Design and Development of Miniaturized Thermal Test Chip for Advanced Interconnect and Packaging Technologies

Corinna Grosse-Kockert¹, Vikas Dubey², Maik Sternberg¹, Dirk Wünsch², Karla Hiller³, Sven Rzepka², Mohamad Abo Ras¹

1: Berliner Nanotest und Design GmbH, Berlin, Germany; 2: Fraunhofer Institute for Electronic Nano Systems, Chemnitz, Germany; 3: TU Chemnitz, Center for Micro and Nano Technologies, Chemnitz, Germany

Thermomechanical Analysis and Validation of an Overmoulded Package Design for Improved Thermal Interface via Selective EMC Grinding

Baris Erol¹, Mathias Koch², Marcus Voitel², Ole Hölck², Leonie Leadbetter², Karl-Friedrich Becker^2,3, Tanja Braun^2,3, Daniel May¹, Bernhard Wunderle^1,4

1: TU Chemnitz, Germany; 2: Fraunhofer IZM, Germany; 3: TU Berlin, Germany; 4: Fraunhofer ENAS, Germany

Experimental Investigation of Warpage-Induced Thermal Performance Degradation in HPC Packages Using Thermal Test Vehicles

Dave Saums¹, Dan R. Wargulski², Maik Sternberg², Mohamad Abo Ras²

1: DS&A LLC, United States of America; 2: NANOTEST, Berlin, Germany

Limits of Nickel Diffusion Barriers at High Operating Temperatures

Mathias Nowottnick, Andrej Novikov, Simon Purschke

University of Rostock, Germany

Smart Evaluation of Interconnect Quality Test Methods in LED Packages using Controlled Defects

Jennifer Rieder, Thomas Zahner, E Liu

ams-OSRAM international GmbH, Germany

Infrared Detection of Crack-Tip-Associated Thermal Signatures Under Cyclic Loading: From Bulk Plexiglas Specimens to Bimaterial Interfaces

Daniel May¹, Marcus Schulz², Mohamad Abo Ras², Bernhard Wunderle¹

1: University of Technology Chemnitz; 2: Berliner Nanotest und Design GmbH

Controlled Excitation of a Nonlinear Resonant Cantilever System for Experimental Delamination Characterization in High-Performance Computing Packages

David Walther¹, Jörg Arnold¹, Arash Mohammadi¹, Karl Friedrich Becker², Mathias Koch², Bernhard Wunderle^1,3,4,5

1: Chemnitz University of Technology, Dept. Materials & Reliability of Microsystems, Chemnitz, Germany; 2: Fraunhofer IZM, Berlin, Germany; 3: Fraunhofer ENAS, Chemnitz, Germany; 4: Centre for Micro- and Nanotechnologies (ZfM), Chemnitz, Germany; 5: Centre for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany

Validated Parametric MOR Approach for Thermal Modelling of Semiconductor Switches

Lorenzo Codecasa¹, Samuele Foresti², Luca Raciti², Thomas Masper², Enrico Ragaini², Paolo Maffezzoni¹, Dario D'Amore¹

1: Politecnico di Milano, Italy; 2: ABB S.p.A.

Deterministic, Solver-accurate Thermal and Warpage Analysis at Manufacturing Resolution for Advanced 2.5D HBM Packages

Rahima Mohammed, Hardik Kabaria, Satish Radhakrishnan, Vincent Rerolle, William Stark, Sarah Osetonski, John Bruggeman, Matteo Frigo, Nimish Patil, Balaji Cherukuri

Vinci4d.ai, United States of America

Impact of Boundary Conditions on Topology Optimization of Fin Structures for PCM-based Battery Thermal Management

Nicola Bianco, Andrea Fragnito, Marcello Iasiello, Vittorio Orlanducci, Francesco Piccirillo

Università degli Studi di Napoli Federico II

Analytically Benchmarked Spatial and Temporal Discretization Guidelines for Finite Element Simulation of Thermal Waves

Kaushal Arun Pareek¹, Daniel May², Peter Meszmer², Bernhard Wunderle^2,3, Mohamad Abo Ras¹

1: Berliner Nanotest and Design GmbH, Germany; 2: Chemnitz University of Technology, Germany; 3: Fraunhofer Institute for Electronics Nano Systems, Germay

