Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Please note that all times are shown in the time zone of the conference. The current conference time is: 16th Oct 2025, 10:46:37am CEST

 
 
Session Overview
Session
3.A: Cooling Approaches for Devices, Packages, and Systems 3
Time:
Wednesday, 24/Sept/2025:
4:00pm - 5:40pm

Session Chair: John Parry, Siemens//Mentor Graphics
Location: Aula Magna


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Presentations

Heat Transfer Augmentation in Fin Channels using Self-Oscillating Reeds

Sourabh Kumar Jha, Ari Glezer

Georgia Institute of Technology, United States of America



Numerical Simulations of Heat Transfer in Moderately High Swirling Pipe Flows

Lorenzo Testa, Tim Persoons

Trinity College Dublin, Ireland



Design and Analysis of Biomimicry-based Gradient Microchannel Heat Sinks to Effectively Dissipate Hotspots by Mitigating Flow Maldistribution

Mahalingam Periasamy, Ganesan Narendran

IIITDM Kancheepuram, India



A Deep Dive into an Air Cooled Data Centre’s Mechanical Cooling System Energy Consumption

Younis Osama Abdelsalam1, Tim Persoons2, Sajad Alimohammadi1

1School of Mechanical & Design Engineering, College of Engineering & Built Environment, Technological University Dublin, City Campus, Dublin D01 K822, Ireland; 2Department of Mechanical, Manufacturing & Biomedical Engineering, University of Dublin, Trinity College, Dublin D02 PN40, Ireland



Testing of Two-Phase Cooling of Bipolar Plates for Fuel Cells

Henk Jan van Gerner1, Georg Mühlthaler2, Marcus-Benedict Buntz3

1NLR - Royal Netherlands Aerospace Centre, 1059 CM Amsterdam, The Netherlands; 2Airbus Commercial Aircraft, 22335 Hamburg, Germany; 3Aerostack GmbH, 72581 Dettingen, Germany