Conference Agenda

Session Overview

Date: Tuesday, 23/Sept/2025
9:00am - 5:30pm	Short Course: Fundamentals of Thermal and Thermomechanical Modeling for Electronics Reliability Location: Aula B
11:00am - 11:30am	1st Coffee Break
1:00pm - 2:30pm	Seafront walk and Lunch
4:00pm - 4:30pm	2nd Coffee Break
5:30pm - 6:00pm	Final test (for PhD students only)

Date: Wednesday, 24/Sept/2025
8:00am - 8:50am	Desk Registration
8:50am - 9:00am	Welcome Location: Aula Magna
9:00am - 9:40am	1st Keynote: Out-of-SOA Electrothermal Limitations of Power Semiconductor Devices: Characterization and Modeling Location: Aula Magna Andrea Irace, University of Naples Federico II
9:40am - 10:00am	Vendors session Location: Aula Magna
10:00am - 10:20am	1st Coffee Break
10:20am - 11:20am	1.A: Cooling Approaches for Devices, Packages, and Systems 1 Location: Aula Magna Enhanced Heat Transfer and Flow Characteristics in a Liquid-cooled Microchannel with Adjacent Micro-Synthetic Jets: Influence of Reynolds Number and Stroke Length Delara Soltani¹, Tim Persoons², Sajad Alimohammdi¹ 1: Technological University Dublin, Ireland; 2: Trinity College Dublin, Ireland Enhancing the Controllability of Forced Convection Liquid Cooling with Minichannel Heatsinks using Pulsating Flow of Variable Frequency Galina Kennedy, Tim Persoons Trinity College Dublin, Ireland Heat Transfer Enhancement by Metamaterial Structures for Semiconductor Cooling Md Lokman Hosain¹, Orlando Girlanda¹, Saeed Maleksaeedi² 1: Hitachi Energy Research, Sweden; 2: University of Waterloo, Canada	1.B: Thermal Management of Batteries 1 Location: Aula A Air-Cooled Versus Liquid-Cooled Flat Pulsating Heat Pipes for Battery Thermal Management Hazhir Fatahi, Arthur Labalte, Anil Kumar, Amrid Amnache, Luc G Fréchette Université de Sherbrooke, QC, Canada Fluid Dynamics in Immersion Battery Cooling: Linking Coolant Vortex Structures to Thermal Gradients and Lithium-ion Cell Performance and Longevity Jibin Mathai Joy^1,2, Mattia Duranti², Edoardo Gino Macchi², Dibakar Rakshit¹ 1: Department of Energy Science and Engineering, IIT Delhi, Hauz Khas, Delhi; 2: Sustainable Energy (SE) , Fondazione Bruno Kessler, Trento, Italy Numerical and Experimental Investigation of Liquid Tab Cooling of a Prismatic Battery David W. Salter, Aidan Mullaney, Kantharuphan Annathurai, Rajesh Nimmagadda, Daniel Trimble, Seamus O'Shaughnessy Trinity College Dublin, Ireland
11:20am - 11:40am	2nd Coffee Break
11:40am - 1:00pm	2.A: Cooling Approaches for Devices, Packages, and Systems 2 Location: Aula Magna Efficient Chip-integrated Microfluidic Cooling Through Jet-enhanced Manifold Microchannels Weiyu Tang, Hongkeng Zhu, Ibrahim Osama Elhagali, Elison Matioli Power and Wide-Band-Gap Electronics Research Laboratory (POWERlab), École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland Self-Oscillating Reeds for Heat Transfer Enhancement in Fin Channels Sourabh Kumar Jha, Ari Glezer Georgia Institute of Technology, United States of America An Experimental Investigation of Guided Flow Liquid Cooling Methods on a Four Cell Prismatic Module David W. Salter, Ciaran Huckfeldt, Kantharuphan Annathurai, Rajesh Nimmagadda, Daniel Trimble, Seamus O'Shaughnessy Trinity College Dublin, Ireland Manufacturing and Design Optimisation of an Air Amplifier for Data Centre Server Cooling Applications David W. Salter^1,2, Eoin H. Oude Essink¹, Gordon O'Brien², Tim Persoons², Sajad Alimohammadi¹ 1: Technological University Dublin, Ireland; 2: Trinity College Dublin, Ireland	2.B: Thermal Management of Batteries 2 Location: Aula A A Numerical and Experimental Comparative Study on Cold Plate Cooling of a 5.6kW Tesla Battery Pack Kantharuphan Annathurai, David Salter, Rajesh Nimmagadda, Daniel