Conference Agenda
| Session | |
S 7: Thermal Characterization Methods 2
| |
| Presentations | |
Transient Thermal Response in AlGaN/GaN HEMT Transistor: Influence of Dissipated Power on Thermal Time Constants 1III-V Lab (Thales), France; 2UMS - United Monolithic Semiconductors, France; 3XLIM, France Electrothermal Characterization and Simulation of GaAs Schottky Diodes for Terahertz (THz) Applications 1XLIM CNRS, France; 2C2N CNRS, France Submicron Ultrafast Raman Thermography System for Power Semiconductor and TGV Inspection 1AccuOptotec Col,, Korea, Republic of (South Korea); 2Kongju National University, Korea, Republic of (South Korea); 3UJL Co., Korea, Republic of (South Korea); 44Korea Electronics Technology Institute, Korea, Republic of (South Korea) Novel Methods to Address the Time Dependence of TSPs in the Thermal Testing of Power Devices 1Budapest University of Technology and Economics, Hungary; 2SIEMENS DI SW, Budapest, Hungary | |