Conference Agenda

Session

4.A: Advanced Thermal Measurement Techniques 1

Time:

Thursday, 25/Sept/2025:

10:00am - 11:20am

Session Chair: András Poppe, Budapest University of Technology and Economics

Location: Aula Magna

Presentations

Monitoring Electrothermal-Induced Package Strain During HTRB Using Fiber Optic Sensors

Alessandro Borghese, Vincenzo Romano Marrazzo, Francesco Fienga, Michele Riccio, Luca Maresca, Giovanni Breglio, Andrea Irace

University of Naples Federico II, Italy

Thermal‑Resistance‑Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load‑Cycling

Maik Sternberg¹, Daniel May², Dan R. Wargulski¹, Kaushal Arun Pareek¹, Bernhard Wunderle^2,3, Mohamad Abo Ras¹

¹Berliner Nanotest und Design GmbH, Germany; ²Chemnitz University of Technology, Germany; ³Fraunhofer ENAS, Germany

Optimal Sensor Placement for Thermal Virtual Sensing in Electronic Systems Using Augmented Kalman Filtering

Matteo Depaola^1,2,3, Daniel De Gregoriis², Robin Bornoff⁴, Bart Vandevelde¹, David Moens^3,5

¹Imec; ²Siemens Industry Software NV; ³KU Leuven; ⁴Siemens Industry Software; ⁵Flanders Make

Experimental Comparison of Variable Density Heatsinks Under Flow Boiling Conditions

Jaume Camarasa, Montse Vilarrubí, Desideri Regany, David Beberide, Pol Rosell, Joan Ignasi Rosell, Manel Ibáñez, Jérôme Barrau

Universitat de Lleida, Spain