10:00am - 11:20am |
7.A: Thermal Management in Power Electronics 1 Location: Aula Magna Chair: John Janssen, NXP Semiconductors
Electrothermal Performance Enhancement of Silicon Carbide Gate-All-Around MOSFETs Using a Ferroelectric Gate Stack
Vincenzo Terracciano1, Alessandro Borghese1, Marco Boccarossa1, Andrea Irace1, Giovanni Salvatore2, Luca Maresca1
1: University of Naples Federico II, Italy;
2: Ca’ Foscari University of Venice, Italy
Dielectric Liquid Cooling of 2.0 kV SiC MOSFET Power Module Using Jet Impingement and Pumped Immersion Flow
Till Huesgen, Johann Renner, Balasubramanian Vaidyanathan, Vladimir Polezhaev
Hochschule Kempten - University of Applied Sciences, Germany
A Comparative Analysis of the Thermal Performance of DBC and Novel IMS Substrates of IGBT Devices
János Hegedüs1, Gusztáv Hantos1, Gyula Lipák1, Andrea Reolon2, András Poppe1, Ferenc Ender1
1: Budapest University of Technology and Economics, Hungary;
2: Serigroup, Italy
Multiphysics Simulations for IGBT Power Semiconductor Module Cooling
Péter Pálovics1, Eeli Kerttula2, Atte Hoffrén2, Joonas Leppänen2, Ferenc Ender1
1: Budapest University of Technology and Economics, Budapest, Hungary;
2: ABB Oy, Motion, Technology Collaboration Office, Helsinki, Finland
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7.B: Advances in Thermal Modeling and Simulation 4 Location: Aula A Chair: Ciro Scognamillo, University of Naples Federico II
Integrated Modelling Framework for 3D IC Package Thermal Design
Sudarshan Deo1, Andras Vass-Varnai1, Peter Gabor Szabo2
1: Siemens EDA, United States of America;
2: Budapest University of Technology and Economics
Simplified Thermal Transient Testing: Unlocking Affordable, Open-source Solutions
Nils Jonas Ziegeler1,2, Stefan Schweizer1,3
1: South Westphalia University of Applied Science;
2: Forvia SE;
3: Fraunhofer Application Center for Inorganic Phosphors
Comparative Analysis of TPMS Structures for Optimized CPU/GPU Thermal Management Using Generative Design
Ine Vandebeek, Ramadan Krasniqi, Luis Cusicanqui, Lieven Vervecken
Diabatix, Belgium
Influence of Heat Source Dimensions and Heat Transfer Coefficient Value on Temperature of Electronic Circuits Cooled by Free Convection
Marcin Janicki
Lodz University of Technology, Poland
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