Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Please note that all times are shown in the time zone of the conference. The current conference time is: 18th Aug 2025, 05:23:56pm CEST

 
 
Session Overview
Session
5.A: Advanced Thermal Measurement Techniques 2
Time:
Thursday, 25/Sept/2025:
11:40am - 1:00pm

Location: Aula Magna


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Presentations

Experimental Comparison of Variable Density Heatsinks Under Flow Boiling Conditions

Jaume Camarasa, Montse Vilarrubí, Desideri Regany, David Beberide, Pol Rosell, Joan Ignasi Rosell, Manel Ibáñez, Jérôme Barrau

Universitat de Lleida, Spain



Experimental Evaluation of Different Cold Plates Configurations for Direct-to-chip Liquid Cooling

David Beberide1,2, Montse Vilarrubí1,2, Jaume Camarasa2, David Sancho1, Desideri Regany2, Jérôme Barrau1,2

1Universal Smart Cooling SL, Spain; 2Universitat de Lleida, Spain



Experimental Comparative Analysis of PCB Cooling Technologies Including Nonlinear Thermal Effects

Denis Musella2, Elena Mengotti1, Enea Bianda1, Hemant Bishnoi1, Ciro Scognamillo2, Vincenzo d'Alessandro2, Antonio Pio Catalano2

1ABB Corporate Research Center, Switzerland; 2Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy



High-Resolution Thermal Analysis of Interface and Microstructure Formation in SAC-Cu Solder Joints

Lisa Mitterhuber, Verena Leitgeb, Elke Kraker, Julien Magnien

Materials Center Leoben Forschung GmbH, Austria