Enhanced Heat Transfer and Flow Characteristics in a Liquid-cooled Microchannel with Adjacent Micro-Synthetic Jets: Influence of Reynolds Number and Stroke Length

Delara Soltani¹, Tim Persoons², Sajad Alimohammdi¹

1: Technological University Dublin, Ireland; 2: Trinity College Dublin, Ireland

Enhancing the Controllability of Forced Convection Liquid Cooling with Minichannel Heatsinks using Pulsating Flow of Variable Frequency

Galina Kennedy, Tim Persoons

Trinity College Dublin, Ireland

Heat Transfer Enhancement by Metamaterial Structures for Semiconductor Cooling

Md Lokman Hosain¹, Orlando Girlanda¹, Saeed Maleksaeedi²

1: Hitachi Energy Research, Sweden; 2: University of Waterloo, Canada

Efficient Chip-integrated Microfluidic Cooling Through Jet-enhanced Manifold Microchannels

Weiyu Tang, Hongkeng Zhu, Ibrahim Osama Elhagali, Elison Matioli

Power and Wide-Band-Gap Electronics Research Laboratory (POWERlab), École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland

Self-Oscillating Reeds for Heat Transfer Enhancement in Fin Channels

Sourabh Kumar Jha, Ari Glezer

Georgia Institute of Technology, United States of America

An Experimental Investigation of Guided Flow Liquid Cooling Methods on a Four Cell Prismatic Module

David W. Salter, Ciaran Huckfeldt, Kantharuphan Annathurai, Rajesh Nimmagadda, Daniel Trimble, Seamus O'Shaughnessy

Trinity College Dublin, Ireland

Manufacturing and Design Optimisation of an Air Amplifier for Data Centre Server Cooling Applications

David W. Salter^1,2, Eoin H. Oude Essink¹, Gordon O'Brien², Tim Persoons², Sajad Alimohammadi¹

1: Technological University Dublin, Ireland; 2: Trinity College Dublin, Ireland

Critical Analysis of Intersection-point-based Techniques for the Experimental Indirect Determination of Thermal Resistance in Bipolar Transistors

Vincenzo d'Alessandro¹, Ciro Scognamillo¹, Antonio Pio Catalano¹, Lorenzo Codecasa²

1: Department of Electrical Engineering and Information Technology, University Federico II, Naples, Italy; 2: Department of Electronics, Information, and Bioengineering, Polytechnic of Milan, Milan, Italy

HTRB-Based Assessment of Epoxy Mold Compounds Using a Multi-DUT Monitoring Platform

Alessandro Borghese, Guglielmo Marignetti, Giuseppe Capasso, Giovanni Breglio, Luca Maresca, Michele Riccio, Andrea Irace

University of Naples Federico II, Italy

Temperature‐dependent equivalent circuit modeling of PiN diodes for accurate electromagnetic simulations of reconfigurable intelligent surfaces

Ilaria Matacena, Vincenzo d'Alessandro

University of Naples Federico II, Italy

Aging Effect on Temperature Behaviour in Li-ion Battery Cell: a Case of Study

Adolfo Dannier, Marino Coppola, Mattia Ribera, Diego Iannuzzi

University of Napoli Federico II, Italy

Improving Photovoltaic Reliability with Temperature-aware Hot-spot Mitigation

Gerardo Saggese, Monica De Riso, Pierluigi Guerriero, Santolo Daliento

University of Napoli Federico II, Italy

Experimental Evaluation of a Passive Dual Two-Phase Cooling System for Ev Batteries Using a Dielectric Fluid and a Pulsating Heat Pipe

Luca Cattani¹, Federico Sacchelli¹, Fabio Bozzoli¹, Alessandro Soldati², Alex Musetti²

1: Department of Engineering for Industrial Systems and Technologies,University of Parma, Italy; 2: Department of Engineering and Architecture, University of Parma, Italy

Hysteresis Phenomenon in the Electric Parameters of Lithium-ion Batteries under Temperature Effects

Simone Barcellona¹, Lorenzo Codecasa¹, Silvia Colnago², Dario D'Amore¹

1: Politecnico di Milano, DEIB, Italy; 2: Ricerca sul Sistema Energetico, TGM, S.p.A.

