Monitoring Electrothermal-Induced Package Strain During HTRB Using Fiber Optic Sensors

Alessandro Borghese, Vincenzo Romano Marrazzo, Francesco Fienga, Michele Riccio, Luca Maresca, Giovanni Breglio, Andrea Irace

University of Naples Federico II, Italy

Thermal‑Resistance‑Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load‑Cycling

Maik Sternberg¹, Daniel May², Dan R. Wargulski¹, Kaushal Arun Pareek¹, Bernhard Wunderle^2,3, Mohamad Abo Ras¹

1: Berliner Nanotest und Design GmbH, Germany; 2: Chemnitz University of Technology, Germany; 3: Fraunhofer ENAS, Germany

Optimal Sensor Placement for Thermal Virtual Sensing in Electronic Systems Using Augmented Kalman Filtering

Matteo Depaola^1,2,3, Daniel De Gregoriis², Robin Bornoff⁴, Bart Vandevelde¹, David Moens^3,5

1: Imec; 2: Siemens Industry Software NV; 3: KU Leuven; 4: Siemens Industry Software; 5: Flanders Make

Experimental Comparison of Variable Density Heatsinks Under Flow Boiling Conditions

Jaume Camarasa, Montse Vilarrubí, Desideri Regany, David Beberide, Pol Rosell, Joan Ignasi Rosell, Manel Ibáñez, Jérôme Barrau

Universitat de Lleida, Spain

Circuit-based Thermal Modeling of Phase Change Materials for Fast Dynamic Simulations

Francesco Piccirillo¹, Antonio Pio Catalano², Ciro Scognamillo², Marcello Iasiello¹, Nicola Bianco¹, Vincenzo d'Alessandro²

1: Department of Industrial Engineering, University of Naples Federico II, Italy; 2: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy

Heat Transfer Performance Modelling for Liquid Cooling of High-Power Electronics

Wendy Luiten

WLC, Netherlands, The

VOLTERRA: An Innovative Approach for Accurate Nonlinear Thermal Modeling of Electronic Components

Giorgio Eliseo¹, Ciro Scognamillo¹, Antonio Pio Catalano¹, Vincenzo d'Alessandro¹, Lorenzo Codecasa²

1: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2: Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy

Bayesian Parameter Estimation and Uncertainty Quantification for 1D Low-Element Thermal Networks

Christian Findenig¹, Lisa Mitterhuber¹, Julien Magnien¹, Robert Peharz², Manfred Mücke¹

1: Materials Center Leoben Forschung GmbH, Austria; 2: Graz University of Technology, Austria

Experimental Evaluation of Different Cold Plates Configurations for Direct-to-chip Liquid Cooling

David Beberide^1,2, Montse Vilarrubí^1,2, Jaume Camarasa², David Sancho¹, Desideri Regany², Jérôme Barrau^1,2

1: Universal Smart Cooling SL, Spain; 2: Universitat de Lleida, Spain

Experimental Comparative Analysis of PCB Cooling Technologies Including Nonlinear Thermal Effects

Denis Musella², Elena Mengotti¹, Enea Bianda¹, Hemant Bishnoi¹, Ciro Scognamillo², Vincenzo d'Alessandro², Antonio Pio Catalano²

1: ABB Corporate Research Center, Switzerland; 2: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy

High-Resolution Thermal Analysis of Interface and Microstructure Formation in SAC-Cu Solder Joints

Lisa Mitterhuber, Verena Leitgeb, Elke Kraker, Julien Magnien

Materials Center Leoben Forschung GmbH, Austria

Stainless-steel Flat Plate Pulsating Heat Pipe: An Alternative for Electronic Cooling

Larissa Krambeck¹, Kelvin G. Domiciano¹, Maria E. Beé¹, Marco Marengo², Marcia B. H. Mantelli¹

1: Heat Pipe Laboratory, Federal University of Santa Catarina, Florianopolis/SC, Brazil; 2: Department of Civil Engineering and Architecture, University of Pavia, Pavia, Italy

Thermohydraulic Lumped Parameter Models for Direct Battery Cooling

Lander Cnudde^1,2, Jana Rogiers^1,2, Jasper Nonneman^1,2, Michel De Paepe^1,2,3

1: Ghent University, Ghent, Belgium; 2: FlandersMake@UGent - Core lab MIRO, Leuven, Belgium; 3: University of Cape Town, Cape Town, South Africa

Electro-thermal Analysis of p-GaN Gate e-mode HEMTs with Ohmic and Schottky Gates

Minji Kim, Jiun Oh, Joon Seop Kwak

Korea Institute of Energy Technology, Korea, Republic of (South Korea)

Numerical Study of Transient Heat Transport in 4H-SiC Triggered by UV Laser Pulses

Janusz Wozny, Andrzej Kubiak, Alessandro Verdolotti, Ewa Raj

Lodz University of Technology, Poland

SPICE Modeling of GaN HEMTs in the Wide Temperature Range (−269°C…+500°C)

Konstantin O. Petrosyants, Mamed R. Ismail-zade, Lev M. Sambursky

National Research University Higher School of Economics (Moscow Institute of Electronics and Mathematics), Russian Federation

Numerical Investigation of the Thermal Behavior of 3-D GaN LEDs for Thermal-Aware Design

Ciro Scognamillo¹, Antonio Pio Catalano¹, Janusz Wozny², Ewa Raj², Vincenzo d'Alessandro¹

1: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2: Department of Semiconductor and Optoelectronics Devices, Lodz University of Technology, Politechniki 10, 93-590 Lodz, Poland

Failure Analysis for Electronic Packaging Materials: A Comparative Study of Pulsed and Lock-In Thermography

Yanan Wu^1,2, Kaushal Arun Pareek¹, Daniel May², Marek Zajaczkowski¹, Corinna Grosse-Kockert¹, Mohamad Abo Ras¹, Ralpf Schacht³, Bernhard Wunderle^2,4

1: Berliner Nanotest und Design GmbH, Germany; 2: Technische Universität Chemnitz, Germany; 3: Brandenburg University of Technology Cottbus-Senftenberg, Germany; 4: Fraunhofer ENAS, Germany

SPICE-based Switching Energies Estimation of SiC Power Transistors

Paweł Górecki, Krzysztof Górecki

Gdynia Maritime University, Poland

Investigation of the Compact Thermal Modeling of SiC-based Power MOSFETs

Antonio Pio Catalano¹, Gianpaolo Romano², Michele Riccio¹, Andrea Irace¹, Lorenzo Codecasa³, Vincenzo d'Alessandro¹

1: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Italy; 2: StarPower Europe AG, Baden, Switzerland; 3: Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy

3D Modelling of Mass and Heat Transport in Multi-Phase Microfluidic Systems

Zsombor Szomor¹, Tamás Pardy², Péter Fürjes¹

1: Centre for Energy Research, Hungary; 2: Tallinn University of Technology

A Time-Efficient Approach to Thermal-electrical Analysis of Six-pack IGBT-based Power Module

Debora Crimi, Edoardo Marchica, Emanuela Privitera, Radha Russo

Nexperia B.V.

Reduced BJT Power Dissipation via Saturated Operation in Full Wave Rectifiers

Riccardo Carotenuto¹, Demetrio Iero¹, Massimo Merenda¹, Francesco G. Della Corte²

1: Mediterranea University of Reggio Calabria; 2: University of Napoli Federico II, Italy

Peltier Cooling for Thermal Management and Efficiency Enhancement in Perovskite Solar Cells

Hichem Bencherif¹, Ziyad Younsi¹, Francesco Della Corte²

1: Higher National School of Renewable Energies, Environment and Sustainable Development, Campus Fesdis, Batna 05078, Algeria; 2: Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy

Thermal Performance of Server Voltage Regulator Modules in Liquid and Air-cooling System

Donata Gualandris, Andrea Garuffo

STMicroelectronics, Italy

Thermal Characterization of Heat Pipe Embedded Heat Spreaders for High Performance Computer Cooling in Automotives

Baris Erol¹, Daniel May¹, Bernhard Wunderle^1,2

1: Chemnitz University of Technology; 2: Fraunhofer ENAS

Three-Omega Method for Characterization of Thermal Conductivity of Samples at Cryogenic Temperatures

Carlos Rincon-Ruiz¹, Nathanael Jöhrmann¹, Uwe Zschenderlein¹, Corinna Grosse-Kockert⁵, Bernhard Wunderle^1,2,3,4

1: Technische Universität Chemnitz, Germany; 2: Fraunhofer ENAS, Chemnitz, Germany; 3: Center for Micro- and Nanotechnologies (ZfM), Chemnitz, Germany; 4: Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz, Germany; 5: Nanotest Berlin, Germany

Fast Extraction of Thermal System Model for a Silicon Carbide Power Module Based on a 1D and 3D Hybrid Simulation Framework

