Laser Powder Bed Fusion (LPBF) of Copper-graphene Metal Matrix Composites for Enhanced Heat Transfer

Wessel W. Wits^1,2, Hyunjong Lee¹, Leonore van Goor¹, Bernard Geurts¹, Davoud Jafari¹

1: Faculty of Electrical Engineering, Mathematics and Computer Science, University of Twente, Netherlands; 2: Royal Netherlands Aerospace Centre (NLR), Marknesse, Netherlands

Lightweight Thermal Management in Electric Vehicle Body Components: Injection‑Molded Thermoplastic Sandwiches with Embedded Electronics

Peter Meszmer^1,4, Sandy Klengel², Marcus Schulz³, Steffen Müller², Mohamad Abo Ras³, Bernhard Wunderle^1,4

1: TU Chemnitz, Germany; 2: Fraunhofer Institute for Microstructure of Materials and Systems: Halle, Germany; 3: Berliner Nanotest und Design GmbH, Germany; 4: Center for Materials, Architectures and Integration of Nanomembranes, TU Chemnitz, Germany

Influence of Surface Roughness on the Thermal and Reliability Performance of Thermal Interface Materials

Aron Reinke, Antonio Harder, Santiago Campos, Teresa Bräuer, Mohamad Abo Ras, Pattric Zimon

Nanotest, Germany

CuBrick: A Novel Vertical Dielectric Immersion Cooling Approach

Johann Renner, Cuong Hoang, Till Huesgen

University of Applied Sciences Kempten, Germany

Design and Implementation of Autonomous Sensor-driven Control Framework for Benchmarking Hybrid Air-liquid Server Cooling

Eoin Oude Essink¹, Md Robiul Hossain^1,3, Ciara Ahern¹, Tim Persoons², Sajad Alimohammadi¹

1: Technological University Dublin, Ireland; 2: Trinity College Dublin, the University of Dublin, Ireland; 3: Digital Futures Research Hub, Technological University Dublin, Ireland

Optimisation of Overmolded PowerModules for EV Energy Conversion

Jérôme Hélie¹, Federicoie Ghioldi², Federico Piscaglia², Alexandre Marie³, Jean-Pierre Fradin³

1: Schaeffler, France; 2: Dept. of Aerospace Science and Technology, Politecnico di Milano, Milano, Italy; 3: ICAM school of Engineering, Toulouse, France

Development of a Test Bed to Analyse the Cooling Capability of an Air Amplifier for Data Centre Server Thermal Management

David W. Salter¹, Tim Persoons², Sajad Alimohammadi¹

1: School of Mechanical Engineering, Technological University Dublin, City Campus, Ireland; 2: Department of Mechanical, Manufacturing & Biomedical Engineering, Trinity College Dublin, Ireland

Packaging and Thermal Management Concept of Power Antenna-in-substrate (AiS) Chip-on-flex Assemblies on Curved Surfaces

Bernhard Wunderle^1,2,3,4, Jannik Haseloff⁵, Jörg Arnold¹, Jens Heilmann¹, Dragos Dancila⁶, George Konstantinidis⁷, Afshin Ziaei⁸, Mohamad Abo Ras⁵

1: TU Chemnitz, Germany; 2: Fraunhofer ENAS, Chemnitz, Germany; 3: Center for Materials, Architectures and Integration of Nanomembranes at TU Chemnitz, Germany; 4: Centre for Micro-and Nanotechnologies at TU Chemnitz, Germany; 5: Berliner Nanotest & Design GmbH, Germany; 6: Uppsala University, Sweden; 7: Foundation for Research and Technology Hellas (FORTH), Greece; 8: Thales Research and Technology, Palaiseau, France

Innovative Solution for Multiscale Warpage Measurement of Complex Integrated Packages

Pierre Everaere, Nicolas Choisel, Pierre Vernhes

INSIDIX, France

Lumped‑parameter Modelling of PCM‑integrated Heat Sinks with Experimental Validation

Michiel De Paepe^1,2, Maité Goderis^1,2, Jana Rogiers^1,2, Wito Plas^1,2, Michel De Paepe^1,2,3

1: Ghent University, Belgium; 2: FlandersMake@Ugent; 3: University of Cape Town, South Africa

Numerical Modelling of Thermocapillary Effect Driven Heat Transfer Devices

Dinuka Herath^1,2

1: Huawei Nuremberg Research Center, Germany; 2: Technical University Munich, Germany

