Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
Authors
 
Session Overview
Session
2.A: Cooling Approaches for Devices, Packages, and Systems 2
Time:
Wednesday, 24/Sept/2025:
11:40am - 1:00pm

 Location: Aula Magna

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Presentations

Efficient Chip-integrated Microfluidic Cooling Through Jet-enhanced Manifold Microchannels

Weiyu Tang, Hongkeng Zhu, Ibrahim Osama Elhagali, Elison Matioli

Power and Wide-Band-Gap Electronics Research Laboratory (POWERlab), École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland


Self-Oscillating Reeds for Heat Transfer Enhancement in Fin Channels

Sourabh Kumar Jha, Ari Glezer

Georgia Institute of Technology, United States of America


An Experimental Investigation of Guided Flow Liquid Cooling Methods on a Four Cell Prismatic Module

David W. Salter, Ciaran Huckfeldt, Kantharuphan Annathurai, Rajesh Nimmagadda, Daniel Trimble, Seamus O'Shaughnessy

Trinity College Dublin, Ireland


Manufacturing and Design Optimisation of an Air Amplifier for Data Centre Server Cooling Applications

David W. Salter1,2, Eoin H. Oude Essink1, Gordon O'Brien2, Tim Persoons2, Sajad Alimohammadi1

1Technological University Dublin, Ireland; 2Trinity College Dublin, Ireland