Thermo-hydraulic Performance of Microchannel Heat Sinks with Square Pin-fin Geometries: A Numerical Investigation

Ashraf Khaled¹, Mohammed Abdel Razzaq², Youssef Khalid³, Mohamed Naser¹, Mohamed Elkholy⁴, Ibrahim Elhagali^4,5, Osama Maklad^6,7

¹Faculty of Engineering, Alexandria University, Alexandria, Egypt; ²The University of Texas at Austin, Austin, TX 78758, USA; ³Mechanical Power Department, Faculty of Engineering, Cairo University, Cairo, Egypt; ⁴Department of Mechanical Power Engineering, Menoufia University, Menoufia, Egypt; ⁵Power and Wide-Band-Gap Electronics Research Laboratory (POWERlab), EPFL, Lausanne, Switzerland; ⁶School of Engineering, University of Greenwich, London, UK; ⁷Department of Mechanical Power Engineering, Mansoura University, Mansoura, Egypt

A Comparative Study of Heat Conduction-Based Numerical Models for Vapor Chamber Thermal Analyses

Ahmet Çömez¹, Sertaç Çadırcı², Ozan Atalay¹, Ali Eray Torun¹, Caner Demir¹, Hakan Uysal¹

¹ASELSAN, UGES Sector Directorate, Ankara, Türkiye; ²Istanbul Technical University, Mechanical Engineering Department, Istanbul, Türkiye

Hot Spot Prediction of a MOSFET Chip Using Machine Learning

Alexandru-Dumitru Buburuzan¹, Georg Pelz², Andi Buzo², Valentina Davidoiu³, Marius-Ioan Purcar¹

¹Faculty of Electrical Engineering, Technical University of Cluj-Napoca, Romania; ²Infineon Technologies AG, Munich, Germany; ³Infineon Technologies, Bucharest, Romania

Efficient Electro-thermal Analysis of Power ICs Using a Hybrid Finite Element and Lumped-element Approach

Luiza Dobre¹, Adrian Bojita¹, Marius Purcar¹, Daniel Tscharnuter², Manuel Petersmann², Cristian Boianceanu³

¹Technical University of Cluj-Napoca, Romania; ²KAI Kompetenzzentrum Automobil und Industrieelectronik GMBH,Austria; ³Infineon Technologies Romania & Co, Romania

Comparative Evaluation of Taguchi, Response Surface Methodology and Full Factorial for Simulation-based Thermal–fluid Optimization of a Representative Liquid-cooled Heat Sink

Cagri Balikci, Monzer Rayya

CARIAD SE, Germany

Experimental Investigation of Metal-Foam Pore Density in a PCM-Based Passive Module for Thermal Control of Electronic Components.

Hala Salhab^1,2, Oronzio Manca^1,2, Bernardo Buonomo^1,2, Sergio Nardini^1,2

¹Department of Engineering,Università degli Studi della Campania “Luigi Vanvitelli”, Italy; ²International Centre for Sustainable Energy Resource Management (iCERM), UNICAMPANIA Division.

Sustainable Cellulose-based Thermal Interface Material for Heat Dissipation of LED

Chenming Liu

University of Oulu, Finland

Electro-thermal Modelling of 26650 Format LiFePO4 Battery Cell for Maritime Applications

Ane Sainz De La Maza^1,3, Ainhoa Odriozola¹, David Ansean², Enrique E. Valdés², Victor M. García², Elena Trancho¹, Edorta Ibarra³

¹Tecnalia, Derio; ²University of Oviedo (Uniovi); ³University of the Basque Country (UPV/EHU)

Experimental Validation of a Lumped Parameter Thermal Model for Spreading Resistance in Direct-cooled Power Electronics

Lander Lode Cnudde^1,2, Jasper Nonneman^1,2,3, Jana Rogiers^1,2, Michiel De Paepe^1,2, Michel De Paepe^1,2,4

¹Ghent University, Belgium; ²FlandersMake@UGent – Core lab MIRO, Belgium; ³University of Antwerp, Belgium; ⁴University of Cape Town, South Africa

Experimental Performance Validation Of Flow Guider Structures For Direct Cooling Of Prismatic Battery Cells

Lander Lode Cnudde^1,2, Jana Rogiers^1,2, Michiel De Paepe^1,2, Jasper Nonneman^1,2,3, Michel De Paepe^1,2,4

¹Ghent University, Belgium; ²FlandersMake@UGent – Core lab MIRO, Belgium; ³University of Antwerp, Belgium; ⁴University of Cape Town, South Africa

Numerical Investigation on Thermal Behaviour of Inclined Plate Heat Sink with Metal Foam Fins and PCM for Electronic Cooling

