Conference Agenda

Design and Development of Miniaturized Thermal Test Chip for Advanced Interconnect and Packaging Technologies

Corinna Grosse-Kockert¹, Vikas Dubey², Maik Sternberg¹, Dirk Wünsch², Karla Hiller³, Sven Rzepka², Mohamad Abo Ras¹

1: Berliner Nanotest und Design GmbH, Berlin, Germany; 2: Fraunhofer Institute for Electronic Nano Systems, Chemnitz, Germany; 3: TU Chemnitz, Center for Micro and Nano Technologies, Chemnitz, Germany

Thermomechanical Analysis and Validation of an Overmoulded Package Design for Improved Thermal Interface via Selective EMC Grinding

Baris Erol¹, Mathias Koch², Marcus Voitel², Ole Hölck², Leonie Leadbetter², Karl-Friedrich Becker^2,3, Tanja Braun^2,3, Daniel May¹, Bernhard Wunderle^1,4

1: TU Chemnitz, Germany; 2: Fraunhofer IZM, Germany; 3: TU Berlin, Germany; 4: Fraunhofer ENAS, Germany

Experimental Investigation of Warpage-Induced Thermal Performance Degradation in HPC Packages Using Thermal Test Vehicles

Dave Saums¹, Dan R. Wargulski², Maik Sternberg², Mohamad Abo Ras²

1: DS&A LLC, United States of America; 2: NANOTEST, Berlin, Germany