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Index of Titles

A complete list of all conference contributions. Use the alphabetical filter or the search box below to find specific submissions. Click on any contribution to view its session details.

List by Initial Letter: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z All Titles

Contribution Title	Author(s)	Session
A Comparative Study of Heat Conduction-Based Numerical Models for Vapor Chamber Thermal Analyses	Çömez, Ahmet (1); Çadırcı, Sertaç (2); Atalay, Ozan (1); Torun, Ali Eray (1); Demir, Caner (1); Uysal, Hakan (1)	Poster Session A
A Concept for In-situ Glass-transition Detection in Insulated Metal Substrates	Hegedüs, János (1); Hantos, Gusztáv (1); Lipák, Gyula (1); Demian, David (2); Cavallini, Andrea (2); Poppe, András (1); Ender, Ferenc (1)	Thermo-Mechanical Reliability 2
A Coupled VOF-VAM CFD Model for Capillary-Limited Phase Change in Flat Heat Pipes	Hussain, Tanweer; Eshagh Nimvari, Majid; Gibbons, Michael J	Computational Fluid Dynamics
A Fracture Mechanical Approach for EMC/Copper Interface Characterization Using Button Shear Testing in Automotive Power Module Applications	Jagadish, Monica (1,2); Leicht, Markus (1); Wunderle, Bernhard (2)	Poster Session B
A Low-thermal-Mass Direct-heating and Edge-AI-assisted Contact-thermocouple Platform for Transient Thermal Characterization of Vapor Chambers	Tao, Yuanyuan; Li, Ling	Poster Session A
A Method for Measuring Junction-to-Case Thermal Resistance in Bottom-Side-Cooling Packages	Brandelero, Julio; Jung, Robin; Pappaardo, Alfio	Poster Session B
A Systematic Study of Graphene-enhanced Heat Sinks for Lightweight Thermal Management Applications	Enmark, Markus (1); Hassan, Muhammad (2); He, Lijie (2); Pashazadeh, Sajjad (1); Nilsson, Torbjörn M.J. (3); Liu, Johan (1)	Computational Fluid Dynamics
A Thermo‑viscoelastic Model for Pressure‑dependent Effective Thermal Impedance of Thermal Interface Material Gap Pads	Recepi, Ismail; Kapidzic, Faruk; Matzick, Philip; Mollov, Stefan	Poster Session B
AI-driven, Non-parametric Geometry Optimization for Heat Sink Design	Rabhi, Achref; Haase, Daniel; Krishnaswamy, Sivasubramani; Berg, Tobias	Computational Fluid Dynamics
Analysis of Heat Transfer Coefficient Values and Temperature Distribution in Power Hybrid Electronic Circuits Cooled by Natural Convection	Janicki, Marcin	Poster Session B
Analytically Benchmarked Spatial and Temporal Discretization Guidelines for Finite Element Simulation of Thermal Waves	Pareek, Kaushal Arun (1); May, Daniel (2); Meszmer, Peter (2); Wunderle, Bernhard (2,3); Abo Ras, Mohamad (1)	Thermal Simulations 1
Artifacts of Non-ideal Thermal Excitation in Time-constant Spectra of thin Tnterfaces: A Simulation-based Study on Dead-time Extrapolation and Excitation Shift Effects	Schwan, Hannes; Schmid, Maximilian; Gordon, Elger	Thermal Simulations 2
Bayesian Optimization of Implantable Thermoelectric Generators	Hickisch, Philipp; Hohlfeld, Dennis	Poster Session A
CFD Investigation of Complete Immersion Forced Convection Cooling of a Lithium-Ion Prismatic Battery Module under Three Different Drive Cycles	Annathurai, Kantharuphan; Trimble, Daniel; O'Shaughnessy, Seamus	Poster Session A