Identifying Failure Root Causes at Cu-Cu Interfaces of Vias using EBAC Analysis

Lisa Mitterhuber¹, Verena Leitgeb¹, Julia Zündel², Maike Sagerer², Thomas Krivec², Elke Kraker¹

1: Materials Center Leoben Forschung GmbH, Austria; 2: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Stacked Si-on–GaN Architectures: Unlocking Reliability for Ultra-Compact Half-Bridge Designs

Sri Sai Chandra Abhinay Nallam¹, Benjamin Fabian¹, Eric Hofmann¹, Christoph Heldt¹, Sebastian Fritzsche¹, Patrick Heinickel¹, Nick Liu², Anu Mathew³

1: Heraeus Electronics GmbH & Co. KG; 2: Nexperia B. V.; 3: Chemnitz University of Technology

A Concept for In-situ Glass-transition Detection in Insulated Metal Substrates

János Hegedüs¹, Gusztáv Hantos¹, Gyula Lipák¹, David Demian², Andrea Cavallini², András Poppe¹, Ferenc Ender¹

1: Department of Electron Devices, Budapest University of Technology and Economics, Budapest, Hungary; 2: Department of Electrical, Electronic, and Information Engineering, University of Bologna, Bologna, Italy

Experimental Investigation of In-situ Glass-transition Detection in Insulated Metal Substrates

Gusztáv Hantos¹, János Hegedüs¹, Gyula Lipák¹, David Demian², Andrea Cavallini², András Poppe¹, Ferenc Ender¹

1: Department of Electron Devices, Budapest University of Technology and Economics, Budapest, Hungary; 2: Department of Electrical, Electronic, and Information Engineering, University of Bologna, Bologna, Italy

Two-dimensional Cryogenic Micro-raman Stress Mapping in Silicon Around Through-silicon Vias and SLID Bond Interface

Maham Ayaz^1,2, Peter Meszmer^1,2, Uwe Zschenderlein¹, Susana Richter Trummer³, Matthias Prinz³, Bernhard Wunderle^1,2,3,4,5

1: Chemnitz University of Technology, Germany; 2: Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany; 3: Fraunhofer ENAS, Chemnitz, Germany; 4: Center for Micro-and Nanotechnologies (ZfM), Chemnitz, Germany; 5: Joint Lab Berlin, Berlin-Adlershof, Germany

Thermo-hydraulic Performance of a Tetrahedral Lattice Core under Laminar Flow: Effects of Strut Materials and Coolant Media

Ali Riaz, Mohammadreza Kadivar, John Lohan, David Tromey, Gerard McGranaghan

Atlantic Technological University, Ireland

Enhancing Flow Redistribution in Skived Heat Sinks for High-power Density Computing: An End-to-End Case Study

Ine Vandebeek, Lieven Vervecken, Rui Vieira

MegaCool Technologies, Belgium

A Systematic Study of Graphene-enhanced Heat Sinks for Lightweight Thermal Management Applications

Markus Enmark¹, Lijie He², Muhammad Hassan², Sajjad Pashazadeh¹, Torbjörn M.J. Nilsson³, Arian Kamal⁴, Kai J. Kallio⁴, Johan Liu¹

1: Chalmers University of Technology, Sweden; 2: SHT Smart High-Tech AB, Sweden; 3: Saab AB, Sweden; 4: Volvo Car Corporation, Sweden

AI-driven, Non-parametric Geometry Optimization for Heat Sink Design

Achref Rabhi, Daniel Haase, Sivasubramani Krishnaswamy, Julio Benavides Rodriguez, Tobias Berg

Synopsys Inc.

Thermo-hydraulic Performance of Microchannel Heat Sinks with Square Pin-fin Geometries: A Numerical Investigation

Ashraf Morsi¹, Mohammed Abdel Razzaq², Youssef Khalid³, Mohamed Naser¹, Mohamed Elkholy⁴, Ibrahim Elhagali^4,5, Osama Maklad^6,7

