Air-Cooled Versus Liquid-Cooled Flat Pulsating Heat Pipes for Battery Thermal Management

Hazhir Fatahi, Arthur Labalte, Anil Kumar, Amrid Amnache, Luc G Fréchette

Université de Sherbrooke, QC, Canada

Fluid Dynamics in Immersion Battery Cooling: Linking Coolant Vortex Structures to Thermal Gradients and Lithium-ion Cell Performance and Longevity

Jibin Mathai Joy^1,2, Mattia Duranti², Edoardo Gino Macchi², Dibakar Rakshit¹

1: Department of Energy Science and Engineering, IIT Delhi, Hauz Khas, Delhi; 2: Sustainable Energy (SE) , Fondazione Bruno Kessler, Trento, Italy

Numerical and Experimental Investigation of Liquid Tab Cooling of a Prismatic Battery

David W. Salter, Aidan Mullaney, Kantharuphan Annathurai, Rajesh Nimmagadda, Daniel Trimble, Seamus O'Shaughnessy

Trinity College Dublin, Ireland

A Numerical and Experimental Comparative Study on Cold Plate Cooling of a 5.6kW Tesla Battery Pack

Kantharuphan Annathurai, David Salter, Rajesh Nimmagadda, Daniel Trimble, Seamus O'Shaughnessy

Trinity College Dublin, Ireland

Thermal Performance of a Heat Pipe with Triangular Grooves for Battery Cooling Applications in Electric Vehicles

Sabrina Costa Chichinelli, Larissa Krambeck, Kelvin Guessi Domiciano, Ricardo Brandalise Botelho, Marcia Barbosa Henriques Mantelli

Federal University of Santa Catarina, Brazil

Temperature Estimation and Thermal Runaway Detection in a Novel Battery Module Arrangement Incorporating a Reduced Number of Sensors

Ane Sainz De La Maza Escobal^1,2, Filippo Gerbino³, Davide Spaggiari³, Danilo Santoro³, Edorta Ibarra², David Ansean⁴, Elena Trancho¹, Nicola Delmonte³

1: Tecnalia, Basque Research and Technology Alliance (BRTA), Derio, Spain; 2: University of the Basque Country (UPV/EHU), Bilbao, Spain; 3: University of Parma, Parma, Italy; 4: Department of Electrical Engineering, University of Oviedo, Gijón, Spain

Thermal Management of Battery Cells in Electric Vehicles: Design and Analysis under Various C-Rates and Environmental Conditions

Ali Eray Torun, Ahmet Çömez, Caner Demir, Hakan Uysal

ASELSAN, Türkiye

Thermal Management Investigation of a V-band GaN Amplifier Embedded into an Advanced Package

Mohamed Bouslama¹, Anass Jakani¹, Jean-Claude Jacquet¹, Stéphane Piotrowicz¹, Louiza Hamidouche¹, Quentin Levesque¹, Benoit Lambert², Gildas Gauthier¹

1: III-V Lab, France; 2: UMS S.A.S, France

Thermal Contact Resistance Improvement Between Clip Attached TO- 247 Package and Heat Sink with Insertion of an Ultra-Thin Interlayer Silver Film

Zsolt Toth-Pal, Hans-Peter Nee

KTH Royal Institute of Technology, Sweden

Laser Powder Bed Fusion of Multi-Material Heat Sink on Silicon Substrate: A Sn-Al Solution for High-power Electronic Heat Dissipation

Andrea Mistrini¹, Amin Hodaei², Martina Meisnar³, Davoud Jafari², Riccardo Casati¹

1: Politecnico di Milano; 2: University of Twente; 3: European Space Agency

Pool Boiling Heat Transfer on Directly 3D-printed Metallic Micropillars on Silicon Chips

Andrea Mistrini¹, Irene Marchi², Amin Hodaei³, Shirin Dehgahi³, Alekos Ioannis Garivalis², Paolo Di Marco², Riccardo Casati¹, Davoud Jafari³

1: Politecnico di Milano, Italy; 2: University of Pisa, Italy; 3: University of Twente, The Netherlands

Graphene Aerogel Enhancement for Next-Generation Ultralight Thermal Management Applications

Jiho Kang¹, Viet Phuong Nguyen^2,3, Seung-Mo Lee^2,3, Duckjong Kim¹

1: Gyeongsang National University, Korea, Republic of (South Korea); 2: Nanomechatronics, University of Science and Technology (UST); 3: Department of Nanomechanics, Korea Institute of Machinery & Materials (KIMM)