CFD-Based Thermal Analysis of TPMS-Integrated Cooling Architectures for Battery Thermal Management Systems	Iqbal, Faisal; Sajid, Muhammad	Poster Session B
Comparative Evaluation of Taguchi, Response Surface Methodology and Full Factorial for Simulation-based Thermal–fluid Optimization of a Representative Liquid-cooled Heat Sink	Balikci, Cagri; Rayya, Monzer	Poster Session A
Comparison of Radial and Axial Thermal Transport in Silicon Nanowires	Burenkov, Alexander; Pichler, Peter; Schulz, Ferdinand	Thermal Simulations 2
Controlled Excitation of a Nonlinear Resonant Cantilever System for Experimental Delamination Characterization in High-Performance Computing Packages	Walther, David (1); Arnold, Jörg (1); Mohammadi, Arash (1); Becker, Karl Friedrich (2); Koch, Mathias (2); Wunderle, Bernhard (1,3,4,5)	Thermo-Mechanical Reliability 1
Cooling Electronics While Generating Power: A Thermomagnetic Pulsating Heat Pipe Approach	Cattani, Luca (1); Cugini, Francesco (2); Schiasselloni, Rachele (1); Pavon Vargas, Dario (1); Gabbi, Simone (2); Bozzoli, Fabio (3); Solzi, Massimo (2); Lorenzini, Giulio (1)	Two-Phase Cooling Solutions 2
CuBrick: A Novel Vertical Dielectric Immersion Cooling Approach	Renner, Johann; Hoang, Cuong; Huesgen, Till	Cooling Concepts & Thermal Technologies
Data-driven Thermal Resistance Prediction of Heat Pipes Using Artificial Neural Networks	Koyuncu, Ahmet; Köse, Haluk Anıl; Zengin, Arda; Ayas, Cankat; Yorulmaz, Efe; Doğu, Orkun; Yağcı, Vedat	Poster Session B
Design and Development of Miniaturized Thermal Test Chip for Advanced Interconnect and Packaging Technologies	Grosse-Kockert, Corinna (1); Dubey, Vikas (2); Sternberg, Maik (1); Wünsch, Dirk (2); Hiller, Karla (3); Rzepka, Sven (2); Abo Ras, Mohamad (1)	High-Performance Computing
Design and Implementation of Autonomous Sensor-driven Control Framework for Benchmarking Hybrid Air-liquid Server Cooling	Hossain, Md Robiul (1); Essink, Eoin Oude (1); Persoons, Tim (2); Ahern, Ciara (1); Alimohammadi, Sajad (1)	Cooling Concepts & Thermal Technologies
Deterministic, Solver-accurate Thermal and Warpage Analysis at Manufacturing Resolution for Advanced 2.5D HBM Packages	Mohammed, Rahima; Kabaria, Hardik; Radhakrishnan, Satish; Rerolle, Vincent; Stark, William; Osetonski, Sarah; Bruggeman, John; Frigo, Matteo	Thermal Simulations 1
Development of a Platform for Thermal Conductivity Measurement of Thermal Interface Materials at Cryogenic Temperatures through 3-Omega Method	Rincon-Ruiz, Carlos (1,3); Joehrmann, Nathanael (1,3); Grosse-Kockert, Corinna (5); Zschenderlein, Uwe (1); May, Daniel (1); Prinz, Matthias (2); Wunderle, Bernhard (1,2,3,4)	Thermal Characterization Methods 1
Development of a Test Bed to Analyse the Cooling Capability of an Air Amplifier for Data Centre Server Thermal Management	Salter, David W. (1); Oude Essink, Eoin H. (1); Persoons, Tim (2); Alimohammadi, Sajad (1)	Cooling Concepts & Thermal Technologies
Early Thermal-aware Floor-planning and Optimization Workflow	Valka, Miroslav	Poster Session B
