Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Please note that all times are shown in the time zone of the conference. The current conference time is: 18th Aug 2025, 03:33:00pm CEST

 
 
Session Overview
Date: Wednesday, 24/Sept/2025
8:00am
-
8:50am
Desk Registration
8:50am
-
9:00am
Welcome
Location: Aula Magna
9:00am
-
9:40am
1st Keynote: Out-of-SOA Electrothermal Limitations of Power Semiconductor Devices: Characterization and Modeling
Location: Aula Magna
Andrea Irace, University of Naples Federico II
9:40am
-
10:00am
Vendors session
Location: Aula Magna
10:00am
-
10:20am
1st Coffee Break
10:20am
-
11:20am
1.A: Cooling Approaches for Devices, Packages, and Systems 1
Location: Aula Magna
 

Enhanced Heat Transfer and Flow Characteristics in a Liquid-cooled Microchannel with Adjacent Micro-Synthetic Jets: Influence of Reynolds Number and Stroke Length

Delara Soltani1, Tim Persoons2, Sajad Alimohammdi1

1: Technological University Dublin, Ireland; 2: Trinity College Dublin, Ireland



Enhancing the Controllability of Forced Convection Liquid Cooling with Minichannel Heatsinks using Pulsating Flow of Variable Frequency

Galina Kennedy, Tim Persoons

Trinity College Dublin, Ireland



Heat Transfer Enhancement by Metamaterial Structures for Semiconductor Cooling

Md Lokman Hosain1, Orlando Girlanda1, Saeed Maleksaeedi2

1: Hitachi Energy Research, Sweden; 2: University of Waterloo, Canada

1.B: Thermal Management of Batteries 1
Location: Aula A
 

Air-Cooled Versus Liquid-Cooled Flat Pulsating Heat Pipes for Battery Thermal Management

Hazhir Fatahi, Arthur Labalte, Anil Kumar, Amrid Amnache, Luc G Fréchette

Université de Sherbrooke, QC, Canada



Fluid Dynamics in Immersion Battery Cooling: Linking Coolant Vortex Structures to Thermal Gradients and Lithium-ion Cell Performance and Longevity

Jibin Mathai Joy1,2, Mattia Duranti2, Edoardo Gino Macchi2, Dibakar Rakshit1

1: Department of Energy Science and Engineering, IIT Delhi, Hauz Khas, Delhi; 2: Sustainable Energy (SE) , Fondazione Bruno Kessler, Trento, Italy



Numerical and Experimental Investigation of Liquid Tab Cooling of a Prismatic Battery

David W. Salter, Aidan Mullaney, Kantharuphan Annathurai, Rajesh Nimmagadda, Daniel Trimble, Seamus O'Shaughnessy

Trinity College Dublin, Ireland

11:20am
-
11:40am
2nd Coffee Break
11:40am
-
1:00pm
2.A: Cooling Approaches for Devices, Packages, and Systems 2
Location: Aula Magna
 

Efficient Chip-integrated Microfluidic Cooling Through Jet-enhanced Manifold Microchannels

Weiyu Tang, Hongkeng Zhu, Ibrahim Osama Elhagali, Elison Matioli

Power and Wide-Band-Gap Electronics Research Laboratory (POWERlab), École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland



Self-Oscillating Reeds for Heat Transfer Enhancement in Fin Channels

Sourabh Kumar Jha, Ari Glezer

Georgia Institute of Technology, United States of America



An Experimental Investigation of Guided Flow Liquid Cooling Methods on a Four Cell Prismatic Module

David W. Salter, Ciaran Huckfeldt, Kantharuphan Annathurai, Rajesh Nimmagadda, Daniel Trimble, Seamus O'Shaughnessy

Trinity College Dublin, Ireland



Manufacturing and Design Optimisation of an Air Amplifier for Data Centre Server Cooling Applications

David W. Salter1,2, Eoin H. Oude Essink1, Gordon O'Brien2, Tim Persoons2, Sajad Alimohammadi1

1: Technological University Dublin, Ireland; 2: Trinity College Dublin, Ireland

2.B: Thermal Management of Batteries 2
Location: Aula A
 

A Numerical and Experimental Comparative Study on Cold Plate Cooling of a 5.6kW Tesla Battery Pack

Kantharuphan Annathurai, David Salter, Rajesh Nimmagadda, Daniel Trimble, Seamus O'Shaughnessy

Trinity College Dublin, Ireland



Thermal Performance of a Heat Pipe with Triangular Grooves for Battery Cooling Applications in Electric Vehicles

Sabrina Costa Chichinelli, Larissa Krambeck, Kelvin Guessi Domiciano, Ricardo Brandalise Botelho, Marcia Barbosa Henriques Mantelli

Federal University of Santa Catarina, Brazil



Temperature Estimation and Thermal Runaway Detection in a Novel Battery Module Arrangement Incorporating a Reduced Number of Sensors

Ane Sainz De La Maza Escobal1,2, Filippo Gerbino3, Davide Spaggiari3, Danilo Santoro3, Edorta Ibarra2, David Ansean4, Elena Trancho1, Nicola Delmonte3

1: Tecnalia, Basque Research and Technology Alliance (BRTA), Derio, Spain; 2: University of the Basque Country (UPV/EHU), Bilbao, Spain; 3: University of Parma, Parma, Italy; 4: Department of Electrical Engineering, University of Oviedo, Gijón, Spain



Thermal Management of Battery Cells in Electric Vehicles: Design and Analysis under Various C-Rates and Environmental Conditions

Ali Eray Torun, Ahmet Çömez, Caner Demir, Hakan Uysal

ASELSAN, Türkiye

1:00pm
-
2:00pm
Lunch
2:00pm
-
3:00pm
Poster Session A
Location: Aula Magna
 

Critical Analysis of Intersection-point-based Techniques for the Experimental Indirect Determination of Thermal Resistance in Bipolar Transistors

Vincenzo d'Alessandro1, Ciro Scognamillo1, Antonio Pio Catalano1, Lorenzo Codecasa2

1: Department of Electrical Engineering and Information Technology, University Federico II, Naples, Italy; 2: Department of Electronics, Information, and Bioengineering, Polytechnic of Milan, Milan, Italy



HTRB-Based Assessment of Epoxy Mold Compounds Using a Multi-DUT Monitoring Platform

Alessandro Borghese, Guglielmo Marignetti, Giuseppe Capasso, Giovanni Breglio, Luca Maresca, Michele Riccio, Andrea Irace

University of Naples Federico II, Italy



Temperature‐dependent equivalent circuit modeling of PiN diodes for accurate electromagnetic simulations of reconfigurable intelligent surfaces

Ilaria Matacena, Vincenzo d'Alessandro

University of Naples Federico II, Italy



Aging Effect on Temperature Behaviour in Li-ion Battery Cell: a Case of Study

Adolfo Dannier, Marino Coppola, Mattia Ribera, Diego Iannuzzi

University of Napoli Federico II, Italy



Improving Photovoltaic Reliability with Temperature-aware Hot-spot Mitigation

Gerardo Saggese, Monica De Riso, Pierluigi Guerriero, Santolo Daliento

University of Napoli Federico II, Italy



Experimental Evaluation of a Passive Dual Two-Phase Cooling System for Ev Batteries Using a Dielectric Fluid and a Pulsating Heat Pipe

Luca Cattani1, Federico Sacchelli1, Fabio Bozzoli1, Alessandro Soldati2, Alex Musetti2

1: Department of Engineering for Industrial Systems and Technologies,University of Parma, Italy; 2: Department of Engineering and Architecture, University of Parma, Italy



Hysteresis Phenomenon in the Electric Parameters of Lithium-ion Batteries under Temperature Effects

Simone Barcellona1, Lorenzo Codecasa1, Silvia Colnago2, Dario D'Amore1

1: Politecnico di Milano, DEIB, Italy; 2: Ricerca sul Sistema Energetico, TGM, S.p.A.



