Innovative Solution for Multiscale Warpage Measurement of Complex Integrated Packages

Pierre Everaere, Nicolas Choisel, Pierre Vernhes

INSIDIX, France

Lumped‑parameter Modelling of PCM‑integrated Heat Sinks with Experimental Validation

Michiel De Paepe^1,2, Maité Goderis^1,2, Jana Rogiers^1,2, Wito Plas^1,2, Michel De Paepe^1,2,3

¹Ghent University, Belgium; ²FlandersMake@Ugent; ³University of Cape Town, South Africa

Numerical Modelling of Thermocapillary Effect Driven Heat Transfer Devices

Dinuka Herath^1,2, Aleksei Maksimov¹, Thiwanka Wijekoon¹, Dongsheng Wen²

¹Huawei Nuremberg Research Center, Germany; ²Technical University Munich, Germany

Numerical Investigation of Two-Phase Pool Boiling Cooling for a 50Ah Prismatic Lithium-Ion Battery Cell

Rajesh Nimmagadda, Kantharuphan Annathurai, Daniel Trimble, Seamus M. O’Shaughnessy

Trinity College Dublin, Ireland

Electro-thermal Simulation of aSi0.33Ge0.665Sn0.005 Reconfigurable Field-effect Transistor

Duru Bozkurt¹, Andrea Malignaggi², Ignatii Zaitsev², Corrado Carta², Costanza Lucia Manganelli²

¹Sabanci University; ²IHP-Leibniz Institute for High Performance Microelectronics, Germany

Data-driven Thermal Resistance Prediction of Heat Pipes Using Artificial Neural Networks

Ahmet Koyuncu, Haluk Anıl Köse, Arda Zengin, Cankat Ayas, Efe Yorulmaz, Orkun Doğu, Vedat Yağcı

Aselsan Inc., Turkey (Türkiye)

Optimization of the Thermal Performance of Wide Band Gap Power Module through Geometrically Optimized Ceramic Heat sink (Al2O3) Manufactured by 3D-Printing (SLA-DLP Technology).

Lucie Teulet¹, Jean-Pierre Fradin², Ahmad Batikh², Alexandre Marie², Benjamin Périé², Virgile Puel², Emmanuel Marcault¹, Lucile Mage¹, Patrick Tounsi³

¹CEA, France; ²ICAM, France; ³LAAS-CNRS, France

Thermal Optimization of UVC LED Cooling Solutions Using a Combination of Thermal Simulations and Microthermography

Zygimantas Staliulionis, Rita Plaipaitė-Nalivaiko

Lithuanian university of Applied Engineering Sciences, Lithuania

Parametric Model Order Reduction of an IGBT Module for System-level Electro-thermal Simulation

Shashwat Kamal Gogoi¹, Aliakbar Taghdiri^1,2, Philipp Hickisch¹, Dennis Hohlfeld¹, Tamara Bechtold^1,2

¹University of Rostock, Albert-Einstein-Str. 2, 18059 Rostock, Germany; ²Jade University of Applied Sciences, Friedrich-Paffrath-Str. 101, 26386 Wilhelmshaven, Germany

Stainless Steel Thermosyphon and Pulsating Heat Pipe: Thermal Performance Comparison

Larissa Krambeck^1,2, Kelvin G. Domiciano¹, Maria E. Beé¹, Marco Marengo², Marcia B. H. Mantelli¹

¹Heat Pipe Laboratory, Federal University of Santa Catarina, Brazil; ²Department of Civil Engineering and Architecture, University of Pavia, Pavia

Sparse Thermal-sensor Placement for Reduced-order Package Diagnostics: A Minimal 2D RC Identifiability Benchmark

Dariusz Swierk

LFTC London, United Kingdom

Thermal Performance Evaluation of Aluminum-ammonia Heat Pipes for High-power Electronics Cooling

Yuh-Ger Lin, Van-Hoan Vu, Reyhan Athalla, Ho-Chuan Lin

EW JET PRDUCTS Co., Ltd., Taiwan

CFD-Based Thermal Analysis of TPMS-Integrated Cooling Architectures for Battery Thermal Management Systems

Faisal Iqbal, Muhammad Sajid

University College Dublin, Ireland

Harvesting Electricity using Thermoelectric Cells

Przemyslaw Ptak, Piotr Arendt, Krzysztof Górecki

Gdynia Maritime University, Department of Power Electronics, Poland

Transient CFD Modelling of Two Phase Microchannel Cooling in a Multi Chip Power Module

Sadegh Sadeghi, Amir Sajjad Bahman

Aalborg University, Denmark

A Thermo‑viscoelastic Model for Pressure‑dependent Effective Thermal Impedance of Thermal Interface Material Gap Pads

Ismail Recepi, Faruk Kapidzic, Philip Matzick, Stefan Mollov

Silicon Austria Labs GmbH, Austria

On the Electrical and Thermal Performance of Thermal Gap Pads Exposed to Constant Voltage and Cyclic Thermo-mechanical Loading

Philip Matzick, Stefan Mollov

Silicon Austria Labs, Austria

Environmental Impact on Server Computational Performance

Eoin Hendrikus Oude Essink¹, Tim Persoons², Sajad Alimohammadi¹

¹Technological University Dublin, Ireland; ²Trinity College Dublin, Ireland

Analysis of Heat Transfer Coefficient Values and Temperature Distribution in Power Hybrid Electronic Circuits Cooled by Natural Convection

Marcin Janicki

Lodz University of Technology, Poland

High-Order ECM-Based Electro-Thermal Model for Lithium-Ion Batteries with Delayed Thermal Behavior

Samuel Yu¹, Eonhyo Kim², Seungmin Lee¹, Jinwon Seo¹, Kisoo Yoo², Bongkeon Choi¹

¹Future Technology Convergence Institute, Hyundai Mobis, Republic of Korea; ²School of Mechanical Engineering, Yeungnam University, Republic of Korea

A Fracture Mechanical Approach for EMC/Copper Interface Characterization Using Button Shear Testing in Automotive Power Module Applications

Monica Jagadish^1,2, Markus Leicht¹, Bernhard Wunderle²

¹Schaeffler AG, Germany; ²Technical University Chemnitz, Chemnitz, Germany

A Method for Measuring Junction-to-Case Thermal Resistance in Bottom-Side-Cooling Packages

Julio Brandelero, Robin Jung, Alfio Pappaardo

STMicroelectronics SA

Experimental Thermo-Hydraulic Investigation of the Transition Toward Fully Direct Liquid-Cooled Server Architectures

Hussein Charaf^1,2, Michael Maalouly¹, Ali Chehade¹, Tala Moussa², Chadi Maalouf²

¹OVHcloud, 155 Avenue Georges Hannart, 59170 Croix, France; ²ITheMM, University of Reims Champagne-Ardenne, 51100 Reims, France

Early Thermal-aware Floor-planning and Optimization Workflow

Miroslav Valka

Synopsis, Germany

Numerical Study of the Self- and Mutual-heating in GaAs pHEMT for MMIC Low-noise Amplifiers

Antonio Pio Catalano¹, Miriana Marino², Ciro Scognamillo¹, Salvatore Cimmino², Vincenzo d'Alessandro¹

¹Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; ²Microelectronics Division, MBDA Italia S.p.A., Bacoli, Italy