Efficient Electro-thermal Analysis of Power ICs Using a Hybrid Finite Element and Lumped-element Approach	Dobre, Luiza (1); Bojita, Adrian (1); Purcar, Marius (1); Tscharnuter, Daniel (2); Petersmann, Manuel (2); Boianceanu, Cristian (3)	Poster Session A
Electro-thermal Modelling of 26650 Format LiFePO4 Battery Cell for Maritime Applications	Sainz De La Maza, Ane (1,3); Odriozola, Ainhoa (1); Ansean, David (2); Valdés, Enrique E. (2); García, Victor M. (2); Trancho, Elena (1); Ibarra, Edorta (3)	Poster Session A
Electro-thermal Simulation of aSi0.33Ge0.665Sn0.005 Reconfigurable Field-effect Transistor	Bozkurt, Duru (1); Malignaggi, Andrea (2); Zaitsev, Ignatii (2); Carta, Corrado (2); Manganelli, Costanza Lucia (2)	Poster Session B
Electro-Thermal Wide Temperature Range SPICE BJTs and FETs Transistor Models Based on Si, SiGe, SiC, GaAs, GaN Semiconductor Materials	Petrosyants, Konstantin O.; Ismail-zade, Mamed R.; Sambursky, Lev M.; Kozhukhov, Maxim V.	Thermal Simulations 2
Electrothermal Characterization and Simulation of GaAs Schottky Diodes for Terahertz (THz) Applications	Kakou, N'doua Luc Arnaud (1); Zerounian, Nicolas (2); Aniel, Frédéric (2); Sommet, Raphael (1)	Thermal Characterization Methods 2
Enhancement of Vertical Flow Boiling Performance through Port and Channel Design	Ye, Hanyang; Barathula, Sreeram; Wong, Teck Neng; Ho, Jin Yao	Two-Phase Cooling Solutions 1
Enhancing Flow Redistribution in Skived Heat Sinks for High-power Density Computing: An End-to-End Case Study	Vandebeek, Ine; Vervecken, Lieven	Computational Fluid Dynamics
Environmental Impact on Server Computational Performance	Oude Essink, Eoin Hendrikus (1); Persoons, Tim (2); Alimohammadi, Sajad (1)	Poster Session B
Evaluation of the Cooling Behaviour of Different Cooling Concepts for 2-Phase Approaches under the Influence of Mechanical Vibrations	Ernst, Plamen; Rohmann, Fabian	Two-Phase Cooling Solutions 2
Experimental Comparison of Flow Boiling Instabilities in two Increasing Density Heatsink Designs	Camarasa, Jaume; Vilarrubí, Montse; Rosell, Pol; Regany, Desideri; Beberide, David; Rosell, Joan Ignasi; Ibáñez, Manel; Barrau, Jérôme	Two-Phase Cooling Solutions 1
Experimental Investigation of In-situ Glass-transition Detection in Insulated Metal Substrates	Hantos, Gusztáv (1); Hegedüs, János (1); Lipák, Gyula (1); Demian, David (2); Cavallini, Andrea (2); Poppe, András (1); Ender, Ferenc (1)	Thermo-Mechanical Reliability 2
Experimental Investigation of Metal-Foam Pore Density in a PCM-Based Passive Module for Thermal Control of Electronic Components.	Salhab, Hala (1,2); Manca, Oronzio (1,2); Buonomo, Bernardo (1,2); Nardini, Sergio (1,2)	Poster Session A
Experimental Investigation of Warpage-Induced Thermal Performance Degradation in HPC Packages Using Thermal Test Vehicles	Saums, Dave (1); Sternberg, Maik (2); Abo Ras, Mohamad (2)	High-Performance Computing
Experimental Investigation on the Effects of Square Waveform Heat Flux Boundary Conditions Applied to Annular, Intermittent and Slug Flows	Rogiers, Jana (1,2); Nonnemann, Jasper (1,2,3); De Paepe, Michel (1,2,4)	Poster Session A
Experimental Performance Validation Of Flow Guider Structures For Direct Cooling Of Prismatic Battery Cells	Cnudde, Lander Lode (1,2); Rogiers, Jana (1,2); De Paepe, Michiel (1,2); Nonneman, Jasper (1,2,3); De Paepe, Michel (1,2,4)	Poster Session A
