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3.A: Cooling Approaches for Devices, Packages, and Systems 3
Time:
Wednesday, 24/Sept/2025:
4:00pm - 5:40pm
Session Chair: John Parry , Siemens//Mentor Graphics
Location: Aula Magna
Presentations
Heat Transfer Augmentation in Fin Channels using Self-Oscillating Reeds
Sourabh Kumar Jha, Ari Glezer
Georgia Institute of Technology, United States of America
Numerical Simulations of Heat Transfer in Moderately High Swirling Pipe Flows
Lorenzo Testa , Tim Persoons
Trinity College Dublin, Ireland
Design and Analysis of Biomimicry-based Gradient Microchannel Heat Sinks to Effectively Dissipate Hotspots by Mitigating Flow Maldistribution
Mahalingam Periasamy, Ganesan Narendran
IIITDM Kancheepuram, India
A Deep Dive into an Air Cooled Data Centre’s Mechanical Cooling System Energy Consumption
Younis Osama Abdelsalam 1 , Tim Persoons2 , Sajad Alimohammadi1
1 School of Mechanical & Design Engineering, College of Engineering & Built Environment, Technological University Dublin, City Campus, Dublin D01 K822, Ireland; 2 Department of Mechanical, Manufacturing & Biomedical Engineering, University of Dublin, Trinity College, Dublin D02 PN40, Ireland
Testing of Two-Phase Cooling of Bipolar Plates for Fuel Cells
Henk Jan van Gerner 1 , Georg Mühlthaler2 , Marcus-Benedict Buntz3
1 NLR - Royal Netherlands Aerospace Centre, 1059 CM Amsterdam, The Netherlands; 2 Airbus Commercial Aircraft, 22335 Hamburg, Germany; 3 Aerostack GmbH, 72581 Dettingen, Germany