Critical Analysis of Intersection-point-based Techniques for the Experimental Indirect Determination of Thermal Resistance in Bipolar Transistors
Vincenzo d'Alessandro1, Ciro Scognamillo1, Antonio Pio Catalano1, Lorenzo Codecasa2
1Department of Electrical Engineering and Information Technology, University Federico II, Naples, Italy; 2Department of Electronics, Information, and Bioengineering, Polytechnic of Milan, Milan, Italy
HTRB-Based Assessment of Epoxy Mold Compounds Using a Multi-DUT Monitoring Platform
Alessandro Borghese, Guglielmo Marignetti, Giuseppe Capasso, Giovanni Breglio, Luca Maresca, Michele Riccio, Andrea Irace
University of Naples Federico II, Italy
Temperature‐dependent equivalent circuit modeling of PiN diodes for accurate electromagnetic simulations of reconfigurable intelligent surfaces
Ilaria Matacena, Vincenzo d'Alessandro
University of Naples Federico II, Italy
Aging Effect on Temperature Behaviour in Li-ion Battery Cell: a Case of Study
Adolfo Dannier, Marino Coppola, Mattia Ribera, Diego Iannuzzi
University of Napoli Federico II, Italy
Improving Photovoltaic Reliability with Temperature-aware Hot-spot Mitigation
Gerardo Saggese, Monica De Riso, Pierluigi Guerriero, Santolo Daliento
University of Napoli Federico II, Italy
Experimental Evaluation of a Passive Dual Two-Phase Cooling System for Ev Batteries Using a Dielectric Fluid and a Pulsating Heat Pipe
Luca Cattani1, Federico Sacchelli1, Fabio Bozzoli1, Alessandro Soldati2, Alex Musetti2
1Department of Engineering for Industrial Systems and Technologies,University of Parma, Italy; 2Department of Engineering and Architecture, University of Parma, Italy
Hysteresis Phenomenon in the Electric Parameters of Lithium-ion Batteries under Temperature Effects
Simone Barcellona1, Lorenzo Codecasa1, Silvia Colnago2, Dario D'Amore1
1Politecnico di Milano, DEIB, Italy; 2Ricerca sul Sistema Energetico, TGM, S.p.A.
Development of 1D Simulation Methodology and Automation for Predicting the Cooling Performance of an Electric Vehicle Battery System
Samuel Yu, Jinwon Seo, Bongkeun Choi
Hyundai Mobis, Korea, Republic of (South Korea)
Solder Joint Fatigue Study on Integrate Circuit Components for Telecom Products
Kaixiang Yang
Ericsson Sweden AB, Sweden
Thermal analysis of a 5G telecom demonstrator in FO-WLP SiP with Integrated GaN Power Amplifier and GaAs Low Noise Amplifier
Anass Jakani1, Jean-Claude Jacquet1, N'Doua Luc Arnaud Kakou2, Mohamed Bouslama1, Vincent Bortolussi3, Nicolas Sarazin4, Benoit Lambert3, Raphael Sommet2, Stephane Piotrowicz1, Gildas Gauthier1
1III-V Lab, France; 2XLIM, France; 3UMS (United Monolithic Semiconductors), France; 4TRT (Thales Research & Technology)
Characterisation of Thermal Interface Materials Under Sustained Cyclic Thermo-Mechanical Loading
Philip Matzick, Christian Mentin, Stefan Mollov
Silicon Austria Labs, Austria
Multi-scale and Multi-physics Analysis Of a GaN System in Package Using Fan Out Wafer Level Packaging (FO-WLP) Technology
N’Doua Luc Arnaud Kakou1, José Anderson Silva dos Santos1, Raphael Sommet1, Vincent Bortolussi2, Anass Jakani3, Jean-Christophe Nallatamby1
1XLIM, UMR7252, Université de Limoges, France; 2United Monolithic Semiconductor, Villebon sur Yvette, France; 33 - 5 Lab, Palaiseau, France
In-chip Liquid Cooling using Directly Integrated Jet Impingement with Enhanced Pin Fins
Ibrahim Osama Ibrahim Elhagali, Hongkeng Zhu, Weiyu Tang, Elison Matioli
EPFL, Switzerland
Improved Thermal Transient Testing of GaN Devices Manufactured with Various Construction Principles
Sandor Ress1,2, Gabor Farkas1, Mahmoud Darwish1, Marta Rencz2, Zoltan Sarkany1
1SIEMENS DISW, Hungary; 2Budapest University of Technology and Economics, Hungary
Thermal Characterization of a Novel Direct Cooler Design for Modular Power Devices
Filippo Gerbino, Luca Cattani, Fabio Bozzoli, Davide Spaggiari, Paolo Cova, Roberto Menozzi
University of Parma, Italy
4H-SiC Power MOSFET Body Diode as a Highly-linear Temperature Sensor for Tj Monitoring
Francesco Della Corte1, Riccardo Carotenuto2, Demetrio Iero2, Massimo Merenda2, Giovanni Pangallo2
1University of Napoli Federico II, Italy; 2Mediterranea University of Reggio Calabria, Italy
Thermal analysis of fast-charger contactless power transfer for electric buses
Luigi Pio Di Noia, Renato Rizzo
University of Napoli Federico II, Italy
Prediction of Dynamic Thermal Behavior of Novel Ceramics for Power Devices Using Numerical Simulations
Peter Gabor Szabo, Gyorgy Bognar, Laszlo Pohl
Budapest University of Technology and Economics, Hungary
Numerical Investigation on Thermal Behaviour of Horizontal Plate Heat Sink with Metal Foam Partially Embedded in PCM for Passive Cooling System
Aanandsundar Arumugam, Bernardo Buonomo, Furio Cascetta, Oronzio Manca, Sergio Nardini
Universita' degli Studi della Campania "Luigi Vanvitelli", Italy
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