Monitoring Electrothermal-Induced Package Strain During HTRB Using Fiber Optic Sensors
Alessandro Borghese, Vincenzo Romano Marrazzo, Francesco Fienga, Michele Riccio, Luca Maresca, Giovanni Breglio, Andrea Irace
University of Naples Federico II, Italy
Thermal‑Resistance‑Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load‑Cycling
Maik Sternberg1, Dan R. Wargulski1, Daniel May1,2, Kaushal Arun Pareek1, Bernhard Wunderle2,3, Mohamad Abo Ras1
1Berliner Nanotest und Design GmbH, Germany; 2Chemnitz University of Technology, Germany; 3Fraunhofer ENAS, Germany
Impact of Adiabatic and Condenser Lengths on the Thermal Performance of Flat Pulsating Heat Pipes
Anil Kumar, Arthur Labalte, Hazhir Fatahi, Amrid Amnache, Luc G. Frechette
University of Sherbrooke, Canada
Optimal Sensor Placement for Thermal Virtual Sensing in Electronic Systems Using Augmented Kalman Filtering
Matteo Depaola1,2,3, Daniel De Gregoriis2, Robin Bornoff4, Bart Vandevelde1, David Moens3,5
1Imec; 2Siemens Industry Software NV; 3KU Leuven; 4Siemens Industry Software; 5Flanders Make
|