Trimble, Seamus O'Shaughnessy Trinity College Dublin, Ireland Thermal Performance of a Heat Pipe with Triangular Grooves for Battery Cooling Applications in Electric Vehicles Sabrina Costa Chichinelli, Larissa Krambeck, Kelvin Guessi Domiciano, Ricardo Brandalise Botelho, Marcia Barbosa Henriques Mantelli Federal University of Santa Catarina, Brazil Temperature Estimation and Thermal Runaway Detection in a Novel Battery Module Arrangement Incorporating a Reduced Number of Sensors Ane Sainz De La Maza Escobal^1,2, Filippo Gerbino³, Davide Spaggiari³, Danilo Santoro³, Edorta Ibarra², David Ansean⁴, Elena Trancho¹, Nicola Delmonte³ 1: Tecnalia, Basque Research and Technology Alliance (BRTA), Derio, Spain; 2: University of the Basque Country (UPV/EHU), Bilbao, Spain; 3: University of Parma, Parma, Italy; 4: Department of Electrical Engineering, University of Oviedo, Gijón, Spain Thermal Management of Battery Cells in Electric Vehicles: Design and Analysis under Various C-Rates and Environmental Conditions Ali Eray Torun, Ahmet Çömez, Caner Demir, Hakan Uysal ASELSAN, Türkiye
1:00pm - 2:00pm	Lunch
2:00pm - 3:00pm	Poster Session A Location: Aula Magna Critical Analysis of Intersection-point-based Techniques for the Experimental Indirect Determination of Thermal Resistance in Bipolar Transistors Vincenzo d'Alessandro¹, Ciro Scognamillo¹, Antonio Pio Catalano¹, Lorenzo Codecasa² 1: Department of Electrical Engineering and Information Technology, University Federico II, Naples, Italy; 2: Department of Electronics, Information, and Bioengineering, Polytechnic of Milan, Milan, Italy HTRB-Based Assessment of Epoxy Mold Compounds Using a Multi-DUT Monitoring Platform Alessandro Borghese, Guglielmo Marignetti, Giuseppe Capasso, Giovanni Breglio, Luca Maresca, Michele Riccio, Andrea Irace University of Naples Federico II, Italy Temperature‐dependent equivalent circuit modeling of PiN diodes for accurate electromagnetic simulations of reconfigurable intelligent surfaces Ilaria Matacena, Vincenzo d'Alessandro University of Naples Federico II, Italy Aging Effect on Temperature Behaviour in Li-ion Battery Cell: a Case of Study Adolfo Dannier, Marino Coppola, Mattia Ribera, Diego Iannuzzi University of Napoli Federico II, Italy Improving Photovoltaic Reliability with Temperature-aware Hot-spot Mitigation Gerardo Saggese, Monica De Riso, Pierluigi Guerriero, Santolo Daliento University of Napoli Federico II, Italy Experimental Evaluation of a Passive Dual Two-Phase Cooling System for Ev Batteries Using a Dielectric Fluid and a Pulsating Heat Pipe Luca Cattani¹, Federico Sacchelli¹, Fabio Bozzoli¹, Alessandro Soldati², Alex Musetti² 1: Department of Engineering for Industrial Systems and Technologies,University of Parma, Italy; 2: Department of Engineering and Architecture, University of Parma, Italy Hysteresis Phenomenon in the Electric Parameters of Lithium-ion Batteries under Temperature Effects Simone Barcellona¹, Lorenzo Codecasa¹, Silvia Colnago², Dario D'Amore¹ 1: Politecnico di Milano, DEIB, Italy; 2: Ricerca sul Sistema Energetico, TGM, S.p.A. Development of 1D Simulation Methodology and Automation for Predicting the Cooling Performance of an Electric Vehicle Battery System Samuel Yu, Jinwon Seo, Bongkeun Choi Hyundai Mobis, Korea, Republic of (South Korea) Solder Joint Fatigue Study on Integrate Circuit Components for Telecom Products Kaixiang Yang Ericsson Sweden AB, Sweden Thermal analysis of a 5G telecom demonstrator in FO-WLP SiP with Integrated GaN Power Amplifier and GaAs Low Noise Amplifier Anass Jakani¹, Jean-Claude Jacquet¹, N'Doua Luc Arnaud Kakou², Mohamed Bouslama¹, Vincent Bortolussi³, Nicolas Sarazin⁴, Benoit Lambert³, Raphael Sommet², Stephane Piotrowicz¹, Gildas