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3.A: Cooling Approaches for Devices, Packages, and Systems 3
Time:
Wednesday, 24/Sept/2025:
4:00pm - 5:40pm
Location:Aula Magna
Presentations
On the Role of Turbulence and Swirl on Heat Transfer Enhancement in Developing Pipe Flow
Lorenzo Testa, Tim Persoons
Trinity College Dublin, Ireland
Numerical Investigation of Gradient-based Alveoli Microchannel Heat Sinks Embedded with Hotspots for Electronic Cooling Applications
Mahalingam Periasamy, Ganesan Narendran
IIITDM Kancheepuram, India
Stainless-steel Flat Plate Pulsating Heat Pipe: An Alternative for Electronic Cooling
Larissa Krambeck1, Kelvin G. Domiciano1, Maria E. Beé1, Marco Marengo2, Marcia B. H. Mantelli1
1Heat Pipe Laboratory, Federal University of Santa Catarina, Florianopolis/SC, Brazil; 2Department of Civil Engineering and Architecture, University of Pavia, Pavia, Italy
A Deep Dive into an Air Cooled Data Centre’s Mechanical Cooling System Energy Consumption
Younis Osama Abdelsalam1, Tim Persoons2, Sajad Alimohammadi1
1School of Mechanical & Design Engineering, College of Engineering & Built Environment, Technological University Dublin, City Campus, Dublin D01 K822, Ireland; 2Department of Mechanical, Manufacturing & Biomedical Engineering, University of Dublin, Trinity College, Dublin D02 PN40, Ireland
Testing of Two-Phase Cooling of Bipolar Plates for Fuel Cells
Henk Jan van Gerner1, Georg Mühlthaler2, Marcus-Benedict Buntz3
1NLR - Royal Netherlands Aerospace Centre, 1059 CM Amsterdam, The Netherlands; 2Airbus Commercial Aircraft, 22335 Hamburg, Germany; 3Aerostack GmbH, 72581 Dettingen, Germany