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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Daily Overview

Session

S 2.B: Thermal Simulations 1

Time:

Wednesday, 16/Sept/2026:

11:30am - 12:50pm

Location: Conference 2

Presentations

Validated Parametric MOR Approach for Thermal Modelling of Semiconductor Switches

Lorenzo Codecasa¹, Samuele Foresti², Luca Raciti², Thomas Masper², Enrico Ragaini², Paolo Maffezzoni¹, Dario D'Amore¹

1: Politecnico di Milano, Italy; 2: ABB S.p.A.

Deterministic, Solver-accurate Thermal and Warpage Analysis at Manufacturing Resolution for Advanced 2.5D HBM Packages

Rahima Mohammed, Hardik Kabaria, Satish Radhakrishnan, Vincent Rerolle, William Stark, Sarah Osetonski, John Bruggeman, Matteo Frigo, Nimish Patil, Balaji Cherukuri

Vinci4d.ai, United States of America

Impact of Boundary Conditions on Topology Optimization of Fin Structures for PCM-based Battery Thermal Management

Nicola Bianco, Andrea Fragnito, Marcello Iasiello, Vittorio Orlanducci, Francesco Piccirillo

Università degli Studi di Napoli Federico II

Analytically Benchmarked Spatial and Temporal Discretization Guidelines for Finite Element Simulation of Thermal Waves

Kaushal Arun Pareek¹, Daniel May², Peter Meszmer², Bernhard Wunderle^2,3, Mohamad Abo Ras¹

1: Berliner Nanotest and Design GmbH, Germany; 2: Chemnitz University of Technology, Germany; 3: Fraunhofer Institute for Electronics Nano Systems, Germay