Gauthier¹ 1: III-V Lab, France; 2: XLIM, France; 3: UMS (United Monolithic Semiconductors), France; 4: TRT (Thales Research & Technology) Characterisation of Thermal Interface Materials Under Sustained Cyclic Thermo-Mechanical Loading Philip Matzick, Christian Mentin, Stefan Mollov Silicon Austria Labs, Austria Multi-scale and Multi-physics Analysis Of a GaN System in Package Using Fan Out Wafer Level Packaging (FO-WLP) Technology N’Doua Luc Arnaud Kakou¹, José Anderson Silva dos Santos¹, Raphael Sommet¹, Vincent Bortolussi², Anass Jakani³, Jean-Christophe Nallatamby¹ 1: XLIM, UMR7252, Université de Limoges, France; 2: United Monolithic Semiconductor, Villebon sur Yvette, France; 3: 3 - 5 Lab, Palaiseau, France In-chip Liquid Cooling using Directly Integrated Jet Impingement with Enhanced Pin Fins Ibrahim Osama Ibrahim Elhagali, Hongkeng Zhu, Weiyu Tang, Elison Matioli EPFL, Switzerland Improved Thermal Transient Testing of GaN Devices Manufactured with Various Construction Principles Sandor Ress^1,2, Gabor Farkas¹, Mahmoud Darwish¹, Marta Rencz², Zoltan Sarkany¹ 1: SIEMENS DISW, Hungary; 2: Budapest University of Technology and Economics, Hungary Thermal Characterization of a Novel Direct Cooler Design for Modular Power Devices Filippo Gerbino, Luca Cattani, Fabio Bozzoli, Davide Spaggiari, Paolo Cova, Roberto Menozzi University of Parma, Italy 4H-SiC Power MOSFET Body Diode as a Highly-linear Temperature Sensor for Tj Monitoring Francesco Della Corte¹, Riccardo Carotenuto², Demetrio Iero², Massimo Merenda², Giovanni Pangallo² 1: University of Napoli Federico II, Italy; 2: Mediterranea University of Reggio Calabria, Italy Thermal analysis of fast-charger contactless power transfer for electric buses Luigi Pio Di Noia, Renato Rizzo University of Napoli Federico II, Italy Prediction of Dynamic Thermal Behavior of Novel Ceramics for Power Devices Using Numerical Simulations Peter Gabor Szabo, Gyorgy Bognar, Laszlo Pohl Budapest University of Technology and Economics, Hungary Numerical Investigation on Thermal Behaviour of Horizontal Plate Heat Sink with Metal Foam Partially Embedded in PCM for Passive Cooling System Aanandsundar Arumugam, Bernardo Buonomo, Furio Cascetta, Oronzio Manca, Sergio Nardini Universita' degli Studi della Campania "Luigi Vanvitelli", Italy
3:00pm - 4:00pm	3rd Coffee Break and Poster Viewing Location: Aula Polifunzionale
4:00pm - 5:40pm	3.A: Cooling Approaches for Devices, Packages, and Systems 3 Location: Aula Magna On the Role of Turbulence and Swirl on Heat Transfer Enhancement in Developing Pipe Flow Lorenzo Testa, Tim Persoons Trinity College Dublin, Ireland Numerical Investigation of Gradient-based Alveoli Microchannel Heat Sinks Embedded with Hotspots for Electronic Cooling Applications Mahalingam Periasamy, Ganesan Narendran IIITDM Kancheepuram, India Stainless-steel Flat Plate Pulsating Heat Pipe: An Alternative for Electronic Cooling Larissa Krambeck¹, Kelvin G. Domiciano¹, Maria E. Beé¹, Marco Marengo², Marcia B. H. Mantelli¹ 1: Heat Pipe Laboratory, Federal University of Santa Catarina, Florianopolis/SC, Brazil; 2: Department of Civil Engineering and Architecture, University of Pavia, Pavia, Italy A Deep Dive into an Air Cooled Data Centre’s Mechanical Cooling System Energy Consumption Younis Osama Abdelsalam¹, Tim Persoons², Sajad Alimohammadi¹ 1: School of Mechanical & Design Engineering, College of Engineering & Built Environment, Technological University Dublin, City Campus, Dublin D01 K822, Ireland; 2: Department of Mechanical, Manufacturing & Biomedical Engineering, University of Dublin, Trinity College, Dublin D02 PN40, Ireland Testing of Two-Phase Cooling of Bipolar Plates for Fuel Cells Henk Jan van Gerner¹, Georg Mühlthaler², Marcus-Benedict Buntz³ 1: NLR - Royal Netherlands Aerospace Centre, 1059 CM Amsterdam, The Netherlands; 2: Airbus Commercial Aircraft, 22335 Hamburg, Germany; 3: Aerostack GmbH, 72581 Dettingen, Germany	3.B: Advanced packaging solutions Location: Aula A Thermal Management Investigation of a V-band GaN Amplifier Embedded into an Advanced Package Mohamed Bouslama¹, Anass Jakani¹, Jean-Claude Jacquet¹, Stéphane Piotrowicz¹, Louiza Hamidouche¹, Quentin Levesque¹, Benoit Lambert², Gildas Gauthier¹ 1: III-V Lab, France; 2: UMS S.A.S, France Thermal Contact Resistance Improvement Between Clip Attached TO- 247 Package and Heat Sink with Insertion of an Ultra-Thin Interlayer Silver Film Zsolt Toth-Pal, Hans-Peter Nee KTH Royal Institute of Technology, Sweden Laser Powder Bed Fusion of Multi-Material Heat Sink on Silicon Substrate: A Sn-Al Solution for High-power Electronic Heat Dissipation Andrea Mistrini¹, Amin Hodaei², Martina Meisnar³, Davoud Jafari², Riccardo Casati¹ 1: Politecnico di Milano; 2: University of Twente; 3: European Space Agency Pool Boiling Heat Transfer on Directly 3D-printed Metallic Micropillars on Silicon Chips Andrea Mistrini¹, Irene Marchi², Amin Hodaei³, Shirin Dehgahi³, Alekos Ioannis Garivalis², Paolo Di Marco², Riccardo Casati¹, Davoud Jafari³ 1: Politecnico di Milano, Italy; 2: University of Pisa, Italy; 3: University of Twente, The Netherlands Graphene Aerogel Enhancement for Next-Generation Ultralight Thermal Management Applications Jiho Kang¹, Viet Phuong Nguyen^2,3, Seung-Mo Lee^2,3, Duckjong Kim¹ 1: Gyeongsang National University, Korea, Republic of (South Korea); 2: Nanomechatronics, University of Science and Technology (UST); 3: Department of Nanomechanics, Korea Institute of Machinery & Materials (KIMM)
7:00pm - 9:00pm	Welcome Cocktail at Circolo Canottieri

Date: Thursday, 25/Sept/2025
9:00am - 9:40am	2nd Keynote: From Thermal Resistance to Power Efficient Thermal Design: Is Thermal still the Cinderella of Semiconductor Industry? Location: Aula Magna Claudio Maria Villa, STMicroelectronics
9:40am - 10:00am	1st Coffee Break
10:00am - 11:20am	4.A: Advanced Thermal Measurement Techniques 1 Location: Aula Magna Monitoring Electrothermal-Induced Package Strain During HTRB Using Fiber Optic Sensors Alessandro Borghese, Vincenzo Romano Marrazzo, Francesco Fienga, Michele Riccio, Luca Maresca, Giovanni Breglio, Andrea Irace University of Naples Federico II, Italy Thermal‑Resistance‑Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load‑Cycling Maik Sternberg¹, Dan R. Wargulski¹, Daniel May^1,2, Kaushal Arun Pareek¹, Bernhard Wunderle^2,3, Mohamad Abo Ras¹ 1: Berliner Nanotest und Design GmbH, Germany; 2: Chemnitz University of Technology, Germany; 3: Fraunhofer ENAS, Germany Impact of Adiabatic and Condenser Lengths on the Thermal Performance of Flat Pulsating Heat Pipes Anil Kumar, Arthur Labalte, Hazhir Fatahi, Amrid Amnache, Luc G. Frechette University of Sherbrooke, Canada Optimal Sensor Placement for Thermal Virtual Sensing in Electronic Systems Using Augmented Kalman Filtering Matteo Depaola^1,2,3, Daniel De Gregoriis², Robin Bornoff⁴, Bart Vandevelde¹, David Moens^3,5 1: Imec; 2: Siemens Industry Software NV; 3: KU Leuven; 4: Siemens Industry Software; 5: Flanders Make	4.B: Advances in Thermal Modeling and Simulation 1 Location: Aula A Circuit-based Thermal Modeling of Phase Change Materials for Fast Dynamic Simulations Francesco Piccirillo¹, Antonio Pio Catalano², Ciro Scognamillo², Marcello Iasiello¹, Nicola Bianco¹, Vincenzo d'Alessandro² 1: Department of Industrial Engineering, University of Naples Federico II, Italy; 2: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy Heat Transfer Performance Modelling for Liquid Cooling of High-Power Electronics Wendy Luiten WLC, Netherlands, The VOLTERRA: An Innovative Approach for Accurate Nonlinear Thermal Modeling of Electronic Components Giorgio Eliseo¹, Ciro Scognamillo¹, Antonio Pio Catalano¹, Vincenzo d'Alessandro¹, Lorenzo Codecasa² 1: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2: Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy Bayesian Parameter Estimation and Uncertainty Quantification for 1D Low-element Thermal Networks Christian Findenig¹, Lisa Mitterhuber¹, Julien Magnien¹, Robert Peharz², Manfred Mücke¹ 1: Materials Center Leoben Forschung GmbH, Austria; 2: Graz University of Technology, Austria
11:20am - 11:40am	2nd Coffee Break
11:40am - 1:00pm	5.A: Advanced Thermal Measurement Techniques 2 Location: Aula Magna Experimental Comparison of Variable Density Heatsinks Under Flow Boiling Conditions Jaume Camarasa, Montse Vilarrubí, Desideri Regany, David Beberide, Pol Rosell, Joan Ignasi Rosell, Manel Ibáñez, Jérôme Barrau Universitat de Lleida, Spain Experimental Evaluation of Different Cold Plates Configurations for Direct-to-chip Liquid Cooling David Beberide^1,2, Montse Vilarrubí^1,2, Jaume Camarasa², David Sancho¹, Desideri Regany², Jérôme Barrau^1,2 1: Universal Smart Cooling SL, Spain; 2: Universitat de Lleida, Spain Experimental Comparative Analysis of PCB Cooling Technologies Including Nonlinear Thermal Effects Denis Musella², Elena Mengotti¹, Enea Bianda¹, Hemant Bishnoi¹, Ciro Scognamillo², Vincenzo d'Alessandro², Antonio Pio Catalano² 1: ABB Corporate Research Center, Switzerland; 2: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy High-Resolution Thermal Analysis of Interface and Microstructure Formation in SAC-Cu Solder Joints Lisa Mitterhuber, Verena Leitgeb, Elke Kraker, Julien Magnien Materials Center Leoben Forschung GmbH, Austria	5.B: Advances in Thermal Modeling and Simulation 2 Location: Aula A Thermohydraulic Lumped Parameter Models for Direct Battery Cooling Lander Cnudde^1,2, Jana Rogiers^1,2, Jasper Nonneman^1,2, Michel De Paepe^1,2,3 1: Ghent University, Ghent, Belgium; 2: FlandersMake@UGent - Core lab MIRO, Leuven, Belgium; 3: University of Cape Town, Cape Town, South Africa Electro-thermal Analysis of p-GaN Gate e-mode HEMTs with Ohmic and Schottky Gates Minji Kim, Jiun Oh, Joon Seop Kwak Korea Institute of Energy Technology, Korea, Republic of (South Korea) Numerical Study of Transient Heat Transport in 4H-SiC Triggered by UV Laser Pulses Janusz Wozny, Andrzej Kubiak, Alessandro Verdolotti, Ewa Raj Lodz University of Technology, Poland SPICE Modeling of GaN HEMTs in the Wide Temperature Range (-269°C…+500°C) Konstantin O. Petrosyants, Mamed R. Ismail-zade, Lev M. Sambursky National Research University Higher School of Economics (Moscow Institute of Electronics and Mathematics), Russian Federation
1:00pm - 2:00pm	Lunch
2:00pm - 3:00pm	Poster Session B Location: Aula Magna Numerical Investigation of the Thermal Behavior of 3-D GaN LEDs for Thermal-Aware Design Ciro Scognamillo¹, Antonio Pio Catalano¹, Janusz Wozny², Ewa Raj², Vincenzo d'Alessandro¹ 1: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2: Department of Semiconductor and Optoelectronics Devices, Lodz University of Technology, Politechniki 10, 93-590 Lodz, Poland Failure Analysis for Electronic Packaging Materials: A Comparative Study of Pulsed and Lock-In Thermography Yanan Wu^1,2, Kaushal Arun Pareek², Daniel May¹, Marek Zajaczkowski², Corinna Grosse-Kockert², Mohamad Abo Ras², Bernhard Wunderle^1,3 1: Technische Universität Chemnitz, Germany; 2: Berliner Nanotest und Design GmbH; 3: Fraunhofer ENAS SPICE-based Switching Energies Estimation of SiC Power Transistors Paweł Górecki, Krzysztof Górecki Gdynia Maritime University, Poland Investigation of the Compact Thermal Modeling of SiC-based Power MOSFETs Antonio Pio Catalano¹, Gianpaolo Romano², Michele Riccio¹, Andrea Irace¹, Lorenzo Codecasa³, Vincenzo d'Alessandro¹ 1: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2: StarPower Europe AG, Baden, Switzerland; 3: Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy 3D Modelling of Mass and Heat Transport in Multi-Phase Microfluidic Systems Zsombor Szomor¹, Tamás Pardy², Péter Fürjes¹ 1: Centre for Energy Research, Hungary; 2: Tallinn University of Technology A Time-Efficient Approach to Thermal-electrical Analysis of Six-pack IGBT-based Power Module Debora Crimi, Edoardo Marchica, Emanuela Privitera Nexperia B.V. Reduced BJT Power Dissipation via Saturated Operation in Full Wave Rectifiers Riccardo Carotenuto¹, Demetrio Iero¹, Massimo Merenda¹, Francesco G. Della Corte² 1: Mediterranea University of Reggio Calabria; 2: University of Napoli Federico II, Italy Peltier Cooling for Thermal Management and Efficiency Enhancement in Perovskite Solar Cells Hichem Bencherif¹, Ziyad Younsi¹, Francesco Della Corte² 1: Higher National School of Renewable Energies, Environment and Sustainable Development, Campus Fesdis, Batna 05078, Algeria; 2: Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy Thermal Performance of Server Voltage Regulator Modules in Liquid and Air-cooling System Donata Gualandris, Andrea Garuffo STMicroelectronics, Italy Thermal Characterization of Heat Pipe Embedded Heat Spreaders for High Performance Computer Cooling in Automotives Baris Erol¹, Daniel May¹, Bernhard Wunderle^1,2 1: Chemnitz University of Technology, Germany; 2: Fraunhofer ENAS Thermal Characterisation of Packaging Materials at Cryogenic Temperatures by the Three-Omega Method Carlos Rincon-Ruiz¹, Nathanael Jöhrmann¹, Uwe Zschenderlein¹, Corinna Grosse-Kockert⁵, Bernhard Wunderle^1,2,3,4 1: Technische Universität Chemnitz, Germany; 2: Fraunhofer ENAS, Chemnitz, Germany; 3: Center for Micro- and Nanotechnologies (ZfM), Chemnitz, Germany; 4: Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany; 5: Nanotest Berlin, Germany Fast Extraction of Thermal System Model for a Silicon Carbide Power Module Based on a 1D and 3D Hybrid Simulation Framework Zhaozan Feng, Jianfeng Li, Jinzhou Cao, Guomeng Song, Yangju Zou, Yu Qi Zhuzhou CRRC Times Electric UK Innovation Center, United Kingdom Effect of the Condenser on the Thermal Performance of a Mini Loop Heat Pipe Kelvin Guessi Domiciano, Larissa Krambeck, Maria Eduarda Beé, Marcia Barbosa Henriques Mantelli Federal University of Santa Catarina, Brazil An Advanced High Temperature Device Heating Methodology for Automotive Grade Zero Conditions Heinrich Helldorff¹, Michael Glavanovics¹, Bernd Deutschmann², Alexander Ulbing¹, Gerhard Glatte¹ 1: KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Austria; 2: Graz University of Technology Optimizing Boosting for Faster Calorimetric Measurement of High-Efficiency Electric Machines Jasper Nonneman^1,2, Ilya T'Jollyn³, Jeroen De Kooning^1,2, Michel De Paepe^1,2,4 1: Ghent University, Ghent, Belgium; 2: FlandersMake@UGent - Core lab MIRO, Leuven, Belgium; 3: University of Antwerp, Antwerp, Belgium; 4: University of Cape Town, Cape Town, Sout Africa Verification of Thermal Transient Measurement Methods for Cascode Type SiC JFETs Wasanthamala Badalawa, Yoshitaka Aoki, Tomoaki Hara SIEMENS, Japan Numerical Thermal Analysis of Liquid-Cooled Electric Motors for High-Performance Applications Ozan Atalay, Ahmet Comez, Ali Eray Torun, Caner Demir ASELSAN, Turkiye Fast Approach with Analytical Models for Heat Sink Modelling and Optimization Dinuka Herath^1,2, Ibrahim Harbi², Aleksei Maksimov², Thiwanka Wijekoon² 1: Technical University Munich; 2: Huawei Technologies Duesseldorf GmbH Cooling Strategies for PCB-Mounted MOSFETs: Comparative Analysis and Numerical Simulations Monzer Rayya, Cagri Balikci CARIAD SE, Germany
3:00pm - 4:00pm	3rd Coffee Break and Poster Viewing Location: Aula Polifunzionale
4:00pm - 5:00pm	6.A: Advanced Thermal Measurement Techniques 3 Location: Aula Magna Experimental Investigation of Flow Boiling Heat Transfer Under Periodically Varying Heat Loads Jana Rogiers¹, Jasper Nonnemann^1,2, Hendrik Vansompel^1,2, Michel De Paepe^1,2,3 1: Ghent Universtity, Ghent, Belgium; 2: FlandersMake@UGent – Core lab MIRO, Leuven, Belgium; 3: University of Cape Town, Cape Town, South Africa Development and Integration of Phase Change Materials to Limit Operating Temperatures Mathias Nowottnick, Andrej Novikov, Leander Lorenz University of Rostock, Germany An Approach to Thermoelectric Module Selection: Analytical Simulation and Experimental Test Fabio Capolupo^1,2, Pesapane Mara¹, Marilena Musto^1,2, Russo Roberto² 1: Industrial Engineering Department, University of Napoli “Federico II”, Piazzale Vincenzo Tecchio, 80, Napoli, 80125, Italy; 2: Institute of Applied Sciences and Intelligent Systems, National Research Council of Italy, Via Pietro Castellino 111, Napoli, 80131, Italy	6.B: Advanced Thermal Measurement Techniques 3 Location: Aula A Numerical Investigation on Full Immersion Forced Convection Cooling of 8-Cell Lithium-Ion Prismatic Battery Pack Rajesh Nimmagadda, Joshua Burns, David W.Salter, Kantharuphan Annathurai, Daniel Trimble, Seamus M. O’Shaughnessy Department of Mechanical, Manufacturing & Biomedical Engineering, Trinity College Dublin, Ireland FEM-Assisted Design and Characterization of a New Lithium Battery Pack-Heatsink Assembly Nicola Delmonte¹, Danilo Santoro¹, Davide Spaggiari¹, Filippo Gerbino¹, Paolo Cova¹, Ane Sainz De La Maza^2,3, Edorta Ibarra², Elena Trancho³, Roberto Menozzi¹ 1: University of Parma, Department of Engineering and Architecture, Italy; 2: University of the Basque Country, Department of Electronic Technology, Spain; 3: Tecnalia, Basque Research and Technology Alliance (BRTA), Spain Investigation and Compact Modeling of Self-heating in Buried Gate Carbon Nanotube Field-effect Transistors Deepak Kumar, Michael Schröter Technische Universität Dresden, Germany
5:00pm - 6:00pm	Steering Commitee Meeting Aula B Location: Aula B
7:20pm - 7:30pm	Appointment to get the BUS
8:00pm - 11:00pm	Gala Dinner at Villa Doria d'Angri

Date: Friday, 26/Sept/2025
9:00am - 9:40am	3rd Keynote: Towards Intelligent Power Electronics Location: Aula Magna Jochen Koszescha , Infineon Technologies, AG
9:40am - 10:00am	1st Coffee Break
10:00am - 11:20am	7.A: Thermal Management in Power Electronics 1 Location: Aula Magna Electrothermal Performance Enhancement of Silicon Carbide Gate-All-Around MOSFETs Using a Ferroelectric Gate Stack Vincenzo Terracciano¹, Alessandro Borghese¹, Marco Boccarossa¹, Andrea Irace¹, Giovanni Salvatore², Luca Maresca¹ 1: University of Naples Federico II, Italy; 2: Ca’ Foscari University of Venice, Italy Dielectric Liquid Cooling of 2.0 kV SiC MOSFET Power Module Using Jet Impingement and Pumped Immersion Flow Till Huesgen, Johann Renner, Balasubramanian Vaidyanathan, Vladimir Polezhaev Hochschule Kempten - University of Applied Sciences, Germany A comparative analysis of the thermal performance of DBC and novel IMS substrates of IGBT devices János Hegedüs¹, Péter G. Szabó¹, László Pohl¹, Gusztáv Hantos¹, Gyula Lipák¹, Andrea Reolon², András Poppe¹, Ferenc Ender¹ 1: Budapest University of Technology and Economics, Hungary; 2: Serigroup, Italy Multi-physics Simulations for IGBT Power Electronics Module Cooling Péter Pálovics¹, Eeli Kerttula², Atte