Experimental Thermo-Hydraulic Investigation of the Transition Toward Fully Direct Liquid-Cooled Server Architectures	Charaf, Hussein (1,2); Maalouly, Michael (1); Chehade, Ali (1); Moussa, Tala (2); Maalouf, Chadi (2)	Poster Session B
Experimental Validation of a Lumped Parameter Thermal Model for Spreading Resistance in Direct-cooled Power Electronics	Cnudde, Lander Lode (1,2); Nonneman, Jasper (1,2,3); Rogiers, Jana (1,2); De Paepe, Michiel (1,2); De Paepe, Michel (1,2,4)	Poster Session A
Flow-boiling Cooling Concept for a Small Form-factor Embedded MOSFET Half-bridge Power Module	Schacht, Ralph (1); Fischer, Felix (2); Majed, Ben (1); Krischel, Finn (2); Gruen, Tobias (3); Vermeer, Wiljan (2); Wunderle, Bernhard (4); Hoene, Eckart (2)	Two-Phase Cooling Solutions 2
Guideline for Thermal Characterization of Multi-chip Packages - A New JEDEC Standard	Schweitzer, Dirk	Thermal Characterization Methods 1
Harvesting Electricity using Thermoelectric Cells	Ptak, Przemyslaw; Arendt, Piotr; Górecki, Krzysztof	Poster Session B
Heat Spreading from a Small Source on a Thick Plate	Luiten, Wendy	Thermal Characterization Methods 1
High-Order ECM-Based Electro-Thermal Model for Lithium-Ion Batteries with Delayed Thermal Behavior	Yu, Samuel (1); Kim, Eonhyo (2); Lee, Seungmin (1); Seo, Jinwon (1); Yoo, Kisoo (2); Choi, Bongkeon (1)	Poster Session B
Hot Spot Prediction of a MOSFET Chip Using Machine Learning	Buburuzan, Alexandru-Dumitru (1); Pelz, Georg (2); Buzo, Andi (2); Davidoiu, Valentina (3); Purcar, Marius-Ioan (1)	Poster Session A
Identifying Failure Root Causes at Cu-Cu Interfaces of Vias using EBAC Analysis	Mitterhuber, Lisa; Leitgeb, Verena; Kraker, Elke	Thermo-Mechanical Reliability 2
Impact of Boundary Conditions on Topology Optimization of Fin Structures for PCM-based Battery Thermal Management	Bianco, Nicola; Fragnito, Andrea; Iasiello, Marcello; Orlanducci, Vittorio; Piccirillo, Francesco	Thermal Simulations 1
Influence of Surface Roughness on the Thermal and Reliability Performance of Thermal Interface Materials	Reinke, Aron; Harder, Antonio; Campos, Santiago; Bräuer, Teresa; Abo Ras, Mohamad; Zimon, Pattric	Thermal Materials Innovations
Infrared Detection of Crack-Tip-Associated Thermal Signatures Under Cyclic Loading: From Bulk Plexiglas Specimens to Bimaterial Interfaces	May, Daniel (1); Schulz, Marcus (2); Abo Ras, Mohamad (2); Wunderle, Bernhard (1)	Thermo-Mechanical Reliability 1
Innovative Solution for Multiscale Warpage Measurement of Complex Integrated Packages	Everaere, Pierre; Choisel, Nicolas; Vernhes, Pierre	Poster Session B
Laser Powder Bed Fusion (LPBF) of Copper-graphene Metal Matrix Composites for Enhanced Heat Transfer	Wits, Wessel W. (1,2); Lee, Hyunjong (1); van Goor, Leonore (1); Geurts, Bernard (1); Jafari, Davoud (1)	Thermal Materials Innovations
Lightweight Thermal Management in Electric Vehicle Body Components: Injection‑Molded Thermoplastic Sandwiches with Embedded Electronics	Meszmer, Peter (1,4); Klengel, Sandy (2); Schulz, Marcus (3); Müller, Steffen (2); Abo Ras, Mohamad (3); Wunderle, Bernhard (1,4)	Thermal Materials Innovations
