Conference Agenda

Critical Analysis of Intersection-point-based Techniques for the Experimental Indirect Determination of Thermal Resistance in Bipolar Transistors

Vincenzo d'Alessandro¹, Ciro Scognamillo¹, Antonio Pio Catalano¹, Lorenzo Codecasa²

¹Department of Electrical Engineering and Information Technology, University Federico II, Naples, Italy; ²Department of Electronics, Information, and Bioengineering, Polytechnic of Milan, Milan, Italy

HTRB-Based Assessment of Epoxy Mold Compounds Using a Multi-DUT Monitoring Platform

Alessandro Borghese, Guglielmo Marignetti, Giuseppe Capasso, Giovanni Breglio, Luca Maresca, Michele Riccio, Andrea Irace

University of Naples Federico II, Italy

Temperature‐dependent equivalent circuit modeling of PiN diodes for accurate electromagnetic simulations of reconfigurable intelligent surfaces

Ilaria Matacena, Vincenzo d'Alessandro

University of Naples Federico II, Italy

Aging Effect on Temperature Behaviour in Li-ion Battery Cell: a Case of Study

Adolfo Dannier, Marino Coppola, Mattia Ribera, Diego Iannuzzi

University of Napoli Federico II, Italy

Improving Photovoltaic Reliability with Temperature-aware Hot-spot Mitigation

Gerardo Saggese, Monica De Riso, Pierluigi Guerriero, Santolo Daliento

University of Napoli Federico II, Italy

Experimental Evaluation of a Passive Dual Two-Phase Cooling System for Ev Batteries Using a Dielectric Fluid and a Pulsating Heat Pipe

Luca Cattani¹, Federico Sacchelli¹, Fabio Bozzoli¹, Alessandro Soldati², Alex Musetti²

¹Department of Engineering for Industrial Systems and Technologies,University of Parma, Italy; ²Department of Engineering and Architecture, University of Parma, Italy

Hysteresis Phenomenon in the Electric Parameters of Lithium-ion Batteries under Temperature Effects

Simone Barcellona¹, Lorenzo Codecasa¹, Silvia Colnago², Dario D'Amore¹

¹Politecnico di Milano, DEIB, Italy; ²Ricerca sul Sistema Energetico, TGM, S.p.A.

Development of 1D Simulation Methodology and Automation for Predicting the Cooling Performance of an Electric Vehicle Battery System

Samuel Yu, Jinwon Seo, Bongkeun Choi

Hyundai Mobis, Korea, Republic of (South Korea)

Solder Joint Fatigue Study on Integrate Circuit Components for Telecom Products

Kaixiang Yang

Ericsson Sweden AB, Sweden

Thermal analysis of a 5G telecom demonstrator in FO-WLP SiP with Integrated GaN Power Amplifier and GaAs Low Noise Amplifier

Anass Jakani¹, Jean-Claude Jacquet¹, N'Doua Luc Arnaud Kakou², Mohamed Bouslama¹, Vincent Bortolussi³, Nicolas Sarazin⁴, Benoit Lambert³, Raphael Sommet², Stephane Piotrowicz¹, Gildas Gauthier¹

¹III-V Lab, France; ²XLIM, France; ³UMS (United Monolithic Semiconductors), France; ⁴TRT (Thales Research & Technology)

Characterisation of Thermal Interface Materials Under Sustained Cyclic Thermo-Mechanical Loading

Philip Matzick, Christian Mentin, Stefan Mollov

Silicon Austria Labs, Austria

Multi-scale and Multi-physics Analysis Of a GaN System in Package Using Fan Out Wafer Level Packaging (FO-WLP) Technology

N’Doua Luc Arnaud Kakou¹, José Anderson Silva dos Santos¹, Raphael Sommet¹, Vincent Bortolussi², Anass Jakani³, Jean-Christophe Nallatamby¹

¹XLIM, UMR7252, Université de Limoges, France; ²United Monolithic Semiconductor, Villebon sur Yvette, France; ³3 - 5 Lab, Palaiseau, France

In-chip Liquid Cooling using Directly Integrated Jet Impingement with Enhanced Pin Fins

Ibrahim Osama Ibrahim Elhagali, Hongkeng Zhu, Weiyu Tang, Elison Matioli

EPFL, Switzerland

Improved Thermal Transient Testing of GaN Devices Manufactured with Various Construction Principles

Sandor Ress^1,2, Gabor Farkas¹, Mahmoud Darwish¹, Marta Rencz², Zoltan Sarkany¹

¹SIEMENS DISW, Hungary; ²Budapest University of Technology and Economics, Hungary

Thermal Characterization of a Novel Direct Cooler Design for Modular Power Devices

Filippo Gerbino, Luca Cattani, Fabio Bozzoli, Davide Spaggiari, Paolo Cova, Roberto Menozzi

University of Parma, Italy

4H-SiC Power MOSFET Body Diode as a Highly-linear Temperature Sensor for Tj Monitoring

Francesco Della Corte¹, Riccardo Carotenuto², Demetrio Iero², Massimo Merenda², Giovanni Pangallo²

¹University of Napoli Federico II, Italy; ²Mediterranea University of Reggio Calabria, Italy

Thermal analysis of fast-charger contactless power transfer for electric buses

Luigi Pio Di Noia, Renato Rizzo

University of Napoli Federico II, Italy

Prediction of Dynamic Thermal Behavior of Novel Ceramics for Power Devices Using Numerical Simulations

Peter Gabor Szabo, Gyorgy Bognar, Laszlo Pohl

Budapest University of Technology and Economics, Hungary

Numerical Investigation on Thermal Behaviour of Horizontal Plate Heat Sink with Metal Foam Partially Embedded in PCM for Passive Cooling System

Aanandsundar Arumugam, Bernardo Buonomo, Furio Cascetta, Oronzio Manca, Sergio Nardini

Universita' degli Studi della Campania "Luigi Vanvitelli", Italy