Numerical Investigation of the Thermal Behavior of 3-D GaN LEDs for Thermal-Aware Design
Ciro Scognamillo1, Antonio Pio Catalano1, Janusz Wozny2, Ewa Raj2, Vincenzo d'Alessandro1
1Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2Department of Semiconductor and Optoelectronics Devices, Lodz University of Technology, Politechniki 10, 93-590 Lodz, Poland
Failure Analysis for Electronic Packaging Materials: A Comparative Study of Pulsed and Lock-In Thermography
Yanan Wu1,2, Kaushal Arun Pareek2, Daniel May1, Marek Zajaczkowski2, Corinna Grosse-Kockert2, Mohamad Abo Ras2, Bernhard Wunderle1,3
1Technische Universität Chemnitz, Germany; 2Berliner Nanotest und Design GmbH; 3Fraunhofer ENAS
SPICE-based Switching Energies Estimation of SiC Power Transistors
Paweł Górecki, Krzysztof Górecki
Gdynia Maritime University, Poland
Investigation of the Compact Thermal Modeling of SiC-based Power MOSFETs
Antonio Pio Catalano1, Gianpaolo Romano2, Michele Riccio1, Andrea Irace1, Lorenzo Codecasa3, Vincenzo d'Alessandro1
1Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2StarPower Europe AG, Baden, Switzerland; 3Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy
3D Modelling of Mass and Heat Transport in Multi-Phase Microfluidic Systems
Zsombor Szomor1, Tamás Pardy2, Péter Fürjes1
1Centre for Energy Research, Hungary; 2Tallinn University of Technology
A Time-Efficient Approach to Thermal-electrical Analysis of Six-pack IGBT-based Power Module
Debora Crimi, Edoardo Marchica, Emanuela Privitera
Nexperia B.V.
Reduced BJT Power Dissipation via Saturated Operation in Full Wave Rectifiers
Riccardo Carotenuto1, Demetrio Iero1, Massimo Merenda1, Francesco G. Della Corte2
1Mediterranea University of Reggio Calabria; 2University of Napoli Federico II, Italy
Peltier Cooling for Thermal Management and Efficiency Enhancement in Perovskite Solar Cells
Hichem Bencherif1, Ziyad Younsi1, Francesco Della Corte2
1Higher National School of Renewable Energies, Environment and Sustainable Development, Campus Fesdis, Batna 05078, Algeria; 2Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy
Thermal Performance of Server Voltage Regulator Modules in Liquid and Air-cooling System
Donata Gualandris, Andrea Garuffo
STMicroelectronics, Italy
Thermal Characterization of Heat Pipe Embedded Heat Spreaders for High Performance Computer Cooling in Automotives
Baris Erol1, Daniel May1, Bernhard Wunderle1,2
1Chemnitz University of Technology, Germany; 2Fraunhofer ENAS
Thermal Characterisation of Packaging Materials at Cryogenic Temperatures by the Three-Omega Method
Carlos Rincon-Ruiz1, Nathanael Jöhrmann1, Uwe Zschenderlein1, Corinna Grosse-Kockert5, Bernhard Wunderle1,2,3,4
1Technische Universität Chemnitz, Germany; 2Fraunhofer ENAS, Chemnitz, Germany; 3Center for Micro- and Nanotechnologies (ZfM), Chemnitz, Germany; 4Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany; 5Nanotest Berlin, Germany
Fast Extraction of Thermal System Model for a Silicon Carbide Power Module Based on a 1D and 3D Hybrid Simulation Framework
Zhaozan Feng, Jianfeng Li, Jinzhou Cao, Guomeng Song, Yangju Zou, Yu Qi
Zhuzhou CRRC Times Electric UK Innovation Center, United Kingdom
Effect of the Condenser on the Thermal Performance of a Mini Loop Heat Pipe
Kelvin Guessi Domiciano, Larissa Krambeck, Maria Eduarda Beé, Marcia Barbosa Henriques Mantelli
Federal University of Santa Catarina, Brazil
An Advanced High Temperature Device Heating Methodology for Automotive Grade Zero Conditions
Heinrich Helldorff1, Michael Glavanovics1, Bernd Deutschmann2, Alexander Ulbing1, Gerhard Glatte1
1KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Austria; 2Graz University of Technology
Optimizing Boosting for Faster Calorimetric Measurement of High-Efficiency Electric Machines
Jasper Nonneman1,2, Ilya T'Jollyn3, Jeroen De Kooning1,2, Michel De Paepe1,2,4
1Ghent University, Ghent, Belgium; 2FlandersMake@UGent - Core lab MIRO, Leuven, Belgium; 3University of Antwerp, Antwerp, Belgium; 4University of Cape Town, Cape Town, Sout Africa
Verification of Thermal Transient Measurement Methods for Cascode Type SiC JFETs
Wasanthamala Badalawa, Yoshitaka Aoki, Tomoaki Hara
SIEMENS, Japan
Numerical Thermal Analysis of Liquid-Cooled Electric Motors for High-Performance Applications
Ozan Atalay, Ahmet Comez, Ali Eray Torun, Caner Demir
ASELSAN, Turkiye
Fast Approach with Analytical Models for Heat Sink Modelling and Optimization
Dinuka Herath1,2, Ibrahim Harbi2, Aleksei Maksimov2, Thiwanka Wijekoon2
1Technical University Munich; 2Huawei Technologies Duesseldorf GmbH
Cooling Strategies for PCB-Mounted MOSFETs: Comparative Analysis and Numerical Simulations
Monzer Rayya, Cagri Balikci
CARIAD SE, Germany
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