Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Please note that all times are shown in the time zone of the conference. The current conference time is: 2nd Dec 2025, 09:54:00am CET
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Session Overview |
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5.A: Advanced Thermal Measurement Techniques 2
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Experimental Evaluation of Different Cold Plates Configurations for Direct-to-chip Liquid Cooling 1Universal Smart Cooling SL, Spain; 2Universitat de Lleida, Spain Experimental Comparative Analysis of PCB Cooling Technologies Including Nonlinear Thermal Effects 1ABB Corporate Research Center, Switzerland; 2Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy High-Resolution Thermal Analysis of Interface and Microstructure Formation in SAC-Cu Solder Joints Materials Center Leoben Forschung GmbH, Austria Stainless-steel Flat Plate Pulsating Heat Pipe: An Alternative for Electronic Cooling 1Heat Pipe Laboratory, Federal University of Santa Catarina, Florianopolis/SC, Brazil; 2Department of Civil Engineering and Architecture, University of Pavia, Pavia, Italy | ||