminFuture Technology Convergence Institute, Hyundai Mobis, Republic of KoreaPoster Session B
Leicht, MarkusSchaeffler AG, GermanyPoster Session B
Leitgeb, VerenaMaterials Center Leoben Forschung GmbH, AustriaThermo-Mechanical Reliability 2
Li, LingDurham University, United KingdomPoster Session A
Lim, SeungyoungAccuOptotec Col,, Korea, Republic of (South Korea)Thermal Characterization Methods 2
Lin, Ho-ChuanEW JET PRDUCTS Co., Ltd., TaiwanPoster Session B  Presenter
Lin, Yuh-GerEW JET PRDUCTS Co., Ltd., TaiwanPoster Session B
Lipák, GyulaDepartment of Electron Devices, Budapest University of Technology and Economics, Budapest, HungaryThermo-Mechanical Reliability 2
Thermo-Mechanical Reliability 2
Liu, ChenmingUniversity of Oulu, FinlandPoster Session A  Presenter
Liu, Eams-OSRAM international GmbH, GermanyThermo-Mechanical Reliability 1
Liu, JohanChalmers University of Technology, SwedenComputational Fluid Dynamics
Liu, NickNexperia B. V.Thermo-Mechanical Reliability 2
Lohan, JohnAtlantic Technological University, IrelandComputational Fluid Dynamics
Lorenzini, GiulioDepartment of Engineering for Industrial Systems and Technologies, University of Parma, ItalyPoster Session A
Two-Phase Cooling Solutions 2
Luiten, WendyWLC, Netherlands, TheThermal Characterization Methods 1  Presenter
M. O’Shaughnessy, SeamusTrinity College Dublin, IrelandPoster Session B
Ma, Byongjin4Korea Electronics Technology Institute, Korea, Republic of (South Korea)Thermal Characterization Methods 2
Poster Session A  Presenter
Maalouf, ChadiITheMM, University of Reims Champagne-Ardenne, 51100 Reims, FrancePoster Session A
Poster Session A
Poster Session B
Maalouly, MichaelOVHcloud, 155 Avenue Georges Hannart, 59170 Croix, FrancePoster Session B
Poster Session A
Poster Session A
Macdonald, MarkIntel CorporationPoster Session A
Maffezzoni, PaoloPolitecnico di Milano, ItalyThermal Simulations 1
Mage, LucileCEA, FrancePoster Session B
Mahdaoui, MustaphaUniversité polytechnique haut de France, FrancePoster Session A
Majed, BenBTU Cottbus-Senftenberg, GermanyTwo-Phase Cooling Solutions 2
Maklad, OsamaSchool of Engineering, University of Greenwich, London, UK; Department of Mechanical Power Engineering, Mansoura University, Mansoura, EgyptPoster Session A  Presenter
Maksimov, AlekseiHuawei Nuremberg Research Center, GermanyPoster Session B
Malignaggi, AndreaIHP-Leibniz Institute for High Performance Microelectronics, GermanyPoster Session B
Manca, OronzioDepartment of Engineering,Università degli Studi della Campania “Luigi Vanvitelli”, Italy; International Centre for Sustainable Energy Resource Management (iCERM), UNICAMPANIA Division.;
Universita' degli Studi della Campania "Luigi Vanvitelli", Italy		Poster Session A
Poster Session A
Manganelli, Costanza LuciaIHP-Leibniz Institute for High Performance Microelectronics, GermanyPoster Session B
Mantelli, Marcia B. H.Heat Pipe Laboratory, Federal University of Santa Catarina, BrazilPoster Session B
Marcault, EmmanuelCEA, FrancePoster Session B
Marengo, MarcoDepartment of Civil Engineering and Architecture, University of Pavia, PaviaPoster Session B
Marie, AlexandreDepTH-Lab ICAM Toulouse, France;
ICAM, France		Cooling Concepts & Thermal Technologies
Poster Session B
Marino, MirianaMicroelectronics Division, MBDA Italia S.p.A., Bacoli, ItalyPoster Session B
Masper, ThomasABB S.p.A.Thermal Simulations 1
Mathew, AnuChemnitz University of TechnologyThermo-Mechanical Reliability 2
Matzick, PhilipSilicon Austria Labs GmbH, AustriaPoster Session B
