Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Please note that all times are shown in the time zone of the conference. The current conference time is: 18th Aug 2025, 05:16:31pm CEST

 
 
Session Overview
Session
Poster Session B
Time:
Thursday, 25/Sept/2025:
2:00pm - 3:00pm

Location: Aula Magna


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Presentations

Numerical Investigation of the Thermal Behavior of 3-D GaN LEDs for Thermal-Aware Design

Ciro Scognamillo1, Antonio Pio Catalano1, Janusz Wozny2, Ewa Raj2, Vincenzo d'Alessandro1

1Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2Department of Semiconductor and Optoelectronics Devices, Lodz University of Technology, Politechniki 10, 93-590 Lodz, Poland



Failure Analysis for Electronic Packaging Materials: A Comparative Study of Pulsed and Lock-In Thermography

Yanan Wu1,2, Kaushal Arun Pareek2, Daniel May1, Marek Zajaczkowski2, Corinna Grosse-Kockert2, Mohamad Abo Ras2, Bernhard Wunderle1,3

1Technische Universität Chemnitz, Germany; 2Berliner Nanotest und Design GmbH; 3Fraunhofer ENAS



SPICE-based Switching Energies Estimation of SiC Power Transistors

Paweł Górecki, Krzysztof Górecki

Gdynia Maritime University, Poland



Investigation of the Compact Thermal Modeling of SiC-based Power MOSFETs

Antonio Pio Catalano1, Gianpaolo Romano2, Michele Riccio1, Andrea Irace1, Lorenzo Codecasa3, Vincenzo d'Alessandro1

1Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2StarPower Europe AG, Baden, Switzerland; 3Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy



3D Modelling of Mass and Heat Transport in Multi-Phase Microfluidic Systems

Zsombor Szomor1, Tamás Pardy2, Péter Fürjes1

1Centre for Energy Research, Hungary; 2Tallinn University of Technology



A Time-Efficient Approach to Thermal-electrical Analysis of Six-pack IGBT-based Power Module

Debora Crimi, Edoardo Marchica, Emanuela Privitera

Nexperia B.V.



Reduced BJT Power Dissipation via Saturated Operation in Full Wave Rectifiers

Riccardo Carotenuto1, Demetrio Iero1, Massimo Merenda1, Francesco G. Della Corte2

1Mediterranea University of Reggio Calabria; 2University of Napoli Federico II, Italy



Peltier Cooling for Thermal Management and Efficiency Enhancement in Perovskite Solar Cells

Hichem Bencherif1, Ziyad Younsi1, Francesco Della Corte2

1Higher National School of Renewable Energies, Environment and Sustainable Development, Campus Fesdis, Batna 05078, Algeria; 2Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy



Thermal Performance of Server Voltage Regulator Modules in Liquid and Air-cooling System

Donata Gualandris, Andrea Garuffo

STMicroelectronics, Italy



Thermal Characterization of Heat Pipe Embedded Heat Spreaders for High Performance Computer Cooling in Automotives

Baris Erol1, Daniel May1, Bernhard Wunderle1,2

1Chemnitz University of Technology, Germany; 2Fraunhofer ENAS



Thermal Characterisation of Packaging Materials at Cryogenic Temperatures by the Three-Omega Method

Carlos Rincon-Ruiz1, Nathanael Jöhrmann1, Uwe Zschenderlein1, Corinna Grosse-Kockert5, Bernhard Wunderle1,2,3,4

1Technische Universität Chemnitz, Germany; 2Fraunhofer ENAS, Chemnitz, Germany; 3Center for Micro- and Nanotechnologies (ZfM), Chemnitz, Germany; 4Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany; 5Nanotest Berlin, Germany



Fast Extraction of Thermal System Model for a Silicon Carbide Power Module Based on a 1D and 3D Hybrid Simulation Framework

Zhaozan Feng, Jianfeng Li, Jinzhou Cao, Guomeng Song, Yangju Zou, Yu Qi

Zhuzhou CRRC Times Electric UK Innovation Center, United Kingdom



Effect of the Condenser on the Thermal Performance of a Mini Loop Heat Pipe

Kelvin Guessi Domiciano, Larissa Krambeck, Maria Eduarda Beé, Marcia Barbosa Henriques Mantelli

Federal University of Santa Catarina, Brazil



An Advanced High Temperature Device Heating Methodology for Automotive Grade Zero Conditions

Heinrich Helldorff1, Michael Glavanovics1, Bernd Deutschmann2, Alexander Ulbing1, Gerhard Glatte1

1KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Austria; 2Graz University of Technology



Optimizing Boosting for Faster Calorimetric Measurement of High-Efficiency Electric Machines

Jasper Nonneman1,2, Ilya T'Jollyn3, Jeroen De Kooning1,2, Michel De Paepe1,2,4

1Ghent University, Ghent, Belgium; 2FlandersMake@UGent - Core lab MIRO, Leuven, Belgium; 3University of Antwerp, Antwerp, Belgium; 4University of Cape Town, Cape Town, Sout Africa



Verification of Thermal Transient Measurement Methods for Cascode Type SiC JFETs

Wasanthamala Badalawa, Yoshitaka Aoki, Tomoaki Hara

SIEMENS, Japan



Numerical Thermal Analysis of Liquid-Cooled Electric Motors for High-Performance Applications

Ozan Atalay, Ahmet Comez, Ali Eray Torun, Caner Demir

ASELSAN, Turkiye



Fast Approach with Analytical Models for Heat Sink Modelling and Optimization

Dinuka Herath1,2, Ibrahim Harbi2, Aleksei Maksimov2, Thiwanka Wijekoon2

1Technical University Munich; 2Huawei Technologies Duesseldorf GmbH



Cooling Strategies for PCB-Mounted MOSFETs: Comparative Analysis and Numerical Simulations

Monzer Rayya, Cagri Balikci

CARIAD SE, Germany