Transient Thermal Response in AlGaN/GaN HEMT Transistor: Influence of Dissipated Power on Thermal Time Constants

Anass Jakani¹, Jean-Claude Jacquet², Mohamed Bouslama², Benoit Lambert³, Jean-Christophe Nallatamby⁴, Raphael Sommet⁴, Gildas Gauthier²

1: Thales Research & Technology; 2: III-V Lab (Thales), France; 3: UMS - United Monolithic Semiconductors, France; 4: XLIM, France

Electrothermal Characterization and Simulation of GaAs Schottky Diodes for Terahertz (THz) Applications

N'Doua Luc Arnaud Kakou¹, Nicolas Zerounian², Frédéric Aniel², Raphael Sommet¹

1: XLIM CNRS, France; 2: C2N CNRS, France

Submicron Ultrafast Raman Thermography System for Power Semiconductor and TGV Inspection

Jung-Hoon Song^1,2, Youngboo Moon^1,3, Seungyoung Lim¹, Gyeong Eun Choi¹, Jaesun Kim¹, Byongjin Ma⁴

1: AccuOptotec Col,, Korea, Republic of (South Korea); 2: Kongju National University, Korea, Republic of (South Korea); 3: UJL Co., Korea, Republic of (South Korea); 4: 4Korea Electronics Technology Institute, Korea, Republic of (South Korea)

Novel Methods to Address the Time Dependence of Temperature Sensitive Parameters in Thermal Testing

Sándor Ress^1,2, Márta Rencz¹, Gábor Farkas², Zoltán Sárkány²

1: Budapest University of Technology and Economics, Hungary; 2: SIEMENS DI SW, Budapest, Hungary

Enhancement of Vertical Flow Boiling Performance through Port and Channel Design

Hanyang Ye, Sreeram Barathula, Teck Neng Wong, Jin Yao Ho

School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore

Experimental Comparison of Flow Boiling Instabilities in two Increasing Density Heatsink Designs

Jaume Camarasa, Montse Vilarrubí, Pol Rosell, Desideri Regany, David Beberide, Joan Ignasi Rosell, Manel Ibáñez, Jérôme Barrau

Universitat de Lleida, Spain

Thermal-hydraulic Analysis of Pressure Drop in Miniaturized Loop Heat Pipe

Kelvin Guessi Domiciano¹, Larissa Krambeck^1,2, Marco Bernagozzi³, Marcia Barbosa Henriques Mantelli¹

1: Heat Pipe Laboratory, Federal University of Santa Catarina, Florianopolis/SC, Brazil; 2: Department of Civil Engineering and Architecture, University of Pavia, Pavia, Italy; 3: Advanced Engineering Centre, University of Brighton, Brighton, United Kingdom

Review of Experiments in Microlayer Thickness during Nucleate Pool Boiling

Willem Vandenhove¹, Mitchell Whiting¹, Jasper Nonneman^1,2,3, Ivan Verhaert¹, Ilya T'Jollyn¹

1: University of Antwerp; 2: University of Ghent; 3: Flanders Make

Comparison of Radial and Axial Thermal Transport in Silicon Nanowires

Alexander Burenkov, Peter Pichler, Ferdinand Schulz

Fraunhofer IISB, Germany

Artifacts of Non-ideal Thermal Excitation in Time-constant Spectra of thin Tnterfaces: A Simulation-based Study on Dead-time Extrapolation and Excitation Shift Effects

Hannes Schwan, Maximilian Schmid, Elger Gordon

Technische Hochschule Ingolstadt, Germany

Electro-Thermal Wide Temperature Range SPICE BJTs and FETs Transistor Models Based on Si, SiGe, SiC, GaAs, GaN Semiconductor Materials

Konstantin O. Petrosyants, Mamed R. Ismail-zade, Lev M. Sambursky, Maxim V. Kozhukhov

National Research University Higher School of Economics (Moscow Institute of Electronics and Mathematics), Russian Federation

Thermal Assessment of a Smart Power Stage Through Experiments and SPICE Simulations

Giorgio Eliseo^1,2, Ciro Scognamillo¹, Antonio Pio Catalano¹, Vincenzo d'Alessandro¹, Francesco Maria De Paola², Jaume Roig³, Petr Betak³, James Victory³

1: University of Naples Federico II, Italy; 2: onsemi, Analog and Mixed-Signal Group; 3: onsemi, Power Solution Group

Flow-boiling Cooling Concept for a Small Form-factor Embedded MOSFET Half-bridge Power Module

Ralph Schacht¹, Felix Fischer², Ben Majed¹, Wiljan Vermeer², Bernhard Wunderle³, Eckart Hoene²

1: BTU Cottbus-Senftenberg, Germany; 2: Fraunhofer IZM, Germany; 3: Chemnitz University of Technology, Germany

Cooling Electronics While Generating Power: A Thermomagnetic Pulsating Heat Pipe Approach

Luca Cattani¹, Francesco Cugini², Rachele Schiasselloni¹, Dario Pavon Vargas¹, Simone Gabbi², Fabio Bozzoli³, Massimo Solzi², Giulio Lorenzini¹

1: Department of Engineering for Industrial Systems and Technologies, University of Parma, Italy; 2: Department of Mathematical, Physical and Computer Sciences, University of Parma, Italy; 3: Department of Industrial Engineering, University of Florence 50139, Florence, Italy

Evaluation of the Cooling Behaviour of Different Cooling Concepts for 2-Phase Approaches under the Influence of Mechanical Vibrations

Plamen Ernst, Fabian Rohmann

HENSOLDT Sensors GmbH, Germany