Poster Session B  Presenter
May, DanielTU Chemnitz, Germany;
Technische Universität Chemnitz, Germany;
University of Technology Chemnitz		High-Performance Computing
Thermal Characterization Methods 1
Thermo-Mechanical Reliability 1  Presenter
May, DanielChemnitz University of Technology, GermanyThermal Simulations 1
McGranaghan, GerardAtlantic Technological University, IrelandComputational Fluid Dynamics
Menozzi, RobertoDepartment of Engineering and Architecture, University of Parma, ItalyPoster Session A
Meszmer, PeterTU Chemnitz, Germany; Center for Materials, Architectures and Integration of Nanomembranes, TU Chemnitz, Germany;
Chemnitz University of Technology, Germany		Thermal Materials Innovations  Presenter
Thermal Simulations 1
Thermo-Mechanical Reliability 2
Mitterhuber, LisaMaterials Center Leoben Forschung GmbH, AustriaThermo-Mechanical Reliability 2  Presenter
Mohammadi, ArashChemnitz University of Technology, Dept. Materials & Reliability of Microsystems, Chemnitz, GermanyThermo-Mechanical Reliability 1
Mohammed, RahimaVinci4d.ai, United States of AmericaThermal Simulations 1
Mollov, StefanSilicon Austria Labs GmbH, AustriaPoster Session B
Poster Session B
Moon, YoungbooAccuOptotec Col,, Korea, Republic of (South Korea); UJL Co., Korea, Republic of (South Korea)Thermal Characterization Methods 2
Moussa, TalaUniversity of Reims Champagne-Ardenne, France;
ITheMM, University of Reims Champagne-Ardenne, 51100 Reims, France		Poster Session A
Poster Session B
Müller, SteffenFraunhofer Institute for Microstructure of Materials and Systems: Halle, GermanyThermal Materials Innovations
Musetti, AlexDepartment of Engineering and Architecture, University of Parma, ItalyPoster Session A
Mwangi, SimonAston University, United KingdomPoster Session A
Nadeem, Talha BinAston University, United Kingdom; NED University of Engineering & Technology, PakistanPoster Session A  Presenter
Nallam, Sri Sai Chandra AbhinayHeraeus Electronics GmbH & Co. KGThermo-Mechanical Reliability 2  Presenter
Nallatamby, Jean-ChristopheXLIM, FranceThermal Characterization Methods 2
Nardini, SergioDepartment of Engineering,Università degli Studi della Campania “Luigi Vanvitelli”, Italy; International Centre for Sustainable Energy Resource Management (iCERM), UNICAMPANIA Division.;
Universita' degli Studi della Campania "Luigi Vanvitelli", Italy		Poster Session A
Poster Session A
Naseef V, MuhammedIndian Institute of Technology, Palakkad, IndiaPoster Session A  Presenter
Naser, MohamedFaculty of Engineering, Alexandria University, Alexandria, EgyptPoster Session A
Nilsson, Torbjörn M.J.Saab AB, SwedenComputational Fluid Dynamics
Nimmagadda, RajeshTrinity College Dublin, IrelandPoster Session B  Presenter
Nonneman, JasperUniversity of Antwerp; University of Ghent; Flanders MakeTwo-Phase Cooling Solutions 1
Nonneman, JasperGhent University, Belgium; FlandersMake@UGent – Core lab MIRO, Belgium; University of Antwerp, BelgiumPoster Session A
Poster Session A
Nonnemann, JasperGhent Universtity, Belgium; FlandersMake@UGent – Core lab MIRO, Leuven, Belgium; University of Antwerp, BelgiumPoster Session A
Novikov, AndrejUniversity of Rostock, GermanyThermo-Mechanical Reliability 1
Nowottnick, MathiasUniversity of Rostock, GermanyThermo-Mechanical Reliability 1  Presenter
O'Shaughnessy, SeamusTrinity College Dublin, IrelandPoster Session A
Odriozola, AinhoaTecnalia, DerioPoster Session A
Orlanducci, VittorioUniversità degli Studi di Napoli Federico IIThermal Simulations 1
