Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Please note that all times are shown in the time zone of the conference. The current conference time is: 18th Aug 2025, 03:33:00pm CEST
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Session Overview |
Date: Friday, 26/Sept/2025 | ||
9:00am - 9:40am |
3rd Keynote: Towards Intelligent Power Electronics Location: Aula Magna Jochen Koszescha , Infineon Technologies, AG |
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9:40am - 10:00am |
1st Coffee Break |
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10:00am - 11:20am |
7.A: Thermal Management in Power Electronics 1 Location: Aula Magna Electrothermal Performance Enhancement of Silicon Carbide Gate-All-Around MOSFETs Using a Ferroelectric Gate Stack 1: University of Naples Federico II, Italy; 2: Ca’ Foscari University of Venice, Italy Dielectric Liquid Cooling of 2.0 kV SiC MOSFET Power Module Using Jet Impingement and Pumped Immersion Flow Hochschule Kempten - University of Applied Sciences, Germany A comparative analysis of the thermal performance of DBC and novel IMS substrates of IGBT devices 1: Budapest University of Technology and Economics, Hungary; 2: Serigroup, Italy Multi-physics Simulations for IGBT Power Electronics Module Cooling 1: Budapest University of Technology and Economics, Budapest, Hungary; 2: ABB Oy, Motion, Technology Collaboration Office, Helsinki, Finland |
7.B: Advances in Thermal Modeling and Simulation 4 Location: Aula A Integrated Modelling Framework for 3D IC Package Thermal Design 1: Siemens EDA, United States of America; 2: Budapest University of Technology and Economics Simplified Thermal Transient Testing: Unlocking Affordable, Open-source Solutions 1: South Westphalia University of Applied Science; 2: Forvia SE; 3: Fraunhofer Application Center for Inorganic Phosphors Comparative Analysis of TPMS Structures for Optimized CPU/GPU Thermal Management Using Generative Design Diabatix, Belgium Influence of Heat Source Dimensions and Heat Transfer Coefficient Value on Temperature of Electronic Circuits Cooled by Free Convection Lodz University of Technology, Poland |
11:20am - 11:40am |
2nd Coffee Break |
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11:40am - 1:00pm |
8: Thermal Management in Power Electronics 2 Location: Aula Magna Study Of Breakdown Mechanisms In GaN/AlGaN HEMTs Under Various Short Circuit Tests Using p-GaN Schottky Gate Current As Thermal Sensitive Parameter 1: STMicroelectronics, France; 2: LAAS-CNRS, France Toward Real-Time Junction Temperature Estimation with a Physics-Informed Attention LSTM 1: Politecnico di Torino, Italy; 2: Ideas & Motion K-factor Calibration Issues of IGBTs Budapest University of Technology and Economics, Hungary Development of a Surrogate Model for a Phase Change Material Heat Sink for Thermal Buffering of Power Electronics 1: Ghent University, Department of Electromechanical, Systems and Metal Engineering, Sint-Pietersnieuwstraat 41, Ghent, 9000, Belgium; 2: FlandersMake@UGent – Core lab MIRO, Ghent, 9000, Belgium; 3: University of Cape Town, Department of Mechanical Engineering, Private Bag X3, Rondebosch 7701, South Africa |
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1:00pm - 2:00pm |
Lunch |
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2:00pm - 3:20pm |
9: Thermal Investigation of LEDs and Solar Cells Location: Aula Magna Reliability of High-Power LEDs Under Varying Thermal Aging Conditions Technische Hochschule Ingolstadt, Germany Extrinsic Failure of High-power Blue LEDs for Horticulture Applications Stressed in Hot Environments University of Padova, Italy Thermal aspects of infrared LED sources interfering with military night vision systems Budapest University of Technology and Economics, Hungary Electro-thermal Circuit Models of PhotoVoltaic Cells Subjected to Optical Degradation Phenomena 1: University of Naples Federico II, Italy; 2: University of Campania "Luigi Vanvitelli"; 3: University of Salerno; 4: National Technical University of Athens |
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3:20pm - 3:40pm |
3rd Coffee Break |
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3:40pm - 4:20pm |
Awards & Closing Remarks |