Conference Agenda

Monitoring Electrothermal-Induced Package Strain During HTRB Using Fiber Optic Sensors

Alessandro Borghese, Vincenzo Romano Marrazzo, Francesco Fienga, Michele Riccio, Luca Maresca, Giovanni Breglio, Andrea Irace

University of Naples Federico II, Italy

Thermal‑Resistance‑Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load‑Cycling

Maik Sternberg¹, Dan R. Wargulski¹, Daniel May^1,2, Kaushal Arun Pareek¹, Bernhard Wunderle^2,3, Mohamad Abo Ras¹

¹Berliner Nanotest und Design GmbH, Germany; ²Chemnitz University of Technology, Germany; ³Fraunhofer ENAS, Germany

Impact of Adiabatic and Condenser Lengths on the Thermal Performance of Flat Pulsating Heat Pipes

Anil Kumar, Arthur Labalte, Hazhir Fatahi, Amrid Amnache, Luc G. Frechette

University of Sherbrooke, Canada

Optimal Sensor Placement for Thermal Virtual Sensing in Electronic Systems Using Augmented Kalman Filtering

Matteo Depaola^1,2,3, Daniel De Gregoriis², Robin Bornoff⁴, Bart Vandevelde¹, David Moens^3,5

¹Imec; ²Siemens Industry Software NV; ³KU Leuven; ⁴Siemens Industry Software; ⁵Flanders Make