Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Please note that all times are shown in the time zone of the conference. The current conference time is: 16th Oct 2025, 10:43:40am CEST
3.B: Advanced packaging solutions
Time:
Wednesday, 24/Sept/2025:
4:00pm - 5:40pm
Session Chair: Bernhard Wunderle , TU Chemnitz
Location: Aula A
Presentations
Thermal Management Investigation of a V-band GaN Amplifier Embedded into an Advanced Package
Mohamed Bouslama 1 , Anass Jakani1 , Jean-Claude Jacquet1 , Stéphane Piotrowicz1 , Louiza Hamidouche1 , Quentin Levesque1 , Benoit Lambert2 , Gildas Gauthier1
1 III-V Lab, France; 2 UMS S.A.S, France
Thermal Contact Resistance Improvement Between Clip Attached TO-247 Package and Heat Sink with Insertion of an Ultra-Thin Interlayer Silver Film
Zsolt Toth-Pal , Hans-Peter Nee
KTH Royal Institute of Technology, Sweden
Laser Powder Bed Fusion of Multi-Material Heat Sink on Silicon Substrate: A Sn-Al Solution for High-power Electronic Heat Dissipation
Andrea Mistrini 1 , Amin Hodaei2 , Martina Meisnar3 , Davoud Jafari2 , Riccardo Casati1
1 Politecnico di Milano; 2 University of Twente; 3 European Space Agency
Pool Boiling Heat Transfer on Directly 3D-printed Metallic Micropillars on Silicon Chips
Andrea Mistrini1 , Irene Marchi2 , Amin Hodaei3 , Shirin Dehgahi3 , Alekos Ioannis Garivalis2 , Paolo Di Marco2 , Riccardo Casati1 , Davoud Jafari 3
1 Politecnico di Milano, Italy; 2 University of Pisa, Italy; 3 University of Twente, The Netherlands
Graphene Aerogel Enhancement for Next-Generation Ultralight Thermal Management Applications
Jiho Kang 1 , Viet Phuong Nguyen2,3 , Seung-Mo Lee2,3 , Duckjong Kim1
1 Gyeongsang National University, Korea, Republic of (South Korea); 2 Nanomechatronics, University of Science and Technology (UST); 3 Department of Nanomechanics, Korea Institute of Machinery & Materials (KIMM)
