Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Daily Overview |
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PS_B: Poster Session B
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Innovative Solution for Multiscale Warpage Measurement of Complex Integrated Packages INSIDIX, France Lumped‑parameter Modelling of PCM‑integrated Heat Sinks with Experimental Validation 1: Ghent University, Belgium; 2: FlandersMake@Ugent; 3: University of Cape Town, South Africa Numerical Modelling of Thermocapillary Effect Driven Heat Transfer Devices 1: Huawei Nuremberg Research Center, Germany; 2: Technical University Munich, Germany Two-Phase Pool Boiling Immersion Cooling for Prismatic Lithium-Ion Batteries Subjected to Higher Discharge Rates Trinity College Dublin, Ireland Electro-thermal Simulation of aSi0.33Ge0.665Sn0.005 Reconfigurable Field-effect Transistor 1: Sabanci University; 2: IHP-Leibniz Institute for High Performance Microelectronics, Germany; 3: Institute of Solid State Electronics, Technische Universit¨at Wien, Austria Data-driven Thermal Resistance Prediction of Heat Pipes Using Artificial Neural Networks Aselsan Inc., Turkey (Türkiye) Optimization of the Thermal Performance of Wide Band Gap Power Module through Geometrically Optimized Ceramic Heat sink (Al2O3) Manufactured by 3D-Printing (SLA-DLP Technology). 1: CEA, France; 2: ICAM, France; 3: LAAS-CNRS, France Thermal Optimization of UVC LED Cooling Solutions Using a Combination of Thermal Simulations and Microthermography Lithuanian university of Applied Engineering Sciences, Lithuania Parametric Model Order Reduction of an IGBT Module for System-level Electro-thermal Simulation 1: University of Rostock, Albert-Einstein-Str. 2, 18059 Rostock, Germany; 2: Jade University of Applied Sciences, Friedrich-Paffrath-Str. 101, 26386 Wilhelmshaven, Germany Stainless Steel Thermosyphon and Pulsating Heat Pipe: Thermal Performance Comparison 1: Heat Pipe Laboratory, Federal University of Santa Catarina, Brazil; 2: Department of Civil Engineering and Architecture, University of Pavia, Pavia Sparse Thermal-sensor Placement for Reduced-order Package Diagnostics: A Minimal 2D RC Identifiability Benchmark LFTC London, United Kingdom Thermal Performance Evaluation of Aluminum-ammonia Heat Pipes for High-power Electronics Cooling EW JET PRODUCTS Co., Ltd., Taiwan CFD-Based Thermal Analysis of a TPMS-Integrated Cooling Architecture for Battery Thermal Management System University College Dublin, Ireland Harvesting Electricity using Thermoelectric Cells Gdynia Maritime University, Department of Power Electronics, Poland Transient CFD Modelling of Two Phase Microchannel Cooling in a Multi Chip Power Module Aalborg University, Denmark On the Electrical and Thermal Performance of Thermal Gap Pads Exposed to Constant Voltage and Cyclic Thermo-mechanical Loading Silicon Austria Labs, Austria Environmental Impact on Server Computational Performance 1: Technological University Dublin, Ireland; 2: Trinity College Dublin, Ireland; 3: Loughborough University Analysis of Heat Transfer Coefficient Values and Temperature Distribution in Power Hybrid Electronic Circuits Cooled by Natural Convection Lodz University of Technology, Poland High-Order ECM-Based Electro-Thermal Model for Lithium-Ion Batteries Incorporating Diffusion-Induced Concentration Polarization 1: Future Technology Convergence Institute, Hyundai Mobis, Republic of Korea; 2: School of Mechanical Engineering, Yeungnam University, Republic of Korea A Fracture Mechanical Approach for EMC/Copper Interface Characterization Using Button Shear Testing in Automotive Power Module Applications 1: Schaeffler AG, Germany; 2: Technical University Chemnitz, Chemnitz, Germany A Method for Measuring Junction-to-Case Thermal Resistance in Bottom-Side-Cooling Packages STMicroelectronics SA Experimental Thermo-Hydraulic Investigation of the Transition Toward Fully Direct Liquid-Cooled Server Architectures 1: OVHcloud, 155 Avenue Georges Hannart, 59170 Croix, France; 2: ITheMM, University of Reims Champagne-Ardenne, 51100 Reims, France Early Thermal-aware Floor-planning and Optimization Workflow Synopsys Inc, Germany Numerical Study of the Self- and Mutual-heating in GaAs pHEMT for MMIC Low-noise Amplifiers 1: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2: Microelectronics Division, MBDA Italia S.p.A., Bacoli, Italy | ||