Thermal Management Investigation of a V-band GaN Amplifier Embedded into an Advanced Package

Mohamed Bouslama¹, Anass Jakani¹, Jean-Claude Jacquet¹, Stéphane Piotrowicz¹, Louiza Hamidouche¹, Quentin Levesque¹, Benoit Lambert², Gildas Gauthier¹

¹III-V Lab, France; ²UMS S.A.S, France

Thermal Contact Resistance Improvement Between Clip Attached TO-247 Package and Heat Sink with Insertion of an Ultra-Thin Interlayer Silver Film

Zsolt Toth-Pal, Hans-Peter Nee

KTH Royal Institute of Technology, Sweden

Laser Powder Bed Fusion of Multi-Material Heat Sink on Silicon Substrate: A Sn-Al Solution for High-power Electronic Heat Dissipation

Andrea Mistrini¹, Amin Hodaei², Martina Meisnar³, Davoud Jafari², Riccardo Casati¹

¹Politecnico di Milano; ²University of Twente; ³European Space Agency

Pool Boiling Heat Transfer on Directly 3D-printed Metallic Micropillars on Silicon Chips

Andrea Mistrini¹, Irene Marchi², Amin Hodaei³, Shirin Dehgahi³, Alekos Ioannis Garivalis², Paolo Di Marco², Riccardo Casati¹, Davoud Jafari³

¹Politecnico di Milano, Italy; ²University of Pisa, Italy; ³University of Twente, The Netherlands

Graphene Aerogel Enhancement for Next-Generation Ultralight Thermal Management Applications

Jiho Kang¹, Viet Phuong Nguyen^2,3, Seung-Mo Lee^2,3, Duckjong Kim¹

¹Gyeongsang National University, Korea, Republic of (South Korea); ²Nanomechatronics, University of Science and Technology (UST); ³Department of Nanomechanics, Korea Institute of Machinery & Materials (KIMM)