Conference Agenda

Limits of Nickel Diffusion Barriers at High Operating Temperatures

Mathias Nowottnick, Andrej Novikov, Simon Purschke

University of Rostock, Germany

Smart Evaluation of Interconnect Quality Test Methods in LED Packages using Controlled Defects

Jennifer Rieder, Thomas Zahner, E Liu

ams-OSRAM international GmbH, Germany

Infrared Detection of Crack-Tip-Associated Thermal Signatures Under Cyclic Loading: From Bulk Plexiglas Specimens to Bimaterial Interfaces

Daniel May¹, Marcus Schulz², Mohamad Abo Ras², Bernhard Wunderle¹

¹University of Technology Chemnitz; ²Berliner Nanotest und Design GmbH

Controlled Excitation of a Nonlinear Resonant Cantilever System for Experimental Delamination Characterization in High-Performance Computing Packages

David Walther¹, Jörg Arnold¹, Arash Mohammadi¹, Karl Friedrich Becker², Mathias Koch², Bernhard Wunderle^1,3,4,5

¹Chemnitz University of Technology, Dept. Materials & Reliability of Microsystems, Chemnitz, Germany; ²Fraunhofer IZM, Berlin, Germany; ³Fraunhofer ENAS, Chemnitz, Germany; ⁴Centre for Micro- and Nanotechnologies (ZfM), Chemnitz, Germany; ⁵Centre for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany