Index of Titles

A complete list of all conference contributions. Use the alphabetical filter or the search box below to find specific submissions. Click on any contribution to view its session details.

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Contribution Title Author(s) Session
Thermal Assessment of a Smart Power Stage Through Experiments and SPICE Simulations
Eliseo, Giorgio (1,2); Scognamillo, Ciro (1); Catalano, Antonio Pio (1); d'Alessandro, Vincenzo (1); De Paola, Francesco Maria (2); Roig, Jaume (3); Betak, Petr (3); Victory, James (3)Thermal Simulations 2
Thermal Investigation and Multi-objective Ranking of Sinusoidal Pin-fin Geometries for Water-blocks
Vahidi Ferdousi, Mahdi (1,2); Bauduin, Hadrien (1); Maalouly, Michael (1); Chehade, Ali (1); Al Moussawi, Houssain (3); Bogard, Fabien (2); Maalouf, Chadi (2)Poster Session A
Thermal Investigation in Lock-in Thermography of Lateral Power GaN Transistor from the Backside Under Specific Driving Conditions
Burky, Jeremie; Grzes, Thomas; Kerreneur, Hugo; Guillot, Laurent; Tilhac, FredericPoster Session A
Thermal Optimization of UVC LED Cooling Solutions Using a Combination of Thermal Simulations and Microthermography
Staliulionis, Zygimantas; Plaipaitė-Nalivaiko, RitaPoster Session B
Thermal Performance Evaluation of Aluminum-ammonia Heat Pipes for High-power Electronics Cooling
Lin, Yuh-Ger; Vu, Van-Hoan; Athalla, Reyhan; Lin, Ho-ChuanPoster Session B
Thermal Reduced-order Modelling of a SiC Power Module for Powertrain Cooling-system Design
Koné, Karnon (1,2); Fénot, Matthieu (2); Videcocq, Etienne (2); Zeaiter, Amal (1); Küttler, Sulivan (1)Poster Session A
Thermal-hydraulic Analysis of Pressure Drop in Miniaturized Loop Heat Pipe
Guessi Domiciano, Kelvin (1); Krambeck, Larissa (1,2); Barbosa Henriques Mantelli, Marcia (1)Two-Phase Cooling Solutions 1
Thermo-hydraulic Performance of a Tetrahedral Lattice Core under Laminar Flow: Effects of Strut Materials and Coolant Media
Riaz, Ali; Kadivar, Mohammadreza; Lohan, John; Tromey, David; McGranaghan, GerardComputational Fluid Dynamics
Thermo-hydraulic Performance of Microchannel Heat Sinks with Square Pin-fin Geometries: A Numerical Investigation
Khaled, Ashraf (1); Abdel Razzaq, Mohammed (2); Khalid, Youssef (3); Naser, Mohamed (1); Elkholy, Mohamed (4); Elhagali, Ibrahim (4,5); Maklad, Osama (6,7)Poster Session A
Thermomechanical Analysis and Validation of an Overmoulded Package Design for Improved Thermal Interface via Selective EMC Grinding
Erol, Baris (1); Koch, Mathias (2); Voitel, Marcus (2); Hölck, Ole (2); Leadbetter, Leonie (2); Becker, Karl-Friedrich (2,3); Braun, Tanja (2,3); May, Daniel (1); Wunderle, Bernhard (1,4)High-Performance Computing
Transient CFD Modelling of Two Phase Microchannel Cooling in a Multi Chip Power Module
Sadeghi, Sadegh; Bahman, Amir SajjadPoster Session B
Transient Thermal Response in AlGaN/GaN HEMT Transistor: Influence of Dissipated Power on Thermal Time Constants
Jakani, Anass (1); Bouslama, Mohamed (1); Jacquet, Jean-Claude (1); Lambert, Benoit (2); Nallatamby, Jean-Christophe (3); Sommet, Raphael (3); Gauthier, Gildas (1)Thermal Characterization Methods 2
Two-dimensional Cryogenic Micro-raman Stress Mapping in Silicon Around Through-silicon Vias and SLID Bond Interface
Ayaz, Maham (1,2); Meszmer, Peter (1,2); Zschenderlein, Uwe (1); Richter Trummer, Susana (3); Prinz, Matthias (3); Wunderle, Bernhard (1,2,3,4,5)Thermo-Mechanical Reliability 2