Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Please note that all times are shown in the time zone of the conference. The current conference time is: 18th June 2026, 11:20:38pm CEST
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Daily Overview |
| Session | |
S 2.B: Thermal Simulations 1
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| Presentations | |
Validated Parametric MOR Approach for Thermal Modelling of Semiconductor Switches 1Politecnico di Milano, Italy; 2ABB S.p.A. Deterministic, Solver-accurate Thermal and Warpage Analysis at Manufacturing Resolution for Advanced 2.5D HBM Packages Vinci4d.ai, United States of America Impact of Boundary Conditions on Topology Optimization of Fin Structures for PCM-based Battery Thermal Management Università degli Studi di Napoli Federico II Analytically Benchmarked Spatial and Temporal Discretization Guidelines for Finite Element Simulation of Thermal Waves 1Berliner Nanotest and Design GmbH, Germany; 2Chemnitz University of Technology, Germany; 3Fraunhofer Institute for Electronics Nano Systems, Germay | |
