Heat Spreading from a Small Source on a Thick Plate

Wendy Luiten

WLC, Netherlands, The

Guideline for Thermal Characterization of Multi-chip Packages - A New JEDEC Standard

Dirk Schweitzer

Infineon Technologies AG, Germany

Development of a Platform for Thermal Conductivity Measurement of Thermal Interface Materials at Cryogenic Temperatures through 3-Omega Method

Carlos Rincon-Ruiz^1,3, Nathanael Joehrmann^1,3, Corinna Grosse-Kockert⁵, Uwe Zschenderlein¹, Daniel May¹, Matthias Prinz², Bernhard Wunderle^1,2,3,4

1: Technische Universität Chemnitz, Germany; 2: Fraunhofer ENAS, Chemnitz, Germany; 3: Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN); 4: Center for Micro- and Nanotechnologies (ZfM), Chemnitz, Germany; 5: Nanotest Berlin, Germany

Structural Features and J-B-T Operating Window of Patterned Niobium Thin-Film Lines on Silicon for Cryogenic 3D Integration

Awais Qadir^1,3, Uwe Zschenderlein¹, Klaus Vogel², Christian Hofmann², Nathanael Jöhrmann^1,2, Bernhard Wunderle^1,2,3,4

1: Professorship Materials and Reliability of Microsystems, Chemnitz University of Technology, Chemnitz, Germany; 2: Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany; 3: Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology Chemnitz, Germany; 4: Micro Materials Centre Fraunhofer Institute for Electronic Nano Systems – ENAS Chemnitz, Germany