Development of 1D Simulation Methodology and Automation for Predicting the Cooling Performance of an Electric Vehicle Battery System

Samuel Yu, Jinwon Seo, Bongkeun Choi

Hyundai Mobis, Korea, Republic of (South Korea)



Solder Joint Fatigue Study on Integrate Circuit Components for Telecom Products

Kaixiang Yang

Ericsson Sweden AB, Sweden



Thermal analysis of a 5G telecom demonstrator in FO-WLP SiP with Integrated GaN Power Amplifier and GaAs Low Noise Amplifier

Anass Jakani1, Jean-Claude Jacquet1, N'Doua Luc Arnaud Kakou2, Mohamed Bouslama1, Vincent Bortolussi3, Nicolas Sarazin4, Benoit Lambert3, Raphael Sommet2, Stephane Piotrowicz1, Gildas Gauthier1

1: III-V Lab, France; 2: XLIM, France; 3: UMS (United Monolithic Semiconductors), France; 4: TRT (Thales Research & Technology)



Characterisation of Thermal Interface Materials Under Sustained Cyclic Thermo-Mechanical Loading

Philip Matzick, Christian Mentin, Stefan Mollov

Silicon Austria Labs, Austria



Multi-scale and Multi-physics Analysis Of a GaN System in Package Using Fan Out Wafer Level Packaging (FO-WLP) Technology

N’Doua Luc Arnaud Kakou1, José Anderson Silva dos Santos1, Raphael Sommet1, Vincent Bortolussi2, Anass Jakani3, Jean-Christophe Nallatamby1

1: XLIM, UMR7252, Université de Limoges, France; 2: United Monolithic Semiconductor, Villebon sur Yvette, France; 3: 3 - 5 Lab, Palaiseau, France



In-chip Liquid Cooling using Directly Integrated Jet Impingement with Enhanced Pin Fins

Ibrahim Osama Ibrahim Elhagali, Hongkeng Zhu, Weiyu Tang, Elison Matioli

EPFL, Switzerland



Improved Thermal Transient Testing of GaN Devices Manufactured with Various Construction Principles

Sandor Ress1,2, Gabor Farkas1, Mahmoud Darwish1, Marta Rencz2, Zoltan Sarkany1

1: SIEMENS DISW, Hungary; 2: Budapest University of Technology and Economics, Hungary



Thermal Characterization of a Novel Direct Cooler Design for Modular Power Devices

Filippo Gerbino, Luca Cattani, Fabio Bozzoli, Davide Spaggiari, Paolo Cova, Roberto Menozzi

University of Parma, Italy



4H-SiC Power MOSFET Body Diode as a Highly-linear Temperature Sensor for Tj Monitoring

Francesco Della Corte1, Riccardo Carotenuto2, Demetrio Iero2, Massimo Merenda2, Giovanni Pangallo2

1: University of Napoli Federico II, Italy; 2: Mediterranea University of Reggio Calabria, Italy



Thermal analysis of fast-charger contactless power transfer for electric buses

Luigi Pio Di Noia, Renato Rizzo

University of Napoli Federico II, Italy



Prediction of Dynamic Thermal Behavior of Novel Ceramics for Power Devices Using Numerical Simulations

Peter Gabor Szabo, Gyorgy Bognar, Laszlo Pohl

Budapest University of Technology and Economics, Hungary



Numerical Investigation on Thermal Behaviour of Horizontal Plate Heat Sink with Metal Foam Partially Embedded in PCM for Passive Cooling System

Aanandsundar Arumugam, Bernardo Buonomo, Furio Cascetta, Oronzio Manca, Sergio Nardini

Universita' degli Studi della Campania "Luigi Vanvitelli", Italy

3:00pm
-
4:00pm
3rd Coffee Break and Poster Viewing
Location: Aula Polifunzionale
4:00pm
-
5:40pm
3.A: Cooling Approaches for Devices, Packages, and Systems 3
Location: Aula Magna
 

