Conference Agenda

Session

2.A: Cooling Approaches for Devices, Packages, and Systems 2

Time:

Wednesday, 24/Sept/2025:

11:40am - 1:00pm

Location: Aula Magna

Presentations

Efficient Chip-integrated Microfluidic Cooling Through Jet-enhanced Manifold Microchannels

Weiyu Tang, Hongkeng Zhu, Ibrahim Osama Elhagali, Elison Matioli

Power and Wide-Band-Gap Electronics Research Laboratory (POWERlab), École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland

Self-Oscillating Reeds for Heat Transfer Enhancement in Fin Channels

Sourabh Kumar Jha, Ari Glezer

Georgia Institute of Technology, United States of America

An Experimental Investigation of Guided Flow Liquid Cooling Methods on a Four Cell Prismatic Module

David W. Salter, Ciaran Huckfeldt, Kantharuphan Annathurai, Rajesh Nimmagadda, Daniel Trimble, Seamus O'Shaughnessy

Trinity College Dublin, Ireland

Manufacturing and Design Optimisation of an Air Amplifier for Data Centre Server Cooling Applications

David W. Salter^1,2, Eoin H. Oude Essink¹, Gordon O'Brien², Tim Persoons², Sajad Alimohammadi¹

¹Technological University Dublin, Ireland; ²Trinity College Dublin, Ireland