Conference Agenda

Session

2.A: Cooling Approaches for Devices, Packages, and Systems 2

Time:

Wednesday, 24/Sept/2025:

11:40am - 1:00pm

Session Chair: Lorenzo Codecasa, Politecnico di Milano

Location: Aula Magna

Presentations

Impact of Adiabatic and Condenser Lengths on the Thermal Performance of Flat Pulsating Heat Pipes

Anil Kumar, Arthur Labalte, Hazhir Fatahi, Amrid Amnache, Luc G. Frechette

University of Sherbrooke, Canada

Efficient Chip-integrated Microfluidic Cooling Through Jet-enhanced Manifold Microchannels

Weiyu Tang, Hongkeng Zhu, Ibrahim Osama Elhagali, Elison Matioli

Power and Wide-Band-Gap Electronics Research Laboratory (POWERlab), École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland

An Experimental Investigation of Guided Flow Liquid Cooling Methods on a Four Cell Prismatic Module

David W. Salter, Ciaran Huckfeldt, Kantharuphan Annathurai, Rajesh Nimmagadda, Daniel Trimble, Seamus O'Shaughnessy

Trinity College Dublin, Ireland

Manufacturing and Design Optimisation of an Air Amplifier for Data Centre Server Cooling Applications

David W. Salter^1,2, Eoin H. Oude Essink¹, Gordon O'Brien², Tim Persoons², Sajad Alimohammadi¹

¹Technological University Dublin, Ireland; ²Trinity College Dublin, Ireland