Conference Agenda
| Session | ||
S 2.A: Thermo-Mechanical Reliability 1
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| Presentations | ||
Limits of Nickel Diffusion Barriers at High Operating Temperatures University of Rostock, Germany Smart Evaluation of Interconnect Quality Test Methods in LED Packages using Controlled Defects ams-OSRAM international GmbH, Germany Infrared Detection of Crack-Tip-Associated Thermal Signatures Under Cyclic Loading: From Bulk Plexiglas Specimens to Bimaterial Interfaces 1: University of Technology Chemnitz; 2: Berliner Nanotest und Design GmbH Controlled Excitation of a Nonlinear Resonant Cantilever System for Experimental Delamination Characterization in High-Performance Computing Packages 1: Chemnitz University of Technology, Dept. Materials & Reliability of Microsystems, Chemnitz, Germany; 2: Fraunhofer IZM, Berlin, Germany; 3: Fraunhofer ENAS, Chemnitz, Germany; 4: Centre for Micro- and Nanotechnologies (ZfM), Chemnitz, Germany; 5: Centre for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany | ||