Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Session
2.A: Cooling Approaches for Devices, Packages, and Systems 2
Time:
Wednesday, 24/Sept/2025:
11:40am - 1:00pm

Session Chair: Lorenzo Codecasa, Politecnico di Milano
 Location: Aula Magna

Show help for 'Increase or decrease the abstract text size'
Presentations

Impact of Adiabatic and Condenser Lengths on the Thermal Performance of Flat Pulsating Heat Pipes

Anil Kumar, Arthur Labalte, Hazhir Fatahi, Amrid Amnache, Luc G. Frechette

University of Sherbrooke, Canada


Efficient Chip-integrated Microfluidic Cooling Through Jet-enhanced Manifold Microchannels

Weiyu Tang, Hongkeng Zhu, Ibrahim Osama Elhagali, Elison Matioli

Power and Wide-Band-Gap Electronics Research Laboratory (POWERlab), École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland


An Experimental Investigation of Guided Flow Liquid Cooling Methods on a Four Cell Prismatic Module

David W. Salter, Ciaran Huckfeldt, Kantharuphan Annathurai, Rajesh Nimmagadda, Daniel Trimble, Seamus O'Shaughnessy

Trinity College Dublin, Ireland


Manufacturing and Design Optimisation of an Air Amplifier for Data Centre Server Cooling Applications

David W. Salter1,2, Eoin H. Oude Essink1, Gordon O'Brien2, Tim Persoons2, Sajad Alimohammadi1

1Technological University Dublin, Ireland; 2Trinity College Dublin, Ireland