On the Role of Turbulence and Swirl on Heat Transfer Enhancement in Developing Pipe Flow

Lorenzo Testa, Tim Persoons

Trinity College Dublin, Ireland



Numerical Investigation of Gradient-based Alveoli Microchannel Heat Sinks Embedded with Hotspots for Electronic Cooling Applications

Mahalingam Periasamy, Ganesan Narendran

IIITDM Kancheepuram, India



Stainless-steel Flat Plate Pulsating Heat Pipe: An Alternative for Electronic Cooling

Larissa Krambeck1, Kelvin G. Domiciano1, Maria E. Beé1, Marco Marengo2, Marcia B. H. Mantelli1

1: Heat Pipe Laboratory, Federal University of Santa Catarina, Florianopolis/SC, Brazil; 2: Department of Civil Engineering and Architecture, University of Pavia, Pavia, Italy



A Deep Dive into an Air Cooled Data Centre’s Mechanical Cooling System Energy Consumption

Younis Osama Abdelsalam1, Tim Persoons2, Sajad Alimohammadi1

1: School of Mechanical & Design Engineering, College of Engineering & Built Environment, Technological University Dublin, City Campus, Dublin D01 K822, Ireland; 2: Department of Mechanical, Manufacturing & Biomedical Engineering, University of Dublin, Trinity College, Dublin D02 PN40, Ireland



Testing of Two-Phase Cooling of Bipolar Plates for Fuel Cells

Henk Jan van Gerner1, Georg Mühlthaler2, Marcus-Benedict Buntz3

1: NLR - Royal Netherlands Aerospace Centre, 1059 CM Amsterdam, The Netherlands; 2: Airbus Commercial Aircraft, 22335 Hamburg, Germany; 3: Aerostack GmbH, 72581 Dettingen, Germany

3.B: Advanced packaging solutions
Location: Aula A
 

Thermal Management Investigation of a V-band GaN Amplifier Embedded into an Advanced Package

Mohamed Bouslama1, Anass Jakani1, Jean-Claude Jacquet1, Stéphane Piotrowicz1, Louiza Hamidouche1, Quentin Levesque1, Benoit Lambert2, Gildas Gauthier1

1: III-V Lab, France; 2: UMS S.A.S, France



Thermal Contact Resistance Improvement Between Clip Attached TO- 247 Package and Heat Sink with Insertion of an Ultra-Thin Interlayer Silver Film

Zsolt Toth-Pal, Hans-Peter Nee

KTH Royal Institute of Technology, Sweden



Laser Powder Bed Fusion of Multi-Material Heat Sink on Silicon Substrate: A Sn-Al Solution for High-power Electronic Heat Dissipation

Andrea Mistrini1, Amin Hodaei2, Martina Meisnar3, Davoud Jafari2, Riccardo Casati1

1: Politecnico di Milano; 2: University of Twente; 3: European Space Agency



Pool Boiling Heat Transfer on Directly 3D-printed Metallic Micropillars on Silicon Chips

Andrea Mistrini1, Irene Marchi2, Amin Hodaei3, Shirin Dehgahi3, Alekos Ioannis Garivalis2, Paolo Di Marco2, Riccardo Casati1, Davoud Jafari3

1: Politecnico di Milano, Italy; 2: University of Pisa, Italy; 3: University of Twente, The Netherlands



Graphene Aerogel Enhancement for Next-Generation Ultralight Thermal Management Applications

Jiho Kang1, Viet Phuong Nguyen2,3, Seung-Mo Lee2,3, Duckjong Kim1

1: Gyeongsang National University, Korea, Republic of (South Korea); 2: Nanomechatronics, University of Science and Technology (UST); 3: Department of Nanomechanics, Korea Institute of Machinery & Materials (KIMM)

7:00pm
-
9:00pm
Welcome Cocktail at Circolo Canottieri