Hoffrén², Joonas Leppänen², Ferenc Ender¹ 1: Budapest University of Technology and Economics, Budapest, Hungary; 2: ABB Oy, Motion, Technology Collaboration Office, Helsinki, Finland	7.B: Advances in Thermal Modeling and Simulation 4 Location: Aula A Integrated Modelling Framework for 3D IC Package Thermal Design Sudarshan Deo¹, Andras Vass-Varnai¹, Peter Szabo² 1: Siemens EDA, United States of America; 2: Budapest University of Technology and Economics Simplified Thermal Transient Testing: Unlocking Affordable, Open-source Solutions Nils Jonas Ziegeler^1,2, Stefan Schweizer^1,3 1: South Westphalia University of Applied Science; 2: Forvia SE; 3: Fraunhofer Application Center for Inorganic Phosphors Comparative Analysis of TPMS Structures for Optimized CPU/GPU Thermal Management Using Generative Design Ine Vandebeek, Lieven Vervecken Diabatix, Belgium Influence of Heat Source Dimensions and Heat Transfer Coefficient Value on Temperature of Electronic Circuits Cooled by Free Convection Marcin Janicki Lodz University of Technology, Poland
11:20am - 11:40am	2nd Coffee Break
11:40am - 1:00pm	8: Thermal Management in Power Electronics 2 Location: Aula Magna Study Of Breakdown Mechanisms In GaN/AlGaN HEMTs Under Various Short Circuit Tests Using p-GaN Schottky Gate Current As Thermal Sensitive Parameter Christale Crouard^1,2, Mickael Rouch¹, Jonathan Godillon¹, Julio Brandelero¹, Patrick Tounsi² 1: STMicroelectronics, France; 2: LAAS-CNRS, France Toward Real-Time Junction Temperature Estimation with a Physics-Informed Attention LSTM Alessandro Varaldi¹, Maurizio Tranchero², Lorenzo Giraudi², Claudio Genta², Marco Vacca¹ 1: Politecnico di Torino, Italy; 2: Ideas & Motion K-factor Calibration Issues of IGBTs Gusztáv Hantos, János Hegedüs, Gyula Lipák, András Poppe, Ferenc Ender Budapest University of Technology and Economics, Hungary Development of a Surrogate Model for a Phase Change Material Heat Sink for Thermal Buffering of Power Electronics Maité Goderis^1,2, Jana Rogiers^1,2, Michiel De Paepe¹, Wito Plas^1,2, Hendrik Vansompel^1,2, Michel De Paepe^1,2,3 1: Ghent University, Department of Electromechanical, Systems and Metal Engineering, Sint-Pietersnieuwstraat 41, Ghent, 9000, Belgium; 2: FlandersMake@UGent – Core lab MIRO, Ghent, 9000, Belgium; 3: University of Cape Town, Department of Mechanical Engineering, Private Bag X3, Rondebosch 7701, South Africa
1:00pm - 2:00pm	Lunch
2:00pm - 3:20pm	9: Thermal Investigation of LEDs and Solar Cells Location: Aula Magna Reliability of High-Power LEDs Under Varying Thermal Aging Conditions Andreas Zippelius, Elias Hufnagel, Zubair Mohd, Maximilian Schmid, Gordon Elger Technische Hochschule Ingolstadt, Germany Extrinsic Failure of High-power Blue LEDs for Horticulture Applications Stressed in Hot Environments Alessandro Caria, Riccardo Fraccaroli, Giulia Pierobon, Thomas Castellaro, Ambrogio Huang, Carlo De Santi, Matteo Buffolo, Nicola Trivellin, Enrico Zanoni, Gaudenzio Meneghesso, Matteo Meneghini University of Padova, Italy Thermal aspects of infrared LED sources interfering with military night vision systems János Hegedüs, Gusztáv Hantos, András Poppe Budapest University of Technology and Economics, Hungary Electro-thermal Circuit Models of PhotoVoltaic Cells Subjected to Optical Degradation Phenomena Marco Balato¹, Martina Botti^2,3, Antonio Pio Catalano¹, Luigi Costanzo², Vincenzo d'Alessandro¹, Athanasios G. Papathanasiou⁴, Carlo Petrarca¹, Ciro Scognamillo¹, Luigi Verolino¹, Massimo Vitelli² 1: University of Naples Federico II, Italy; 2: University of Campania "Luigi Vanvitelli"; 3: University of Salerno; 4: National Technical University of Athens
3:20pm - 3:40pm	3rd Coffee Break
3:40pm - 4:20pm	Awards & Closing Remarks