Conference Agenda
| Session | ||
Poster Session B
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| Presentations | ||
Numerical Investigation of the Thermal Behavior of 3-D GaN LEDs for Thermal-Aware Design 1Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2Department of Semiconductor and Optoelectronics Devices, Lodz University of Technology, Politechniki 10, 93-590 Lodz, Poland Failure Analysis for Electronic Packaging Materials: A Comparative Study of Pulsed and Lock-In Thermography 1Technische Universität Chemnitz, Germany; 2Berliner Nanotest und Design GmbH; 3Fraunhofer ENAS SPICE-based Switching Energies Estimation of SiC Power Transistors Gdynia Maritime University, Poland Investigation of the Compact Thermal Modeling of SiC-based Power MOSFETs 1Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2StarPower Europe AG, Baden, Switzerland; 3Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy 3D Modelling of Mass and Heat Transport in Multi-Phase Microfluidic Systems 1Centre for Energy Research, Hungary; 2Tallinn University of Technology A Time-Efficient Approach to Thermal-electrical Analysis of Six-pack IGBT-based Power Module Nexperia B.V. Reduced BJT Power Dissipation via Saturated Operation in Full Wave Rectifiers 1Mediterranea University of Reggio Calabria; 2University of Napoli Federico II, Italy Peltier Cooling for Thermal Management and Efficiency Enhancement in Perovskite Solar Cells 1Higher National School of Renewable Energies, Environment and Sustainable Development, Campus Fesdis, Batna 05078, Algeria; 2Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy Thermal Performance of Server Voltage Regulator Modules in Liquid and Air-cooling System STMicroelectronics, Italy Thermal Characterization of Heat Pipe Embedded Heat Spreaders for High Performance Computer Cooling in Automotives 1Chemnitz University of Technology, Germany; 2Fraunhofer ENAS Thermal Characterisation of Packaging Materials at Cryogenic Temperatures by the Three-Omega Method 1Technische Universität Chemnitz, Germany; 2Fraunhofer ENAS, Chemnitz, Germany; 3Center for Micro- and Nanotechnologies (ZfM), Chemnitz, Germany; 4Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany; 5Nanotest Berlin, Germany Fast Extraction of Thermal System Model for a Silicon Carbide Power Module Based on a 1D and 3D Hybrid Simulation Framework Zhuzhou CRRC Times Electric UK Innovation Center, United Kingdom Effect of the Condenser on the Thermal Performance of a Mini Loop Heat Pipe Federal University of Santa Catarina, Brazil An Advanced High Temperature Device Heating Methodology for Automotive Grade Zero Conditions 1KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Austria; 2Graz University of Technology Optimizing Boosting for Faster Calorimetric Measurement of High-Efficiency Electric Machines 1Ghent University, Ghent, Belgium; 2FlandersMake@UGent - Core lab MIRO, Leuven, Belgium; 3University of Antwerp, Antwerp, Belgium; 4University of Cape Town, Cape Town, Sout Africa Verification of Thermal Transient Measurement Methods for Cascode Type SiC JFETs SIEMENS, Japan Numerical Thermal Analysis of Liquid-Cooled Electric Motors for High-Performance Applications ASELSAN, Turkiye Fast Approach with Analytical Models for Heat Sink Modelling and Optimization 1Technical University Munich; 2Huawei Technologies Duesseldorf GmbH Cooling Strategies for PCB-Mounted MOSFETs: Comparative Analysis and Numerical Simulations CARIAD SE, Germany | ||