Limits of Nickel Diffusion Barriers at High Operating Temperatures	Nowottnick, Mathias; Novikov, Andrej; Purschke, Simon	Thermo-Mechanical Reliability 1
Lumped‑parameter Modelling of PCM‑integrated Heat Sinks with Experimental Validation	De Paepe, Michiel (1,2); Goderis, Maité (1,2); Rogiers, Jana (1,2); Plas, Wito (1,2); De Paepe, Michel (1,2,3)	Poster Session B
Modeling of Spatially Varying Thermal Contact Conductance in Bolted Electronic Package Heat Sink Joints	Ajul, E (1,2); Naseef V, Muhammed (2); Chanda, Samajeet (2)	Poster Session A
Modeling Study on Thermal Runaway of Battery System	Elogb, Ranim; Ouenzerfi, Safouene; Mahdaoui, Mustapha; Harmand, Souad	Poster Session A
Non-destructive Defect Analysis of Through-glass Vias Using Transient Thermal Response	Ma, Byongjin; Baek, Juhee; Lee, Guesuk; Kim, Jemin	Poster Session A
Novel Methods to Address the Time Dependence of TSPs in the Thermal Testing of Power Devices	Ress, Sándor (1,2); Rencz, Márta (1); Farkas, Gábor (2); Sárkány, Zoltán (2)	Thermal Characterization Methods 2
Numerical Investigation of Two-Phase Pool Boiling Cooling for a 50Ah Prismatic Lithium-Ion Battery Cell	Nimmagadda, Rajesh; Annathurai, Kantharuphan; Trimble, Daniel; M. O’Shaughnessy, Seamus	Poster Session B
Numerical Investigation on Thermal Behaviour of Inclined Plate Heat Sink with Metal Foam Fins and PCM for Electronic Cooling	Arumugam, Aanandsundar; Bounib, Meriem; Buonomo, Bernardo; Manca, Oronzio; Nardini, Sergio	Poster Session A
Numerical Modelling of Thermocapillary Effect Driven Heat Transfer Devices	Herath, Dinuka (1,2); Maksimov, Aleksei (1); Wijekoon, Thiwanka (1); Wen, Dongsheng (2)	Poster Session B
Numerical Study of the Self- and Mutual-heating in GaAs pHEMT for MMIC Low-noise Amplifiers	Catalano, Antonio Pio (1); Marino, Miriana (2); Scognamillo, Ciro (1); Cimmino, Salvatore (2); d'Alessandro, Vincenzo (1)	Poster Session B
On the Electrical and Thermal Performance of Thermal Gap Pads Exposed to Constant Voltage and Cyclic Thermo-mechanical Loading	Matzick, Philip; Mollov, Stefan	Poster Session B
Optimisation of Overmolded PowerModules for EV Energy Conversion	Hélie, Jérôme (1); Ghioldi, Federicoie (2); Piscaglia, Federico (2); Marie, Alexandre (3); Fradin, Jean-Pierre (3)	Cooling Concepts & Thermal Technologies
Optimization of the Thermal Performance of Wide Band Gap Power Module through Geometrically Optimized Ceramic Heat sink (Al2O3) Manufactured by 3D-Printing (SLA-DLP Technology).	Teulet, Lucie (1); Fradin, Jean-Pierre (2); Batikh, Ahmad (2); Marie, Alexandre (2); Périé, Benjamin (2); Puel, Virgile (2); Marcault, Emmanuel (1); Mage, Lucile (1); Tounsi, Patrick (3)	Poster Session B
Packaging and Thermal Management Concept of Power Antenna-in-substrate (AiS) Chip-on-flex Assemblies on Curved Surfaces	Wunderle, Bernhard (1,2,3,4); Haseloff, Jannik (5); Arnold, Jörg (1); Heilmann, Jens (1); Dancila, Dragos (6); Konstantinidis, George (7); Ziaei, Afshin (8); Abo Ras, Mohamad (5)	Cooling Concepts & Thermal Technologies
