Conference Agenda

Identifying Failure Root Causes at Cu-Cu Interfaces of Vias using EBAC Analysis

Lisa Mitterhuber, Verena Leitgeb, Elke Kraker

Materials Center Leoben Forschung GmbH, Austria

Stacked Si-on–GaN Architectures: Unlocking Reliability for Ultra-Compact Half-Bridge Designs

Sri Sai Chandra Abhinay Nallam¹, Benjamin Fabian¹, Eric Hofmann¹, Christoph Heldt¹, Sebastian Fritzsche¹, Patrick Heinickel¹, Nick Liu², Anu Mathew³

¹Heraeus Electronics GmbH & Co. KG; ²Nexperia B. V.; ³Chemnitz University of Technology

A Concept for In-situ Glass-transition Detection in Insulated Metal Substrates

János Hegedüs¹, Gusztáv Hantos¹, Gyula Lipák¹, David Demian², Andrea Cavallini², András Poppe¹, Ferenc Ender¹

¹Department of Electron Devices, Budapest University of Technology and Economics, Budapest, Hungary; ²Department of Electrical, Electronic, and Information Engineering, University of Bologna, Bologna, Italy

Experimental Investigation of In-situ Glass-transition Detection in Insulated Metal Substrates

Gusztáv Hantos¹, János Hegedüs¹, Gyula Lipák¹, David Demian², Andrea Cavallini², András Poppe¹, Ferenc Ender¹

¹Department of Electron Devices, Budapest University of Technology and Economics, Budapest, Hungary; ²Department of Electrical, Electronic, and Information Engineering, University of Bologna, Bologna, Italy

Two-dimensional Cryogenic Micro-raman Stress Mapping in Silicon Around Through-silicon Vias and SLID Bond Interface

Maham Ayaz^1,2, Peter Meszmer^1,2, Uwe Zschenderlein¹, Susana Richter Trummer³, Matthias Prinz³, Bernhard Wunderle^1,2,3,4,5

¹Chemnitz University of Technology, Germany; ²Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany; ³Fraunhofer ENAS, Chemnitz, Germany; ⁴Center for Micro-and Nanotechnologies (ZfM), Chemnitz, Germany; ⁵Joint Lab Berlin, Berlin-Adlershof, Germany