Osetonski, SarahVinci4d.ai, United States of AmericaThermal Simulations 1
Oude Essink, Eoin HendrikusSchool of Mechanical Engineering, Technological University Dublin, City Campus, IrelandCooling Concepts & Thermal Technologies
Poster Session B  Presenter
Ouenzerfi, SafoueneUniversité polytechnique haut de France, FrancePoster Session A
Pappaardo, AlfioSTMicroelectronics SAPoster Session B
Pareek, Kaushal ArunBerliner Nanotest and Design GmbH, GermanyThermal Simulations 1  Presenter
Pashazadeh, SajjadChalmers University of Technology, SwedenComputational Fluid Dynamics
Pavon Vargas, Dario JavierDepartment of Engineering for Industrial Systems and Technologies, University of Parma, ItalyTwo-Phase Cooling Solutions 2
Poster Session A
Pelz, GeorgInfineon Technologies AG, Munich, GermanyPoster Session A
Périé, BenjaminICAM, FrancePoster Session B
Persoons, TimTrinity College Dublin, the University of Dublin, Ireland;
Department of Mechanical, Manufacturing & Biomedical Engineering, Trinity College Dublin, Ireland		Cooling Concepts & Thermal Technologies
Cooling Concepts & Thermal Technologies
Poster Session B
Petersmann, ManuelKAI Kompetenzzentrum Automobil und Industrieelectronik GMBH,AustriaPoster Session A
Petrosyants, Konstantin O.National Research University Higher School of Economics (Moscow Institute of Electronics and Mathematics), Russian FederationThermal Simulations 2  Presenter
Piccirillo, FrancescoUniversità degli Studi di Napoli Federico IIThermal Simulations 1  Presenter
Pichler, PeterFraunhofer IISB, GermanyThermal Simulations 2
Piscaglia, FedericoPolitecnico di Milano, ItalyCooling Concepts & Thermal Technologies
Plaipaitė-Nalivaiko, RitaLithuanian university of Applied Engineering Sciences, LithuaniaPoster Session B
Plas, WitoGhent University, Belgium; FlandersMake@UgentPoster Session B
Polidori, GuillaumeUniversity of Reims Champagne-Ardenne, FrancePoster Session A
Poppe, AndrásDepartment of Electron Devices, Budapest University of Technology and Economics, Budapest, HungaryThermo-Mechanical Reliability 2
Thermo-Mechanical Reliability 2
Prinz, MatthiasFraunhofer ENAS, Chemnitz, GermanyThermal Characterization Methods 1
Thermo-Mechanical Reliability 2
Ptak, PrzemyslawGdynia Maritime University, Department of Power Electronics, PolandPoster Session B  Presenter
Puel, VirgileICAM, FrancePoster Session B
Pujahari, AnkitaIndian Institute of Technology Kharagpur, IndiaPoster Session A
Purcar, Marius-IoanTechnical University of Cluj-Napoca, RomaniaPoster Session A
Poster Session A
Purschke, SimonUniversity of Rostock, GermanyThermo-Mechanical Reliability 1
Qadir, AwaisProfessorship Materials and Reliability of Microsystems, Chemnitz University of Technology, Chemnitz, Germany; Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology Chemnitz, GermanyThermal Characterization Methods 1  Presenter
Rabhi, AchrefSynopsys Inc., SwedenComputational Fluid Dynamics  Presenter
Raciti, LucaABB S.p.A.Thermal Simulations 1
Radhakrishnan, SatishVinci4d.ai, United States of AmericaThermal Simulations 1
Ragaini, EnricoABB S.p.A.Thermal Simulations 1
Rayya, MonzerCARIAD SE, GermanyPoster Session A
Recepi, IsmailSilicon Austria Labs GmbH, AustriaPoster Session B  Presenter
Regany, DesideriUniversitat de Lleida, SpainTwo-Phase Cooling Solutions 1
Reinke, AronNanotest, GermanyThermal Materials Innovations  Presenter
Rencz, MártaBudapest University of Technology and Economics, HungaryThermal Characterization Methods 2