Aanandsundar Arumugam, Meriem Bounib, Bernardo Buonomo, Oronzio Manca, Sergio Nardini

Universita' degli Studi della Campania "Luigi Vanvitelli", Italy

Modeling Study on Thermal Runaway of Battery System

Ranim Elogb, Safouene Ouenzerfi, Mustapha Mahdaoui, Souad Harmand

Université polytechnique haut de France, France

CFD Investigation of Complete Immersion Forced Convection Cooling of a Lithium-Ion Prismatic Battery Module under Three Different Drive Cycles

Kantharuphan Annathurai, Daniel Trimble, Seamus O'Shaughnessy

Trinity College Dublin, Ireland

Thermal Investigation and Multi-objective Ranking of Sinusoidal Pin-fin Geometries for Water-blocks

Mahdi Vahidi Ferdousi^1,2, Hadrien Bauduin¹, Michael Maalouly¹, Ali Chehade¹, Houssain Al Moussawi³, Fabien Bogard², Chadi Maalouf²

¹OVHcloud, 155 Avenue Georges Hannart, 59170 Croix, France.; ²ITheMM, University of Reims Champagne-Ardenne, 51100 Reims, France; ³3 School of Engineering, Lebanese International University – LIU, Beirut, Lebanon

Thermal Investigation in Lock-in Thermography of Lateral Power GaN Transistor from the Backside Under Specific Driving Conditions

Jeremie Burky, Thomas Grzes, Hugo Kerreneur, Laurent Guillot, Frederic Tilhac

ALTER TECHNOLOGY TUV NORD FRANCE, France

A Low-thermal-Mass Direct-heating and Edge-AI-assisted Contact-thermocouple Platform for Transient Thermal Characterization of Vapor Chambers

Yuanyuan Tao, Ling Li

Durham University, United Kingdom

Modeling of Spatially Varying Thermal Contact Conductance in Bolted Electronic Package Heat Sink Joints

E Ajul^1,2, Muhammed Naseef V², Samajeet Chanda²

¹Indian Institute of Technology, Kanpur, India; ²Indian Institute of Technology, Palakkad, India

Performance Assessment of Sustainable and Energy-Efficient Indirect Evaporative Cooling System

Talha Bin Nadeem^1,2, Muhammad Imran¹, Emad Tandis¹, Simon Mwangi¹

¹Aston University, United Kingdom; ²NED University of Engineering & Technology, Pakistan

Non-destructive Defect Analysis of Through-glass Vias Using Transient Thermal Response

Byongjin Ma, Juhee Baek, Guesuk Lee, Jemin Kim

Korea Electronics Technology Institute, Korea, Republic of (South Korea)

Water-cooling Circuit Designs Comparison for Enhanced Natural Convection in Single-phase Immersion Cooling for Data Centers

Ayoub Ruichek^1,3, Michael Maalouly¹, Mohamad Hnayno¹, Ali Chehade¹, Farouk Fardoun², Tala Moussa³, Guillaume Polidori³, Chadi Maalouf³

¹OVHcloud; ²Doctoral School of Science and Technology Lebanese University; ³University of Reims Champagne-Ardenne, France

Experimental Investigation on the Effects of Square Waveform Heat Flux Boundary Conditions Applied to Annular, Intermittent and Slug Flows

Jana Rogiers^1,2, Jasper Nonnemann^1,2,3, Michel De Paepe^1,2,4

¹Ghent Universtity, Belgium; ²FlandersMake@UGent – Core lab MIRO, Leuven, Belgium; ³University of Antwerp, Belgium; ⁴University of Cape Town, Cape Town, South Africa

Bayesian Optimization of Implantable Thermoelectric Generators

Philipp Hickisch, Dennis Hohlfeld

University of Rostock, Germany

Supercritical CO2 as Working Fluid for Heat Spreader Applications in Thin Form Factor Electronics

Ankita Pujahari¹, Mark Macdonald², Sunando DasGupta¹, Anandaroop Bhattacharya¹

¹Indian Institute of Technology Kharagpur, India; ²Intel Corporation

Pulsating Heat Pipe Passive Cooling for Photovoltaic Panel Distributed Optimizers

Alex Musetti¹, Rachele Schiasselloni², Dario Javier Pavon Vargas², Roberto Menozzi¹, Giulio Lorenzini², Luca Cattani², Alessandro Soldati¹

¹Department of Engineering and Architecture, University of Parma, Italy; ²Department of Engineering for Industrial Systems and Technologies, University of Parma, Italy

Thermal Reduced-order Modelling of a SiC Power Module for Powertrain Cooling-system Design

Karnon Koné^1,2, Matthieu Fénot², Etienne Videcocq², Amal Zeaiter¹, Sulivan Küttler¹

¹Safran SA; ²Pprime Institut/ENSMA, France