Parametric Model Order Reduction of an IGBT Module for System-level Electro-thermal Simulation	Gogoi, Shashwat Kamal (1); Taghdiri, Aliakbar (1,2); Hickisch, Philipp (1); Hohlfeld, Dennis (1); Bechtold, Tamara (1,2)	Poster Session B
Performance Assessment of Sustainable and Energy-Efficient Indirect Evaporative Cooling System	Nadeem, Talha Bin (1,2); Imran, Muhammad (1); Tandis, Emad (1); Mwangi, Simon (1)	Poster Session A
Pulsating Heat Pipe Passive Cooling for Photovoltaic Panel Distributed Optimizers	Musetti, Alex (1); Schiasselloni, Rachele (2); Pavon Vargas, Dario Javier (2); Menozzi, Roberto (1); Lorenzini, Giulio (2); Cattani, Luca (2); Soldati, Alessandro (1)	Poster Session A
REVIEW OF EXPERIMENTS IN MICROLAYER THICKNESS DURING NUCLEATE BOILING	Vandenhove, Willem (1); Whiting, Mitchell (1); Nonneman, Jasper (1,2,3); Verhaert, Ivan (1); T'Jollyn, Ilya (1)	Two-Phase Cooling Solutions 1
Smart Evaluation of Interconnect Quality Test Methods in LED Packages using Controlled Defects	Rieder, Jennifer; Zahner, Thomas; Liu, E	Thermo-Mechanical Reliability 1
Sparse Thermal-sensor Placement for Reduced-order Package Diagnostics: A Minimal 2D RC Identifiability Benchmark	Swierk, Dariusz	Poster Session B
Stacked Si-on–GaN Architectures: Unlocking Reliability for Ultra-Compact Half-Bridge Designs	Nallam, Sri Sai Chandra Abhinay (1); Fabian, Benjamin (1); Hofmann, Eric (1); Heldt, Christoph (1); Fritzsche, Sebastian (1); Heinickel, Patrick (1); Liu, Nick (2); Mathew, Anu (3)	Thermo-Mechanical Reliability 2
Stainless Steel Thermosyphon and Pulsating Heat Pipe: Thermal Performance Comparison	Krambeck, Larissa (1,2); Domiciano, Kelvin G. (1); Beé, Maria E. (1); Marengo, Marco (2); Mantelli, Marcia B. H. (1)	Poster Session B
Structural Features and J-B-T Operating Window of Patterned Niobium Thin-Film Lines on Silicon for Cryogenic 3D Integration	Qadir, Awais (1,3); Zschenderlein, Uwe (1); Vogel, Klaus (2); Hofmann, Christian (2); Jöhrmann, Nathanael (1,2); Wunderle, Bernhard (1,2,3,4)	Thermal Characterization Methods 1
Submicron Ultrafast Raman Thermography System for Power Semiconductor and TGV Inspection	Song, Jung-Hoon (1,2); Moon, Youngboo (1,3); Lim, Seungyoung (1); Choi, Gyeong Eun (1); Kim, Jaesun (1); Ma, Byongjin (4)	Thermal Characterization Methods 2
Supercritical CO2 as Working Fluid for Heat Spreader Applications in Thin Form Factor Electronics	Pujahari, Ankita (1); Macdonald, Mark (2); DasGupta, Sunando (1); Bhattacharya, Anandaroop (1)	Poster Session A
Sustainable Cellulose-based Thermal Interface Material for Heat Dissipation of LED	Liu, Chenming	Poster Session A
Thermal Assessment of a Smart Power Stage Through Experiments and SPICE Simulations	Eliseo, Giorgio (1,2); Scognamillo, Ciro (1); Catalano, Antonio Pio (1); d'Alessandro, Vincenzo (1); De Paola, Francesco Maria (2); Roig, Jaume (3); Betak, Petr (3); Victory, James (3)	Thermal Simulations 2
Thermal Investigation and Multi-objective Ranking of Sinusoidal Pin-fin Geometries for Water-blocks	Vahidi Ferdousi, Mahdi (1,2); Bauduin, Hadrien (1); Maalouly, Michael (1); Chehade, Ali (1); Al Moussawi, Houssain (3); Bogard, Fabien (2); Maalouf, Chadi (2)	Poster Session A