Development of 1D Simulation Methodology and Automation for Predicting the Cooling Performance of an Electric Vehicle Battery System

Samuel Yu, Jinwon Seo, Bongkeun Choi

Hyundai Mobis, Korea, Republic of (South Korea)

Solder Joint Fatigue Study on Integrate Circuit Components for Telecom Products

Kaixiang Yang

Ericsson Sweden AB, Sweden

Thermal analysis of a 5G telecom demonstrator in FO-WLP SiP with Integrated GaN Power Amplifier and GaAs Low Noise Amplifier

Anass Jakani¹, Jean-Claude Jacquet¹, N'Doua Luc Arnaud Kakou², Mohamed Bouslama¹, Vincent Bortolussi³, Nicolas Sarazin⁴, Benoit Lambert³, Raphael Sommet², Stephane Piotrowicz¹, Gildas Gauthier¹

1: III-V Lab, France; 2: XLIM, France; 3: UMS (United Monolithic Semiconductors), France; 4: TRT (Thales Research & Technology)

Characterisation of Thermal Interface Materials Under Sustained Cyclic Thermo-Mechanical Loading

Philip Matzick, Christian Mentin, Stefan Mollov

Silicon Austria Labs, Austria

Multi-scale and Multi-physics Analysis Of a GaN System in Package Using Fan Out Wafer Level Packaging (FO-WLP) Technology

N’Doua Luc Arnaud Kakou¹, José Anderson Silva dos Santos¹, Raphael Sommet¹, Vincent Bortolussi², Anass Jakani³, Jean-Christophe Nallatamby¹

1: XLIM, UMR7252, Université de Limoges, France; 2: United Monolithic Semiconductor, Villebon sur Yvette, France; 3: 3 - 5 Lab, Palaiseau, France

In-chip Liquid Cooling using Directly Integrated Jet Impingement with Enhanced Pin Fins

Ibrahim Osama Ibrahim Elhagali, Hongkeng Zhu, Weiyu Tang, Elison Matioli

EPFL, Switzerland

Improved Thermal Transient Testing of GaN Devices Manufactured with Various Construction Principles

Sandor Ress^1,2, Gabor Farkas¹, Mahmoud Darwish¹, Marta Rencz², Zoltan Sarkany¹

1: SIEMENS DISW, Hungary; 2: Budapest University of Technology and Economics, Hungary

Thermal Characterization of a Novel Direct Cooler Design for Modular Power Devices

Filippo Gerbino, Luca Cattani, Fabio Bozzoli, Davide Spaggiari, Paolo Cova, Roberto Menozzi

University of Parma, Italy

4H-SiC Power MOSFET Body Diode as a Highly-linear Temperature Sensor for Tj Monitoring

Francesco Della Corte¹, Riccardo Carotenuto², Demetrio Iero², Massimo Merenda², Giovanni Pangallo²

1: University of Napoli Federico II, Italy; 2: Mediterranea University of Reggio Calabria, Italy

Thermal analysis of fast-charger contactless power transfer for electric buses

Luigi Pio Di Noia, Renato Rizzo

University of Napoli Federico II, Italy

Prediction of Dynamic Thermal Behavior of Novel Ceramics for Power Devices Using Numerical Simulations

Peter Gabor Szabo, Gyorgy Bognar, Laszlo Pohl

Budapest University of Technology and Economics, Hungary

Numerical Investigation on Thermal Behaviour of Horizontal Plate Heat Sink with Metal Foam Partially Embedded in PCM for Passive Cooling System

Aanandsundar Arumugam, Bernardo Buonomo, Furio Cascetta, Oronzio Manca, Sergio Nardini