Renner, JohannUniversity of Applied Sciences Kempten, GermanyCooling Concepts & Thermal Technologies  Presenter
Rerolle, VincentVinci4d.ai, United States of AmericaThermal Simulations 1
Ress, SándorBudapest University of Technology and Economics, Hungary; SIEMENS DI SW, Budapest, HungaryThermal Characterization Methods 2  Presenter
Riaz, AliAtlantic Technological University, IrelandComputational Fluid Dynamics  Presenter
Richter Trummer, SusanaFraunhofer ENAS, Chemnitz, GermanyThermo-Mechanical Reliability 2
Rieder, Jenniferams-OSRAM international GmbH, GermanyThermo-Mechanical Reliability 1  Presenter
Rincon-Ruiz, CarlosTechnische Universität Chemnitz, Germany; Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN)Thermal Characterization Methods 1  Presenter
Rogiers, JanaGhent University, Belgium; FlandersMake@UGent – Core lab MIRO, BelgiumPoster Session A
Poster Session A
Poster Session A  Presenter
Poster Session B
Rohmann, FabianHENSOLDT Sensors GmbH, GermanyTwo-Phase Cooling Solutions 2
Roig, Jaumeonsemi, Power Solution GroupThermal Simulations 2
Rosell, Joan IgnasiUniversitat de Lleida, SpainTwo-Phase Cooling Solutions 1
Rosell, PolUniversitat de Lleida, SpainTwo-Phase Cooling Solutions 1
Ruichek, AyoubOVHcloud; University of Reims Champagne-Ardenne, FrancePoster Session A  Presenter
Rzepka, SvenFraunhofer Institute for Electronic Nano Systems, Chemnitz, GermanyHigh-Performance Computing
Sadeghi, SadeghAalborg University, DenmarkPoster Session B  Presenter
Sainz De La Maza, AneTecnalia, Derio; University of the Basque Country (UPV/EHU)Poster Session A  Presenter
Sajid, MuhammadUniversity College Dublin, IrelandPoster Session B
Salhab, HalaDepartment of Engineering,Università degli Studi della Campania “Luigi Vanvitelli”, Italy; International Centre for Sustainable Energy Resource Management (iCERM), UNICAMPANIA Division.Poster Session A  Presenter
Salter, David W.School of Mechanical Engineering, Technological University Dublin, City Campus, IrelandCooling Concepts & Thermal Technologies  Presenter
Sambursky, Lev M.National Research University Higher School of Economics (Moscow Institute of Electronics and Mathematics), Russian FederationThermal Simulations 2
Sárkány, ZoltánSIEMENS DI SW, Budapest, HungaryThermal Characterization Methods 2
Saums, DaveDS&A LLC, United States of AmericaHigh-Performance Computing  Presenter
Schacht, RalphBTU Cottbus-Senftenberg, GermanyTwo-Phase Cooling Solutions 2  Presenter
Schiasselloni, RacheleDepartment of Engineering for Industrial Systems and Technologies, University of Parma, ItalyPoster Session A
Two-Phase Cooling Solutions 2
Schmid, MaximilianTechnische Hochschule Ingolstadt, GermanyThermal Simulations 2
Schulz, FerdinandFraunhofer IISB, GermanyThermal Simulations 2
Schulz, MarcusBerliner Nanotest und Design GmbH, GermanyThermal Materials Innovations
Thermo-Mechanical Reliability 1
Schwan, HannesTechnische Hochschule Ingolstadt, GermanyThermal Simulations 2  Presenter
Schweitzer, DirkInfineon Technologies AG, GermanyThermal Characterization Methods 1  Presenter
Scognamillo, CiroDepartment of Electrical Engineering and Information Technology, University of Naples Federico II, ItalyPoster Session B
Thermal Simulations 2
Seo, JinwonFuture Technology Convergence Institute, Hyundai Mobis, Republic of KoreaPoster Session B
Soldati, AlessandroDepartment of Engineering and Architecture, University of Parma, ItalyPoster Session A  Presenter
Solzi, MassimoDepartment of Mathematical, Physical and Computer Sciences, University of Parma, ItalyTwo-Phase Cooling Solutions 2
Sommet, RaphaelXLIM, FranceThermal Characterization Methods 2
Sommet, RaphaelXLIM CNRS, FranceThermal Characterization Methods 2
Song, Jung-HoonAccuOptotec Col,, Korea, Republic of (South Korea); Kongju National University, Korea, Republic of (South Korea)Thermal Characterization Methods 2  Presenter
Staliulionis, ZygimantasLithuanian university of Applied Engineering Sciences, LithuaniaPoster Session B  Presenter
Stark, WilliamVinci4d.ai, United States of AmericaThermal Simulations 1
Sternberg, MaikBerliner Nanotest und Design GmbH, Berlin, Germany;
Nanotest, Berlin, Germany		High-Performance Computing
High-Performance Computing
Swierk, DariuszLFTC London, United KingdomPoster Session B  Presenter
T'Jollyn, IlyaUniversity of AntwerpTwo-Phase Cooling Solutions 1
Taghdiri, AliakbarUniversity of Rostock, Albert-Einstein-Str. 2, 18059 Rostock, Germany; Jade University of Applied Sciences, Friedrich-Paffrath-Str. 101, 26386 Wilhelmshaven, GermanyPoster Session B
Tandis, EmadAston University, United KingdomPoster Session A
Tao, YuanyuanDurham University, United KingdomPoster Session A  Presenter
Teulet, LucieCEA, FrancePoster Session B  Presenter
Tilhac, FredericALTER TECHNOLOGY TUV NORD FRANCE, FrancePoster Session A
Torun, Ali ErayASELSAN, UGES Sector Directorate, Ankara, TürkiyePoster Session A
Tounsi, PatrickLAAS-CNRS, FrancePoster Session B
Trancho, ElenaTecnalia, DerioPoster Session A
Trimble, DanielTrinity College Dublin, IrelandPoster Session A
Poster Session B
Tromey, DavidAtlantic Technological University, IrelandComputational Fluid Dynamics
Tscharnuter, DanielKAI Kompetenzzentrum Automobil und Industrieelectronik GMBH,AustriaPoster Session A
Uysal, HakanASELSAN, UGES Sector Directorate, Ankara, TürkiyePoster Session A
Vahidi Ferdousi, MahdiOVHcloud, 155 Avenue Georges Hannart, 59170 Croix, France.; ITheMM, University of Reims Champagne-Ardenne, 51100 Reims, FrancePoster Session A  Presenter
Valdés, Enrique E.University of Oviedo (Uniovi)Poster Session A
Valka, MiroslavSynopsis, GermanyPoster Session B  Presenter
van Goor, LeonoreFaculty of Electrical Engineering, Mathematics and Computer Science, University of Twente, NetherlandsThermal Materials Innovations
Vandebeek, IneMegaCool Technologies, BelgiumComputational Fluid Dynamics  Presenter
Vandenhove, WillemUniversity of AntwerpTwo-Phase Cooling Solutions 1  Presenter
Verhaert, IvanUniversity of AntwerpTwo-Phase Cooling Solutions 1
Vermeer, WiljanFraunhofer IZM, GermanyTwo-Phase Cooling Solutions 2
Vernhes, PierreINSIDIX, FrancePoster Session B
Vervecken, LievenMegaCool Technologies, BelgiumComputational Fluid Dynamics
Victory, Jamesonsemi, Power Solution GroupThermal Simulations 2
Videcocq, EtiennePprime Institut/ENSMA, FrancePoster Session A
Vilarrubí, MontseUniversitat de Lleida, SpainTwo-Phase Cooling Solutions 1
Vogel, KlausFraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, GermanyThermal Characterization Methods 1
Voitel, MarcusFraunhofer IZM, GermanyHigh-Performance Computing
Vu, Van-HoanEW JET PRDUCTS Co., Ltd., TaiwanPoster Session B
Walther, DavidChemnitz University of Technology, Dept. Materials & Reliability of Microsystems, Chemnitz, GermanyThermo-Mechanical Reliability 1  Presenter
Wen, DongshengTechnical University Munich, GermanyPoster Session B
Whiting, MitchellUniversity of AntwerpTwo-Phase Cooling Solutions 1
