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5.A: Advanced Thermal Measurement Techniques 2
Time:
Thursday, 25/Sept/2025:
11:40am - 1:00pm
Session Chair: Claudio Maria Villa , ST Microelectronics
Location: Aula Magna
Presentations
Experimental Evaluation of Different Cold Plates Configurations for Direct-to-chip Liquid Cooling
David Beberide 1,2 , Montse Vilarrubí1,2 , Jaume Camarasa2 , David Sancho1 , Desideri Regany2 , Jérôme Barrau1,2
1 Universal Smart Cooling SL, Spain; 2 Universitat de Lleida, Spain
Experimental Comparative Analysis of PCB Cooling Technologies Including Nonlinear Thermal Effects
Denis Musella 2 , Elena Mengotti1 , Enea Bianda1 , Hemant Bishnoi1 , Ciro Scognamillo2 , Vincenzo d'Alessandro2 , Antonio Pio Catalano2
1 ABB Corporate Research Center, Switzerland; 2 Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy
High-Resolution Thermal Analysis of Interface and Microstructure Formation in SAC-Cu Solder Joints
Lisa Mitterhuber , Verena Leitgeb, Elke Kraker, Julien Magnien
Materials Center Leoben Forschung GmbH, Austria
Stainless-steel Flat Plate Pulsating Heat Pipe: An Alternative for Electronic Cooling
Larissa Krambeck 1 , Kelvin G. Domiciano1 , Maria E. Beé1 , Marco Marengo2 , Marcia B. H. Mantelli1
1 Heat Pipe Laboratory, Federal University of Santa Catarina, Florianopolis/SC, Brazil; 2 Department of Civil Engineering and Architecture, University of Pavia, Pavia, Italy