Universita' degli Studi della Campania "Luigi Vanvitelli", Italy

On the Role of Turbulence and Swirl on Heat Transfer Enhancement in Developing Pipe Flow

Lorenzo Testa, Tim Persoons

Trinity College Dublin, Ireland

Numerical Investigation of Gradient-based Alveoli Microchannel Heat Sinks Embedded with Hotspots for Electronic Cooling Applications

Mahalingam Periasamy, Ganesan Narendran

IIITDM Kancheepuram, India

Stainless-steel Flat Plate Pulsating Heat Pipe: An Alternative for Electronic Cooling

Larissa Krambeck¹, Kelvin G. Domiciano¹, Maria E. Beé¹, Marco Marengo², Marcia B. H. Mantelli¹

1: Heat Pipe Laboratory, Federal University of Santa Catarina, Florianopolis/SC, Brazil; 2: Department of Civil Engineering and Architecture, University of Pavia, Pavia, Italy

A Deep Dive into an Air Cooled Data Centre’s Mechanical Cooling System Energy Consumption

Younis Osama Abdelsalam¹, Tim Persoons², Sajad Alimohammadi¹

1: School of Mechanical & Design Engineering, College of Engineering & Built Environment, Technological University Dublin, City Campus, Dublin D01 K822, Ireland; 2: Department of Mechanical, Manufacturing & Biomedical Engineering, University of Dublin, Trinity College, Dublin D02 PN40, Ireland

Testing of Two-Phase Cooling of Bipolar Plates for Fuel Cells

Henk Jan van Gerner¹, Georg Mühlthaler², Marcus-Benedict Buntz³

1: NLR - Royal Netherlands Aerospace Centre, 1059 CM Amsterdam, The Netherlands; 2: Airbus Commercial Aircraft, 22335 Hamburg, Germany; 3: Aerostack GmbH, 72581 Dettingen, Germany

Monitoring Electrothermal-Induced Package Strain During HTRB Using Fiber Optic Sensors

Alessandro Borghese, Vincenzo Romano Marrazzo, Francesco Fienga, Michele Riccio, Luca Maresca, Giovanni Breglio, Andrea Irace

University of Naples Federico II, Italy

Thermal‑Resistance‑Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load‑Cycling

Maik Sternberg¹, Dan R. Wargulski¹, Daniel May^1,2, Kaushal Arun Pareek¹, Bernhard Wunderle^2,3, Mohamad Abo Ras¹

1: Berliner Nanotest und Design GmbH, Germany; 2: Chemnitz University of Technology, Germany; 3: Fraunhofer ENAS, Germany

Impact of Adiabatic and Condenser Lengths on the Thermal Performance of Flat Pulsating Heat Pipes

Anil Kumar, Arthur Labalte, Hazhir Fatahi, Amrid Amnache, Luc G. Frechette

University of Sherbrooke, Canada

Optimal Sensor Placement for Thermal Virtual Sensing in Electronic Systems Using Augmented Kalman Filtering

Matteo Depaola^1,2,3, Daniel De Gregoriis², Robin Bornoff⁴, Bart Vandevelde¹, David Moens^3,5

1: Imec; 2: Siemens Industry Software NV; 3: KU Leuven; 4: Siemens Industry Software; 5: Flanders Make

Experimental Comparison of Variable Density Heatsinks Under Flow Boiling Conditions

Jaume Camarasa, Montse Vilarrubí, Desideri Regany, David Beberide, Pol Rosell, Joan Ignasi Rosell, Manel Ibáñez, Jérôme Barrau

Universitat de Lleida, Spain

Experimental Evaluation of Different Cold Plates Configurations for Direct-to-chip Liquid Cooling

David Beberide^1,2, Montse Vilarrubí^1,2, Jaume Camarasa², David Sancho¹, Desideri Regany², Jérôme Barrau^1,2

1: Universal Smart Cooling SL, Spain; 2: Universitat de Lleida, Spain

Experimental Comparative Analysis of PCB Cooling Technologies Including Nonlinear Thermal Effects