Wijekoon, ThiwankaHuawei Nuremberg Research Center, GermanyPoster Session B
Wits, Wessel W.Faculty of Electrical Engineering, Mathematics and Computer Science, University of Twente, Netherlands; Royal Netherlands Aerospace Centre (NLR), Marknesse, NetherlandsThermal Materials Innovations  Presenter
Wong, Teck NengSchool of Mechanical and Aerospace Engineering, Nanyang Technological University, SingaporeTwo-Phase Cooling Solutions 1
Wunderle, BernhardTU Chemnitz, Germany; Fraunhofer ENAS, Chemnitz, Germany; Center for Materials, Architectures and Integration of Nanomembranes at TU Chemnitz, Germany; Centre for Micro-and Nanotechnologies at TU Chemnitz, Germany;
TU Chemnitz, Germany; Fraunhofer ENAS, Germany;
Technical University Chemnitz, Chemnitz, Germany;
Professorship Materials and Reliability of Microsystems, Chemnitz University of Technology, Chemnitz, Germany; Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany; Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology Chemnitz, Germany; Micro Materials Centre Fraunhofer Institute for Electronic Nano Systems – ENAS Chemnitz, Germany;
Chemnitz University of Technology, Germany; Fraunhofer Institute for Electronics Nano Systems, Germay;
University of Technology Chemnitz;
Chemnitz University of Technology, Dept. Materials & Reliability of Microsystems, Chemnitz, Germany; Fraunhofer ENAS, Chemnitz, Germany; Centre for Micro- and Nanotechnologies (ZfM), Chemnitz, Germany; Centre for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany;
Chemnitz University of Technology, Germany; Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany; Fraunhofer ENAS, Chemnitz, Germany; Center for Micro-and Nanotechnologies (ZfM), Chemnitz, Germany; Joint Lab Berlin, Berlin-Adlershof, Germany		Cooling Concepts & Thermal Technologies  Presenter
High-Performance Computing
Poster Session B
Thermal Characterization Methods 1
Thermal Characterization Methods 1
Thermal Materials Innovations
Thermal Simulations 1
Thermo-Mechanical Reliability 1
Thermo-Mechanical Reliability 1
Thermo-Mechanical Reliability 2
Two-Phase Cooling Solutions 2
Wünsch, DirkFraunhofer Institute for Electronic Nano Systems, Chemnitz, GermanyHigh-Performance Computing
Yağcı, VedatAselsan Inc., Turkey (Türkiye)Poster Session B
Ye, HanyangSchool of Mechanical and Aerospace Engineering, Nanyang Technological University, SingaporeTwo-Phase Cooling Solutions 1  Presenter
Yoo, KisooSchool of Mechanical Engineering, Yeungnam University, Republic of KoreaPoster Session B
Yorulmaz, EfeAselsan Inc., Turkey (Türkiye)Poster Session B
Yu, SamuelFuture Technology Convergence Institute, Hyundai Mobis, Republic of KoreaPoster Session B  Presenter
Zahner, Thomasams-OSRAM international GmbH, GermanyThermo-Mechanical Reliability 1
Zaitsev, IgnatiiIHP-Leibniz Institute for High Performance Microelectronics, GermanyPoster Session B
Zeaiter, AmalSafran SAPoster Session A
Zengin, ArdaAselsan Inc., Turkey (Türkiye)Poster Session B
Zerounian, NicolasC2N CNRS, FranceThermal Characterization Methods 2
Ziaei, AfshinThales Research and Technology, Palaiseau, FranceCooling Concepts & Thermal Technologies
Zimon, PattricNanotest, GermanyThermal Materials Innovations
Zschenderlein, UweTechnische Universität Chemnitz, Germany;
Professorship Materials and Reliability of Microsystems, Chemnitz University of Technology, Chemnitz, Germany;
Chemnitz University of Technology, Germany		Thermal Characterization Methods 1
Thermal Characterization Methods 1
Thermo-Mechanical Reliability 2