1: Faculty of Engineering, Alexandria University, Alexandria, Egypt; 2: The University of Texas at Austin, Austin, TX 78758, USA; 3: Mechanical Power Department, Faculty of Engineering, Cairo University, Cairo, Egypt; 4: Department of Mechanical Power Engineering, Menoufia University, Menoufia, Egypt; 5: Power and Wide-Band-Gap Electronics Research Laboratory (POWERlab), EPFL, Lausanne, Switzerland; 6: School of Engineering, University of Greenwich, London, UK; 7: Department of Mechanical Power Engineering, Mansoura University, Mansoura, Egypt

A Comparative Study of Heat Conduction-Based Numerical Models for Vapor Chamber Thermal Analyses

Ahmet Çömez¹, Sertaç Çadırcı², Ozan Atalay¹, Ali Eray Torun¹, Caner Demir¹, Hakan Uysal¹

1: ASELSAN, UGES Sector Directorate, Ankara, Türkiye; 2: Istanbul Technical University, Department of Mechanical Engineering, Istanbul, Türkiye

Hot Spot Prediction of a MOSFET Chip Using Machine Learning

Alexandru-Dumitru Buburuzan¹, Georg Pelz², Andi Buzo², Roxana-Daniela Florescu³, Marius-Ioan Purcar¹, Sebastian Wittmann²

1: Faculty of Electrical Engineering, Technical University of Cluj-Napoca, Romania; 2: Infineon Technologies AG, Munich, Germany; 3: Infineon Technologies, Bucharest, Romania

Efficient Electro-thermal Analysis of Power ICs Using a Hybrid Finite Element and Lumped-element Approach

Luiza Dobre¹, Adrian Bojita¹, Marius Purcar¹, Daniel Tscharnuter², Manuel Petersmann², Cristian Boianceanu³

1: Technical University of Cluj-Napoca, Romania; 2: KAI Kompetenzzentrum Automobil und Industrieelectronik GMBH,Austria; 3: Infineon Technologies Romania & Co, Romania

Experimental Investigation of Metal-Foam Pore Density in a PCM-Based Passive Module for Thermal Control of Electronic Components.

Hala Salhab^1,2, Oronzio Manca^1,2, Bernardo Buonomo^1,2, Sergio Nardini^1,2

1: Department of Engineering,Università degli Studi della Campania “Luigi Vanvitelli”, Italy; 2: International Centre for Sustainable Energy Resource Management (iCERM), UNICAMPANIA Division.

Electro-thermal Modelling of 26650-format LiFePO4 Cell for Maritime Applications

Ane Sainz De La Maza^1,3, Ainhoa Odriozola¹, Enrique E. Valdés², Victor M. García², Elena Trancho¹, Edorta Ibarra³, David Ansean²

1: Tecnalia, Derio; 2: University of Oviedo (Uniovi); 3: University of the Basque Country (UPV/EHU)

Experimental Validation of a Lumped Parameter Thermal Model for Spreading Resistance in Direct-cooled Power Electronics

Lander Lode Cnudde^1,2, Jasper Nonneman^1,2,3, Jana Rogiers^1,2, Michiel De Paepe^1,2, Michel De Paepe^1,2,4

1: Ghent University, Belgium; 2: FlandersMake@UGent – Core lab MIRO, Belgium; 3: University of Antwerp, Belgium; 4: University of Cape Town, South Africa

Experimental Performance Validation Of Flow Guider Structures For Direct Cooling Of Prismatic Battery Cells

Lander Lode Cnudde^1,2, Jana Rogiers^1,2, Michiel De Paepe^1,2, Jasper Nonneman^1,2,3, Michel De Paepe^1,2,4

1: Ghent University, Belgium; 2: FlandersMake@UGent – Core lab MIRO, Belgium; 3: University of Antwerp, Belgium; 4: University of Cape Town, South Africa

Numerical Investigation on Thermal Behaviour of Inclined Plate Heat Sink with Metal Foam Fins and PCM for Electronic Cooling

Aanandsundar Arumugam, Meriem Bounib, Bernardo Buonomo, Oronzio Manca, Sergio Nardini

Universita' degli Studi della Campania "Luigi Vanvitelli", Italy

Modeling Study on Thermal Runaway of Battery System

Ranim Elogb, Safouene Ouenzerfi, Mustapha Mahdaoui, Souad Harmand

Université polytechnique haut de France, France

Why the Optimal Pin-Fin Geometry Depends on the Operating Point: A Separation-Based Analysis of Sinusoidal Meso-Channel Cold Plates