Denis Musella², Elena Mengotti¹, Enea Bianda¹, Hemant Bishnoi¹, Ciro Scognamillo², Vincenzo d'Alessandro², Antonio Pio Catalano²

1: ABB Corporate Research Center, Switzerland; 2: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy

High-Resolution Thermal Analysis of Interface and Microstructure Formation in SAC-Cu Solder Joints

Lisa Mitterhuber, Verena Leitgeb, Elke Kraker, Julien Magnien

Materials Center Leoben Forschung GmbH, Austria

Numerical Investigation of the Thermal Behavior of 3-D GaN LEDs for Thermal-Aware Design

Ciro Scognamillo¹, Antonio Pio Catalano¹, Janusz Wozny², Ewa Raj², Vincenzo d'Alessandro¹

1: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2: Department of Semiconductor and Optoelectronics Devices, Lodz University of Technology, Politechniki 10, 93-590 Lodz, Poland

Failure Analysis for Electronic Packaging Materials: A Comparative Study of Pulsed and Lock-In Thermography

Yanan Wu^1,2, Kaushal Arun Pareek², Daniel May¹, Marek Zajaczkowski², Corinna Grosse-Kockert², Mohamad Abo Ras², Bernhard Wunderle^1,3

1: Technische Universität Chemnitz, Germany; 2: Berliner Nanotest und Design GmbH; 3: Fraunhofer ENAS

SPICE-based Switching Energies Estimation of SiC Power Transistors

Paweł Górecki, Krzysztof Górecki

Gdynia Maritime University, Poland

Investigation of the Compact Thermal Modeling of SiC-based Power MOSFETs

Antonio Pio Catalano¹, Gianpaolo Romano², Michele Riccio¹, Andrea Irace¹, Lorenzo Codecasa³, Vincenzo d'Alessandro¹

1: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2: StarPower Europe AG, Baden, Switzerland; 3: Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy

3D Modelling of Mass and Heat Transport in Multi-Phase Microfluidic Systems

Zsombor Szomor¹, Tamás Pardy², Péter Fürjes¹

1: Centre for Energy Research, Hungary; 2: Tallinn University of Technology

A Time-Efficient Approach to Thermal-electrical Analysis of Six-pack IGBT-based Power Module

Debora Crimi, Edoardo Marchica, Emanuela Privitera

Nexperia B.V.

Reduced BJT Power Dissipation via Saturated Operation in Full Wave Rectifiers

Riccardo Carotenuto¹, Demetrio Iero¹, Massimo Merenda¹, Francesco G. Della Corte²

1: Mediterranea University of Reggio Calabria; 2: University of Napoli Federico II, Italy

Peltier Cooling for Thermal Management and Efficiency Enhancement in Perovskite Solar Cells

Hichem Bencherif¹, Ziyad Younsi¹, Francesco Della Corte²

1: Higher National School of Renewable Energies, Environment and Sustainable Development, Campus Fesdis, Batna 05078, Algeria; 2: Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy

Thermal Performance of Server Voltage Regulator Modules in Liquid and Air-cooling System

Donata Gualandris, Andrea Garuffo

STMicroelectronics, Italy

Thermal Characterization of Heat Pipe Embedded Heat Spreaders for High Performance Computer Cooling in Automotives

Baris Erol¹, Daniel May¹, Bernhard Wunderle^1,2

1: Chemnitz University of Technology, Germany; 2: Fraunhofer ENAS

Thermal Characterisation of Packaging Materials at Cryogenic Temperatures by the Three-Omega Method

Carlos Rincon-Ruiz¹, Nathanael Jöhrmann¹, Uwe Zschenderlein¹, Corinna Grosse-Kockert⁵, Bernhard Wunderle^1,2,3,4

1: Technische Universität Chemnitz, Germany; 2: Fraunhofer ENAS, Chemnitz, Germany; 3: Center for Micro- and Nanotechnologies (ZfM), Chemnitz, Germany; 4: Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany; 5: Nanotest Berlin, Germany

