Conference Time: 18th Aug 2025, 05:18:46pm CEST
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2.A: Cooling Approaches for Devices, Packages, and Systems 2
Time:
Wednesday, 24/Sept/2025:
11:40am - 1:00pm
Location: Aula Magna
Presentations
Efficient Chip-integrated Microfluidic Cooling Through Jet-enhanced Manifold Microchannels
Weiyu Tang , Hongkeng Zhu, Ibrahim Osama Elhagali, Elison Matioli
Power and Wide-Band-Gap Electronics Research Laboratory (POWERlab), École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland
Self-Oscillating Reeds for Heat Transfer Enhancement in Fin Channels
Sourabh Kumar Jha, Ari Glezer
Georgia Institute of Technology, United States of America
An Experimental Investigation of Guided Flow Liquid Cooling Methods on a Four Cell Prismatic Module
David W. Salter , Ciaran Huckfeldt, Kantharuphan Annathurai, Rajesh Nimmagadda, Daniel Trimble, Seamus O'Shaughnessy
Trinity College Dublin, Ireland
Manufacturing and Design Optimisation of an Air Amplifier for Data Centre Server Cooling Applications
David W. Salter 1,2 , Eoin H. Oude Essink1 , Gordon O'Brien2 , Tim Persoons2 , Sajad Alimohammadi1
1 Technological University Dublin, Ireland; 2 Trinity College Dublin, Ireland