Thermal Investigation in Lock-in Thermography of Lateral Power GaN Transistor from the Backside Under Specific Driving Conditions	Burky, Jeremie; Grzes, Thomas; Kerreneur, Hugo; Guillot, Laurent; Tilhac, Frederic	Poster Session A
Thermal Optimization of UVC LED Cooling Solutions Using a Combination of Thermal Simulations and Microthermography	Staliulionis, Zygimantas; Plaipaitė-Nalivaiko, Rita	Poster Session B
Thermal Performance Evaluation of Aluminum-ammonia Heat Pipes for High-power Electronics Cooling	Lin, Yuh-Ger; Vu, Van-Hoan; Athalla, Reyhan; Lin, Ho-Chuan	Poster Session B
Thermal Reduced-order Modelling of a SiC Power Module for Powertrain Cooling-system Design	Koné, Karnon (1,2); Fénot, Matthieu (2); Videcocq, Etienne (2); Zeaiter, Amal (1); Küttler, Sulivan (1)	Poster Session A
Thermal-hydraulic Analysis of Pressure Drop in Miniaturized Loop Heat Pipe	Guessi Domiciano, Kelvin (1); Krambeck, Larissa (1,2); Barbosa Henriques Mantelli, Marcia (1)	Two-Phase Cooling Solutions 1
Thermo-hydraulic Performance of a Tetrahedral Lattice Core under Laminar Flow: Effects of Strut Materials and Coolant Media	Riaz, Ali; Kadivar, Mohammadreza; Lohan, John; Tromey, David; McGranaghan, Gerard	Computational Fluid Dynamics
Thermo-hydraulic Performance of Microchannel Heat Sinks with Square Pin-fin Geometries: A Numerical Investigation	Khaled, Ashraf (1); Abdel Razzaq, Mohammed (2); Khalid, Youssef (3); Naser, Mohamed (1); Elkholy, Mohamed (4); Elhagali, Ibrahim (4,5); Maklad, Osama (6,7)	Poster Session A
Thermomechanical Analysis and Validation of an Overmoulded Package Design for Improved Thermal Interface via Selective EMC Grinding	Erol, Baris (1); Koch, Mathias (2); Voitel, Marcus (2); Hölck, Ole (2); Leadbetter, Leonie (2); Becker, Karl-Friedrich (2,3); Braun, Tanja (2,3); May, Daniel (1); Wunderle, Bernhard (1,4)	High-Performance Computing
Transient CFD Modelling of Two Phase Microchannel Cooling in a Multi Chip Power Module	Sadeghi, Sadegh; Bahman, Amir Sajjad	Poster Session B
Transient Thermal Response in AlGaN/GaN HEMT Transistor: Influence of Dissipated Power on Thermal Time Constants	Jakani, Anass (1); Bouslama, Mohamed (1); Jacquet, Jean-Claude (1); Lambert, Benoit (2); Nallatamby, Jean-Christophe (3); Sommet, Raphael (3); Gauthier, Gildas (1)	Thermal Characterization Methods 2
Two-dimensional Cryogenic Micro-raman Stress Mapping in Silicon Around Through-silicon Vias and SLID Bond Interface	Ayaz, Maham (1,2); Meszmer, Peter (1,2); Zschenderlein, Uwe (1); Richter Trummer, Susana (3); Prinz, Matthias (3); Wunderle, Bernhard (1,2,3,4,5)	Thermo-Mechanical Reliability 2
Validated Parametric MOR Approach for Thermal Modelling of Semiconductor Switches	Codecasa, Lorenzo (1); Foresti, Samuele (2); Raciti, Luca (2); Masper, Thomas (2); Ragaini, Enrico (2); Maffezzoni, Paolo (1); D'Amore, Dario (1)	Thermal Simulations 1
Water-cooling Circuit Designs Comparison for Enhanced Natural Convection in Single-phase Immersion Cooling for Data Centers	Ruichek, Ayoub (1,3); Maalouly, Michael (1); Hnayno, Mohamad (1); Chehade, Ali (1); Fardoun, Farouk (2); Moussa, Tala (3); Polidori, Guillaume (3); Maalouf, Chadi (3)	Poster Session A

THERMINIC 2026

Berlin | September 16 - 18, 2026

Index of Titles