Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Please note that all times are shown in the time zone of the conference. The current conference time is: 25th Aug 2026, 07:58:38pm CEST
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Daily Overview |
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S 1: High-Performance Computing
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Design and Development of Miniaturized Thermal Test Chip for Advanced Interconnect and Packaging Technologies 1: Berliner Nanotest und Design GmbH, Berlin, Germany; 2: Fraunhofer Institute for Electronic Nano Systems, Chemnitz, Germany; 3: TU Chemnitz, Center for Micro and Nano Technologies, Chemnitz, Germany Thermomechanical Analysis and Validation of an Overmoulded Package Design for Improved Thermal Interface via Selective EMC Grinding 1: TU Chemnitz, Germany; 2: Fraunhofer IZM, Germany; 3: TU Berlin, Germany; 4: Fraunhofer ENAS, Germany Experimental Investigation of Warpage-Induced Thermal Performance Degradation in HPC Packages Using Thermal Test Vehicles 1: DS&A LLC, United States of America; 2: NANOTEST, Berlin, Germany | ||