Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Please note that all times are shown in the time zone of the conference. The current conference time is: 19th June 2026, 12:32:00am CEST
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Daily Overview |
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S 6: Thermal Characterization Methods 1
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Heat Spreading from a Small Source on a Thick Plate WLC, Netherlands, The Guideline for Thermal Characterization of Multi-chip Packages - A New JEDEC Standard Infineon Technologies AG, Germany Development of a Platform for Thermal Conductivity Measurement of Thermal Interface Materials at Cryogenic Temperatures through 3-Omega Method 1Technische Universität Chemnitz, Germany; 2Fraunhofer ENAS, Chemnitz, Germany; 3Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN); 4Center for Micro- and Nanotechnologies (ZfM), Chemnitz, Germany; 5Nanotest Berlin, Germany Structural Features and J-B-T Operating Window of Patterned Niobium Thin-Film Lines on Silicon for Cryogenic 3D Integration 1Professorship Materials and Reliability of Microsystems, Chemnitz University of Technology, Chemnitz, Germany; 2Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany; 3Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology Chemnitz, Germany; 4Micro Materials Centre Fraunhofer Institute for Electronic Nano Systems – ENAS Chemnitz, Germany | |