Fast Extraction of Thermal System Model for a Silicon Carbide Power Module Based on a 1D and 3D Hybrid Simulation Framework

Zhaozan Feng, Jianfeng Li, Jinzhou Cao, Guomeng Song, Yangju Zou, Yu Qi

Zhuzhou CRRC Times Electric UK Innovation Center, United Kingdom

Effect of the Condenser on the Thermal Performance of a Mini Loop Heat Pipe

Kelvin Guessi Domiciano, Larissa Krambeck, Maria Eduarda Beé, Marcia Barbosa Henriques Mantelli

Federal University of Santa Catarina, Brazil

An Advanced High Temperature Device Heating Methodology for Automotive Grade Zero Conditions

Heinrich Helldorff¹, Michael Glavanovics¹, Bernd Deutschmann², Alexander Ulbing¹, Gerhard Glatte¹

1: KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Austria; 2: Graz University of Technology

Optimizing Boosting for Faster Calorimetric Measurement of High-Efficiency Electric Machines

Jasper Nonneman^1,2, Ilya T'Jollyn³, Jeroen De Kooning^1,2, Michel De Paepe^1,2,4

1: Ghent University, Ghent, Belgium; 2: FlandersMake@UGent - Core lab MIRO, Leuven, Belgium; 3: University of Antwerp, Antwerp, Belgium; 4: University of Cape Town, Cape Town, Sout Africa

Verification of Thermal Transient Measurement Methods for Cascode Type SiC JFETs

Wasanthamala Badalawa, Yoshitaka Aoki, Tomoaki Hara

SIEMENS, Japan

Numerical Thermal Analysis of Liquid-Cooled Electric Motors for High-Performance Applications

Ozan Atalay, Ahmet Comez, Ali Eray Torun, Caner Demir

ASELSAN, Turkiye

Fast Approach with Analytical Models for Heat Sink Modelling and Optimization

Dinuka Herath^1,2, Ibrahim Harbi², Aleksei Maksimov², Thiwanka Wijekoon²

1: Technical University Munich; 2: Huawei Technologies Duesseldorf GmbH

Cooling Strategies for PCB-Mounted MOSFETs: Comparative Analysis and Numerical Simulations

Monzer Rayya, Cagri Balikci

CARIAD SE, Germany

Experimental Investigation of Flow Boiling Heat Transfer Under Periodically Varying Heat Loads

Jana Rogiers¹, Jasper Nonnemann^1,2, Hendrik Vansompel^1,2, Michel De Paepe^1,2,3

1: Ghent Universtity, Ghent, Belgium; 2: FlandersMake@UGent – Core lab MIRO, Leuven, Belgium; 3: University of Cape Town, Cape Town, South Africa

Development and Integration of Phase Change Materials to Limit Operating Temperatures

Mathias Nowottnick, Andrej Novikov, Leander Lorenz

University of Rostock, Germany

An Approach to Thermoelectric Module Selection: Analytical Simulation and Experimental Test

Fabio Capolupo^1,2, Pesapane Mara¹, Marilena Musto^1,2, Russo Roberto²

1: Industrial Engineering Department, University of Napoli “Federico II”, Piazzale Vincenzo Tecchio, 80, Napoli, 80125, Italy; 2: Institute of Applied Sciences and Intelligent Systems, National Research Council of Italy, Via Pietro Castellino 111, Napoli, 80131, Italy

Electrothermal Performance Enhancement of Silicon Carbide Gate-All-Around MOSFETs Using a Ferroelectric Gate Stack

Vincenzo Terracciano¹, Alessandro Borghese¹, Marco Boccarossa¹, Andrea Irace¹, Giovanni Salvatore², Luca Maresca¹

1: University of Naples Federico II, Italy; 2: Ca’ Foscari University of Venice, Italy

Dielectric Liquid Cooling of 2.0 kV SiC MOSFET Power Module Using Jet Impingement and Pumped Immersion Flow