Two-Phase Pool Boiling Immersion Cooling for Prismatic Lithium-Ion Batteries Subjected to Higher Discharge Rates

Rajesh Nimmagadda, Kantharuphan Annathurai, Daniel Trimble, Seamus M. O’Shaughnessy

Trinity College Dublin, Ireland

Electro-thermal Simulation of aSi0.33Ge0.665Sn0.005 Reconfigurable Field-effect Transistor

Duru Bozkurt¹, Andrea Malignaggi², Ignatii Zaitsev², Masiar Sistani³, Andreas Fuchsberger³, Nikolas Thomas Knaller³, Corrado Carta², Costanza Lucia Manganelli²

1: Sabanci University; 2: IHP-Leibniz Institute for High Performance Microelectronics, Germany; 3: Institute of Solid State Electronics, Technische Universit¨at Wien, Austria

Data-driven Thermal Resistance Prediction of Heat Pipes Using Artificial Neural Networks

Ahmet Koyuncu, Haluk Anıl Köse, Arda Zengin, Cankat Ayas, Efe Yorulmaz, Orkun Doğu, Vedat Yağcı

Aselsan Inc., Turkey (Türkiye)

Optimization of the Thermal Performance of Wide Band Gap Power Module through Geometrically Optimized Ceramic Heat sink (Al2O3) Manufactured by 3D-Printing (SLA-DLP Technology).

Lucie Teulet¹, Jean-Pierre Fradin², Ahmad Batikh², Alexandre Marie², Benjamin Périé², Virgile Puel², Emmanuel Marcault¹, Lucile Mage¹, Patrick Tounsi³

1: CEA, France; 2: ICAM, France; 3: LAAS-CNRS, France

Thermal Optimization of UVC LED Cooling Solutions Using a Combination of Thermal Simulations and Microthermography

Zygimantas Staliulionis, Rita Plaipaitė-Nalivaiko, Marjan Monshi

Lithuanian university of Applied Engineering Sciences, Lithuania

Parametric Model Order Reduction of an IGBT Module for System-level Electro-thermal Simulation

Shashwat Kamal Gogoi¹, Aliakbar Taghdiri^1,2, Philipp Hickisch¹, Dennis Hohlfeld¹, Tamara Bechtold^1,2

1: University of Rostock, Albert-Einstein-Str. 2, 18059 Rostock, Germany; 2: Jade University of Applied Sciences, Friedrich-Paffrath-Str. 101, 26386 Wilhelmshaven, Germany

Stainless Steel Thermosyphon and Pulsating Heat Pipe: Thermal Performance Comparison

Larissa Krambeck^1,2, Kelvin G. Domiciano¹, Maria E. Beé¹, Marco Marengo², Marcia B. H. Mantelli¹

1: Heat Pipe Laboratory, Federal University of Santa Catarina, Brazil; 2: Department of Civil Engineering and Architecture, University of Pavia, Pavia

Heat Spreading from a Small Source on a Thick Plate

Wendy Luiten

WLC, Netherlands, The

Guideline for Thermal Characterization of Multi-chip Packages - A New JEDEC Standard

Dirk Schweitzer

Infineon Technologies AG, Germany

Development of a Platform for Thermal Conductivity Measurement of Thermal Interface Materials at Cryogenic Temperatures through 3-Omega Method

Carlos Rincon-Ruiz^1,3, Nathanael Joehrmann^1,3, Corinna Grosse-Kockert⁵, Uwe Zschenderlein¹, Daniel May¹, Matthias Prinz², Bernhard Wunderle^1,2,3,4

1: Technische Universität Chemnitz, Germany; 2: Fraunhofer ENAS, Chemnitz, Germany; 3: Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN); 4: Center for Micro- and Nanotechnologies (ZfM), Chemnitz, Germany; 5: Nanotest Berlin, Germany

Structural Features and J-B-T Operating Window of Patterned Niobium Thin-Film Lines on Silicon for Cryogenic 3D Integration

Awais Qadir^1,3, Uwe Zschenderlein¹, Klaus Vogel², Christian Hofmann², Nathanael Jöhrmann^1,2, Bernhard Wunderle^1,2,3,4

1: Professorship Materials and Reliability of Microsystems, Chemnitz University of Technology, Chemnitz, Germany; 2: Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany; 3: Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology Chemnitz, Germany; 4: Micro Materials Centre Fraunhofer Institute for Electronic Nano Systems – ENAS Chemnitz, Germany