Mahdi Vahidi Ferdousi^1,2, Hadrien Bauduin¹, Michael Maalouly¹, Ali Chehade¹, Fabien Bogard², Chadi Maalouf²

1: OVHcloud, 155 Avenue Georges Hannart, 59170 Croix, France.; 2: ITheMM, University of Reims Champagne-Ardenne, 51100 Reims, France

Thermal Investigation in Lock-in Thermography of Lateral Power GaN Transistor from the Backside Under Specific Driving Conditions

Jeremie Burky, Thomas Grzes, Hugo Kerreneur, Laurent Guillot, Frederic Tilhac

ALTER TECHNOLOGY TUV NORD FRANCE, France

A Low-thermal-Mass Direct-heating and Edge-AI-assisted Contact-thermocouple Platform for Transient Thermal Characterization of Vapor Chambers

Yuanyuan Tao, Ling Li

Durham University, United Kingdom

Modeling of Spatially Varying Thermal Contact Conductance in Bolted Electronic Package Heat Sink Joints

E Ajul^1,2, Muhammed Naseef V², Samarjeet Chanda²

1: Indian Institute of Technology Kanpur, Kanpur, India; 2: Indian Institute of Technology Palakkad, Palakkad, India

Performance Assessment of Sustainable and Energy-Efficient Indirect Evaporative Cooling System

Talha Bin Nadeem^1,2, Muhammad Imran¹, Emad Tandis¹, Simon Mwangi¹

1: Aston University, United Kingdom; 2: NED University of Engineering & Technology, Pakistan

Non-destructive Defect Analysis of Through-glass Vias Using Transient Thermal Response

Byongjin Ma, Juhee Baek, Guesuk Lee, Jemin Kim

Korea Electronics Technology Institute, Korea, Republic of (South Korea)

Localized Upper-Zone Heat Extraction for Thermal Stratification Control in Hybrid Immersion-Cooled Servers

Ayoub Ruichek^1,3, Michael Maalouly¹, Mohamad Hnayno¹, Ali Chehade¹, Farouk Fardoun², Tala Moussa³, Guillaume Polidori³, Chadi Maalouf³

1: OVHcloud; 2: Doctoral School of Science and Technology Lebanese University; 3: University of Reims Champagne-Ardenne, France

Experimental Investigation on the Effects of Square Waveform Heat Flux Boundary Conditions Applied to Annular, Intermittent and Slug Flows

Jana Rogiers^1,2, Jasper Nonnemann^1,2,3, Ilya T'Jollyn³, Michel De Paepe^1,2,4

1: Ghent Universtity, Belgium; 2: FlandersMake@UGent – Core lab MIRO, Leuven, Belgium; 3: University of Antwerp, Belgium; 4: University of Cape Town, Cape Town, South Africa

Bayesian Optimization of Implantable Thermoelectric Generators

Philipp Hickisch, Dennis Hohlfeld

University of Rostock, Germany

Supercritical CO2 as Working Fluid for Heat Spreader Applications in Thin Form Factor Electronics

Ankita Pujahari¹, Mark Macdonald², Sunando DasGupta¹, Anandaroop Bhattacharya¹

1: Indian Institute of Technology Kharagpur, India; 2: Intel Corporation

Pulsating Heat Pipe Passive Cooling for Photovoltaic Panel Distributed Optimizers

Alex Musetti¹, Rachele Schiasselloni², Dario Javier Pavon Vargas², Roberto Menozzi¹, Giulio Lorenzini², Luca Cattani², Alessandro Soldati¹

1: Department of Engineering and Architecture, University of Parma, Italy; 2: Department of Engineering for Industrial Systems and Technologies, University of Parma, Italy

Thermal Reduced-order Modelling of a SiC Power Module for Powertrain Cooling-system Design

Karnon Koné^1,2, Matthieu Fénot², Etienne Videcocq², Amal Zeaiter¹, Sulivan Küttler¹

1: Safran SA; 2: Pprime Institut/ENSMA, France

Coupled Thermo-Mechanical Characterization of a Thermal Interface Material Gap Pad for Top-Side-Cooled Power Devices

Ismail Recepi, Faruk Kapidzic, Philip Matzick, Stefan Mollov

Silicon Austria Labs GmbH, Austria