Zhaozan Feng, Jianfeng Li, Jinzhou Cao, Guomeng Song, Yangju Zou, Yu Qi

Zhuzhou CRRC Times Electric UK Innovation Center, United Kingdom

Effect of the Condenser on the Thermal Performance of a Mini Loop Heat Pipe

Kelvin Guessi Domiciano, Larissa Krambeck, Maria Eduarda Beé, Marcia Barbosa Henriques Mantelli

Federal University of Santa Catarina, Brazil

An Advanced High Temperature Device Heating Methodology for Automotive Grade Zero Conditions

Heinrich Helldorff¹, Michael Glavanovics¹, Bernd Deutschmann², Alexander Ulbing¹, Gerhard Glatte¹

1: KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Austria; 2: Graz University of Technology

Optimizing Boosting for Faster Calorimetric Measurement of High-Efficiency Electric Machines

Jasper Nonneman^1,2, Ilya T'Jollyn³, Jeroen De Kooning^1,2, Michel De Paepe^1,2,4

1: Ghent University, Ghent, Belgium; 2: FlandersMake@UGent - Core lab MIRO, Leuven, Belgium; 3: University of Antwerp, Antwerp, Belgium; 4: University of Cape Town, Cape Town, Sout Africa

Verification of Thermal Transient Measurement Methods for Cascode Type SiC JFETs

Wasanthamala Badalawa, Yoshitaka Aoki, Tomoaki Hara

SIEMENS, Japan

Numerical Thermal Analysis of Liquid-Cooled Electric Motors for High-Performance Applications

Ozan Atalay, Ahmet Comez, Ali Eray Torun, Caner Demir

ASELSAN, Turkiye

Fast Approach with Analytical Models for Heat Sink Modelling and Optimization

Dinuka Herath^1,2, Ibrahim Harbi², Aleksei Maksimov², Thiwanka Wijekoon²

1: Technical University Munich; 2: Huawei Technologies Duesseldorf GmbH

Cooling Strategies for PCB-Mounted MOSFETs: Comparative Analysis and Numerical Simulations

Monzer Rayya, Cagri Balikci

CARIAD SE, Germany

Experimental Investigation of Flow Boiling Heat Transfer in Different Flow Regimes

Jana Rogiers¹, Jasper Nonnemann^1,2, Hendrik Vansompel^1,2, Michel De Paepe^1,2,3

1: Ghent Universtity, Ghent, Belgium; 2: FlandersMake@UGent – Core lab MIRO, Leuven, Belgium; 3: University of Cape Town, Cape Town, South Africa

Development and Integration of Phase Change Materials to Limit Operating Temperatures

Mathias Nowottnick, Andrej Novikov, Dirk Seehase, Leander Lorenz

University of Rostock, Germany

An Approach to Thermoelectric Module Selection: Analytical Simulation and Experimental Test

Fabio Capolupo^1,2, Pesapane Mara¹, Marilena Musto^1,2, Russo Roberto²

1: Industrial Engineering Department, University of Napoli “Federico II”, Piazzale Vincenzo Tecchio, 80, Napoli, 80125, Italy; 2: Institute of Applied Sciences and Intelligent Systems, National Research Council of Italy, Via Pietro Castellino 111, Napoli, 80131, Italy

Electrochemical-Thermal Modelling of Forced Convection Immersion Cooling of an 8-Cell Lithium-Ion Prismatic Battery Module

Rajesh Nimmagadda, David W.Salter, Kantharuphan Annathurai, Daniel Trimble, Seamus M. O’Shaughnessy

Department of Mechanical, Manufacturing & Biomedical Engineering, Trinity College Dublin, Ireland

FEM-Assisted Design and Characterization of a New Lithium Battery Pack-Heatsink Assembly

Nicola Delmonte¹, Danilo Santoro¹, Davide Spaggiari¹, Filippo Gerbino¹, Paolo Cova¹, Ane Sainz De La Maza^2,3, Edorta Ibarra², Elena Trancho³, Roberto Menozzi¹

1: University of Parma, Department of Engineering and Architecture, Italy; 2: University of the Basque Country, Department of Electronic Technology, Spain; 3: Tecnalia, Basque Research and Technology Alliance (BRTA), Spain

Investigation and Compact Modeling of Self-heating in Buried Gate Carbon Nanotube Field-effect Transistors

Deepak Kumar¹, Michael Schröter^1,2

1: Technische Universität Dresden, Germany; 2: Advanced Device Modeling Enterprises, Escondido, CA, USA