Conference Agenda
| Session | ||
3.A: Cooling Approaches for Devices, Packages, and Systems 3
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| Presentations | ||
On the Role of Turbulence and Swirl on Heat Transfer Enhancement in Developing Pipe Flow Trinity College Dublin, Ireland Numerical Investigation of Gradient-based Alveoli Microchannel Heat Sinks Embedded with Hotspots for Electronic Cooling Applications IIITDM Kancheepuram, India Stainless-steel Flat Plate Pulsating Heat Pipe: An Alternative for Electronic Cooling 1Heat Pipe Laboratory, Federal University of Santa Catarina, Florianopolis/SC, Brazil; 2Department of Civil Engineering and Architecture, University of Pavia, Pavia, Italy A Deep Dive into an Air Cooled Data Centre’s Mechanical Cooling System Energy Consumption 1School of Mechanical & Design Engineering, College of Engineering & Built Environment, Technological University Dublin, City Campus, Dublin D01 K822, Ireland; 2Department of Mechanical, Manufacturing & Biomedical Engineering, University of Dublin, Trinity College, Dublin D02 PN40, Ireland Testing of Two-Phase Cooling of Bipolar Plates for Fuel Cells 1NLR - Royal Netherlands Aerospace Centre, 1059 CM Amsterdam, The Netherlands; 2Airbus Commercial Aircraft, 22335 Hamburg, Germany; 3Aerostack GmbH, 72581 Dettingen, Germany | ||