Circuit-based Thermal Modeling of Phase Change Materials for Fast Dynamic Simulations

Francesco Piccirillo¹, Antonio Pio Catalano², Ciro Scognamillo², Marcello Iasiello¹, Nicola Bianco¹, Vincenzo d'Alessandro²

1: Department of Industrial Engineering, University of Naples Federico II, Italy; 2: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy

Heat Transfer Performance Modelling for Liquid Cooling of High-Power Electronics

Wendy Luiten

WLC, Netherlands, The

VOLTERRA: An Innovative Approach for Accurate Nonlinear Thermal Modeling of Electronic Components

Giorgio Eliseo¹, Ciro Scognamillo¹, Antonio Pio Catalano¹, Vincenzo d'Alessandro¹, Lorenzo Codecasa²

1: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2: Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy

Bayesian Parameter Estimation and Uncertainty Quantification for 1D Low-element Thermal Networks

Christian Findenig¹, Lisa Mitterhuber¹, Julien Magnien¹, Robert Peharz², Manfred Mücke¹

1: Materials Center Leoben Forschung GmbH, Austria; 2: Graz University of Technology, Austria

Thermohydraulic Lumped Parameter Models for Direct Battery Cooling

Lander Cnudde^1,2, Jana Rogiers^1,2, Jasper Nonneman^1,2, Michel De Paepe^1,2,3

1: Ghent University, Ghent, Belgium; 2: FlandersMake@UGent - Core lab MIRO, Leuven, Belgium; 3: University of Cape Town, Cape Town, South Africa

Electro-thermal Analysis of p-GaN Gate e-mode HEMTs with Ohmic and Schottky Gates

Minji Kim, Jiun Oh, Joon Seop Kwak

Korea Institute of Energy Technology, Korea, Republic of (South Korea)

Numerical Study of Transient Heat Transport in 4H-SiC Triggered by UV Laser Pulses

Janusz Wozny, Andrzej Kubiak, Alessandro Verdolotti, Ewa Raj

Lodz University of Technology, Poland

SPICE Modeling of GaN HEMTs in the Wide Temperature Range (-269°C…+500°C)

Konstantin O. Petrosyants, Mamed R. Ismail-zade, Lev M. Sambursky

National Research University Higher School of Economics (Moscow Institute of Electronics and Mathematics), Russian Federation

Numerical Investigation on Full Immersion Forced Convection Cooling of 8-Cell Lithium-Ion Prismatic Battery Pack

Rajesh Nimmagadda, Joshua Burns, David W.Salter, Kantharuphan Annathurai, Daniel Trimble, Seamus M. O’Shaughnessy

Department of Mechanical, Manufacturing & Biomedical Engineering, Trinity College Dublin, Ireland

FEM-Assisted Design and Characterization of a New Lithium Battery Pack-Heatsink Assembly

Nicola Delmonte¹, Danilo Santoro¹, Davide Spaggiari¹, Filippo Gerbino¹, Paolo Cova¹, Ane Sainz De La Maza^2,3, Edorta Ibarra², Elena Trancho³, Roberto Menozzi¹

1: University of Parma, Department of Engineering and Architecture, Italy; 2: University of the Basque Country, Department of Electronic Technology, Spain; 3: Tecnalia, Basque Research and Technology Alliance (BRTA), Spain

Investigation and Compact Modeling of Self-heating in Buried Gate Carbon Nanotube Field-effect Transistors

Deepak Kumar, Michael Schröter

Technische Universität Dresden, Germany

Integrated Modelling Framework for 3D IC Package Thermal Design

Sudarshan Deo¹, Andras Vass-Varnai¹, Peter Szabo²

1: Siemens EDA, United States of America; 2: Budapest University of Technology and Economics

Simplified Thermal Transient Testing: Unlocking Affordable, Open-source Solutions

Nils Jonas Ziegeler^1,2, Stefan Schweizer^1,3

1: South Westphalia University of Applied Science; 2: Forvia SE; 3: Fraunhofer Application Center for Inorganic Phosphors

Comparative Analysis of TPMS Structures for Optimized CPU/GPU Thermal Management Using Generative Design

Ine Vandebeek, Lieven Vervecken

Diabatix, Belgium

Influence of Heat Source Dimensions and Heat Transfer Coefficient Value on Temperature of Electronic Circuits Cooled by Free Convection

Marcin Janicki

Lodz University of Technology, Poland