Till Huesgen, Johann Renner, Balasubramanian Vaidyanathan, Vladimir Polezhaev

Hochschule Kempten - University of Applied Sciences, Germany

A comparative analysis of the thermal performance of DBC and novel IMS substrates of IGBT devices

János Hegedüs¹, Péter G. Szabó¹, László Pohl¹, Gusztáv Hantos¹, Gyula Lipák¹, Andrea Reolon², András Poppe¹, Ferenc Ender¹

1: Budapest University of Technology and Economics, Hungary; 2: Serigroup, Italy

Multi-physics Simulations for IGBT Power Electronics Module Cooling

Péter Pálovics¹, Eeli Kerttula², Atte Hoffrén², Joonas Leppänen², Ferenc Ender¹

1: Budapest University of Technology and Economics, Budapest, Hungary; 2: ABB Oy, Motion, Technology Collaboration Office, Helsinki, Finland

Study Of Breakdown Mechanisms In GaN/AlGaN HEMTs Under Various Short Circuit Tests Using p-GaN Schottky Gate Current As Thermal Sensitive Parameter

Christale Crouard^1,2, Mickael Rouch¹, Jonathan Godillon¹, Julio Brandelero¹, Patrick Tounsi²

1: STMicroelectronics, France; 2: LAAS-CNRS, France

Toward Real-Time Junction Temperature Estimation with a Physics-Informed Attention LSTM

Alessandro Varaldi¹, Maurizio Tranchero², Lorenzo Giraudi², Claudio Genta², Marco Vacca¹

1: Politecnico di Torino, Italy; 2: Ideas & Motion

K-factor Calibration Issues of IGBTs

Gusztáv Hantos, János Hegedüs, Gyula Lipák, András Poppe, Ferenc Ender

Budapest University of Technology and Economics, Hungary

Development of a Surrogate Model for a Phase Change Material Heat Sink for Thermal Buffering of Power Electronics

Maité Goderis^1,2, Jana Rogiers^1,2, Michiel De Paepe¹, Wito Plas^1,2, Hendrik Vansompel^1,2, Michel De Paepe^1,2,3

1: Ghent University, Department of Electromechanical, Systems and Metal Engineering, Sint-Pietersnieuwstraat 41, Ghent, 9000, Belgium; 2: FlandersMake@UGent – Core lab MIRO, Ghent, 9000, Belgium; 3: University of Cape Town, Department of Mechanical Engineering, Private Bag X3, Rondebosch 7701, South Africa

Reliability of High-Power LEDs Under Varying Thermal Aging Conditions

Andreas Zippelius, Elias Hufnagel, Zubair Mohd, Maximilian Schmid, Gordon Elger

Technische Hochschule Ingolstadt, Germany

Extrinsic Failure of High-power Blue LEDs for Horticulture Applications Stressed in Hot Environments

Alessandro Caria, Riccardo Fraccaroli, Giulia Pierobon, Thomas Castellaro, Ambrogio Huang, Carlo De Santi, Matteo Buffolo, Nicola Trivellin, Enrico Zanoni, Gaudenzio Meneghesso, Matteo Meneghini

University of Padova, Italy

Thermal aspects of infrared LED sources interfering with military night vision systems

János Hegedüs, Gusztáv Hantos, András Poppe

Budapest University of Technology and Economics, Hungary

Electro-thermal Circuit Models of PhotoVoltaic Cells Subjected to Optical Degradation Phenomena

Marco Balato¹, Martina Botti^2,3, Antonio Pio Catalano¹, Luigi Costanzo², Vincenzo d'Alessandro¹, Athanasios G. Papathanasiou⁴, Carlo Petrarca¹, Ciro Scognamillo¹, Luigi Verolino¹, Massimo Vitelli²

1: University of Naples Federico II, Italy; 2: University of Campania "Luigi Vanvitelli"; 3: University of Salerno; 4: National Technical University of Athens