Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Please note that all times are shown in the time zone of the conference. The current conference time is: 2nd Dec 2025, 09:54:33am CET
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Session Overview |
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7.B: Advances in Thermal Modeling and Simulation 4
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Integrated Modelling Framework for 3D IC Package Thermal Design 1Siemens EDA, United States of America; 2Budapest University of Technology and Economics Simplified Thermal Transient Testing: Unlocking Affordable, Open-source Solutions 1South Westphalia University of Applied Science; 2Forvia SE; 3Fraunhofer Application Center for Inorganic Phosphors Comparative Analysis of TPMS Structures for Optimized CPU/GPU Thermal Management Using Generative Design Diabatix, Belgium Influence of Heat Source Dimensions and Heat Transfer Coefficient Value on Temperature of Electronic Circuits Cooled by Free Convection Lodz University of Technology, Poland | ||