Conference Agenda

Session

S 2.B: Thermal Simulations 1

Time:

Wednesday, 16/Sept/2026:

11:30am - 12:50pm

Presentations

Validated Parametric MOR Approach for Thermal Modelling of Semiconductor Switches

Lorenzo Codecasa¹, Samuele Foresti², Luca Raciti², Thomas Masper², Enrico Ragaini², Paolo Maffezzoni¹, Dario D'Amore¹

¹Politecnico di Milano, Italy; ²ABB S.p.A.

Deterministic, Solver-accurate Thermal and Warpage Analysis at Manufacturing Resolution for Advanced 2.5D HBM Packages

Rahima Mohammed, Hardik Kabaria, Satish Radhakrishnan, Vincent Rerolle, William Stark, Sarah Osetonski, John Bruggeman, Matteo Frigo

Vinci4d.ai, United States of America

Impact of Boundary Conditions on Topology Optimization of Fin Structures for PCM-based Battery Thermal Management

Nicola Bianco, Andrea Fragnito, Marcello Iasiello, Vittorio Orlanducci, Francesco Piccirillo

Università degli Studi di Napoli Federico II

Analytically Benchmarked Spatial and Temporal Discretization Guidelines for Finite Element Simulation of Thermal Waves

Kaushal Arun Pareek¹, Daniel May², Peter Meszmer², Bernhard Wunderle^2,3, Mohamad Abo Ras¹

¹Berliner Nanotest and Design GmbH, Germany; ²Chemnitz University of Technology, Germany; ³Fraunhofer Institute for Electronics Nano Systems, Germay