Conference Agenda

Session

3.A: Cooling Approaches for Devices, Packages, and Systems 3

Time:

Wednesday, 24/Sept/2025:

4:00pm - 5:40pm

Session Chair: John Parry, Siemens//Mentor Graphics

Location: Aula Magna

Presentations

Heat Transfer Augmentation in Fin Channels using Self-Oscillating Reeds

Sourabh Kumar Jha, Ari Glezer

Georgia Institute of Technology, United States of America

Numerical Simulations of Heat Transfer in Moderately High Swirling Pipe Flows

Lorenzo Testa, Tim Persoons

Trinity College Dublin, Ireland

Design and Analysis of Biomimicry-based Gradient Microchannel Heat Sinks to Effectively Dissipate Hotspots by Mitigating Flow Maldistribution

Mahalingam Periasamy, Ganesan Narendran

IIITDM Kancheepuram, India

A Deep Dive into an Air Cooled Data Centre’s Mechanical Cooling System Energy Consumption

Younis Osama Abdelsalam¹, Tim Persoons², Sajad Alimohammadi¹

¹School of Mechanical & Design Engineering, College of Engineering & Built Environment, Technological University Dublin, City Campus, Dublin D01 K822, Ireland; ²Department of Mechanical, Manufacturing & Biomedical Engineering, University of Dublin, Trinity College, Dublin D02 PN40, Ireland

Testing of Two-Phase Cooling of Bipolar Plates for Fuel Cells

Henk Jan van Gerner¹, Georg Mühlthaler², Marcus-Benedict Buntz³

¹NLR - Royal Netherlands Aerospace Centre, 1059 CM Amsterdam, The Netherlands; ²Airbus Commercial Aircraft, 22335 Hamburg, Germany; ³Aerostack GmbH, 72581 Dettingen, Germany