Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Please note that all times are shown in the time zone of the conference. The current conference time is: 18th June 2026, 11:20:38pm CEST
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Daily Overview |
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S 3.A: Thermo-Mechanical Reliability 2
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Identifying Failure Root Causes at Cu-Cu Interfaces of Vias using EBAC Analysis Materials Center Leoben Forschung GmbH, Austria Stacked Si-on–GaN Architectures: Unlocking Reliability for Ultra-Compact Half-Bridge Designs 1Heraeus Electronics GmbH & Co. KG; 2Nexperia B. V.; 3Chemnitz University of Technology A Concept for In-situ Glass-transition Detection in Insulated Metal Substrates 1Department of Electron Devices, Budapest University of Technology and Economics, Budapest, Hungary; 2Department of Electrical, Electronic, and Information Engineering, University of Bologna, Bologna, Italy Experimental Investigation of In-situ Glass-transition Detection in Insulated Metal Substrates 1Department of Electron Devices, Budapest University of Technology and Economics, Budapest, Hungary; 2Department of Electrical, Electronic, and Information Engineering, University of Bologna, Bologna, Italy Two-dimensional Cryogenic Micro-raman Stress Mapping in Silicon Around Through-silicon Vias and SLID Bond Interface 1Chemnitz University of Technology, Germany; 2Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany; 3Fraunhofer ENAS, Chemnitz, Germany; 4Center for Micro-and Nanotechnologies (ZfM), Chemnitz, Germany; 5Joint Lab Berlin, Berlin-Adlershof, Germany | |