Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Please note that all times are shown in the time zone of the conference. The current conference time is: 18th Aug 2025, 03:33:00pm CEST
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Session Overview |
Date: Wednesday, 24/Sept/2025 | ||
8:00am - 8:50am |
Desk Registration |
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8:50am - 9:00am |
Welcome Location: Aula Magna |
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9:00am - 9:40am |
1st Keynote: Out-of-SOA Electrothermal Limitations of Power Semiconductor Devices: Characterization and Modeling Location: Aula Magna Andrea Irace, University of Naples Federico II |
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9:40am - 10:00am |
Vendors session Location: Aula Magna |
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10:00am - 10:20am |
1st Coffee Break |
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10:20am - 11:20am |
1.A: Cooling Approaches for Devices, Packages, and Systems 1 Location: Aula Magna Enhanced Heat Transfer and Flow Characteristics in a Liquid-cooled Microchannel with Adjacent Micro-Synthetic Jets: Influence of Reynolds Number and Stroke Length 1: Technological University Dublin, Ireland; 2: Trinity College Dublin, Ireland Enhancing the Controllability of Forced Convection Liquid Cooling with Minichannel Heatsinks using Pulsating Flow of Variable Frequency Trinity College Dublin, Ireland Heat Transfer Enhancement by Metamaterial Structures for Semiconductor Cooling 1: Hitachi Energy Research, Sweden; 2: University of Waterloo, Canada |
1.B: Thermal Management of Batteries 1 Location: Aula A Air-Cooled Versus Liquid-Cooled Flat Pulsating Heat Pipes for Battery Thermal Management Université de Sherbrooke, QC, Canada Fluid Dynamics in Immersion Battery Cooling: Linking Coolant Vortex Structures to Thermal Gradients and Lithium-ion Cell Performance and Longevity 1: Department of Energy Science and Engineering, IIT Delhi, Hauz Khas, Delhi; 2: Sustainable Energy (SE) , Fondazione Bruno Kessler, Trento, Italy Numerical and Experimental Investigation of Liquid Tab Cooling of a Prismatic Battery Trinity College Dublin, Ireland |
11:20am - 11:40am |
2nd Coffee Break |
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11:40am - 1:00pm |
2.A: Cooling Approaches for Devices, Packages, and Systems 2 Location: Aula Magna Efficient Chip-integrated Microfluidic Cooling Through Jet-enhanced Manifold Microchannels Power and Wide-Band-Gap Electronics Research Laboratory (POWERlab), École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland Self-Oscillating Reeds for Heat Transfer Enhancement in Fin Channels Georgia Institute of Technology, United States of America An Experimental Investigation of Guided Flow Liquid Cooling Methods on a Four Cell Prismatic Module Trinity College Dublin, Ireland Manufacturing and Design Optimisation of an Air Amplifier for Data Centre Server Cooling Applications 1: Technological University Dublin, Ireland; 2: Trinity College Dublin, Ireland |
2.B: Thermal Management of Batteries 2 Location: Aula A A Numerical and Experimental Comparative Study on Cold Plate Cooling of a 5.6kW Tesla Battery Pack Trinity College Dublin, Ireland Thermal Performance of a Heat Pipe with Triangular Grooves for Battery Cooling Applications in Electric Vehicles Federal University of Santa Catarina, Brazil Temperature Estimation and Thermal Runaway Detection in a Novel Battery Module Arrangement Incorporating a Reduced Number of Sensors 1: Tecnalia, Basque Research and Technology Alliance (BRTA), Derio, Spain; 2: University of the Basque Country (UPV/EHU), Bilbao, Spain; 3: University of Parma, Parma, Italy; 4: Department of Electrical Engineering, University of Oviedo, Gijón, Spain Thermal Management of Battery Cells in Electric Vehicles: Design and Analysis under Various C-Rates and Environmental Conditions ASELSAN, Türkiye |
1:00pm - 2:00pm |
Lunch |
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2:00pm - 3:00pm |
Poster Session A Location: Aula Magna Critical Analysis of Intersection-point-based Techniques for the Experimental Indirect Determination of Thermal Resistance in Bipolar Transistors 1: Department of Electrical Engineering and Information Technology, University Federico II, Naples, Italy; 2: Department of Electronics, Information, and Bioengineering, Polytechnic of Milan, Milan, Italy HTRB-Based Assessment of Epoxy Mold Compounds Using a Multi-DUT Monitoring Platform University of Naples Federico II, Italy Temperature‐dependent equivalent circuit modeling of PiN diodes for accurate electromagnetic simulations of reconfigurable intelligent surfaces University of Naples Federico II, Italy Aging Effect on Temperature Behaviour in Li-ion Battery Cell: a Case of Study University of Napoli Federico II, Italy Improving Photovoltaic Reliability with Temperature-aware Hot-spot Mitigation University of Napoli Federico II, Italy Experimental Evaluation of a Passive Dual Two-Phase Cooling System for Ev Batteries Using a Dielectric Fluid and a Pulsating Heat Pipe 1: Department of Engineering for Industrial Systems and Technologies,University of Parma, Italy; 2: Department of Engineering and Architecture, University of Parma, Italy Hysteresis Phenomenon in the Electric Parameters of Lithium-ion Batteries under Temperature Effects 1: Politecnico di Milano, DEIB, Italy; 2: Ricerca sul Sistema Energetico, TGM, S.p.A. Development of 1D Simulation Methodology and Automation for Predicting the Cooling Performance of an Electric Vehicle Battery System Hyundai Mobis, Korea, Republic of (South Korea) Solder Joint Fatigue Study on Integrate Circuit Components for Telecom Products Ericsson Sweden AB, Sweden Thermal analysis of a 5G telecom demonstrator in FO-WLP SiP with Integrated GaN Power Amplifier and GaAs Low Noise Amplifier 1: III-V Lab, France; 2: XLIM, France; 3: UMS (United Monolithic Semiconductors), France; 4: TRT (Thales Research & Technology) Characterisation of Thermal Interface Materials Under Sustained Cyclic Thermo-Mechanical Loading Silicon Austria Labs, Austria Multi-scale and Multi-physics Analysis Of a GaN System in Package Using Fan Out Wafer Level Packaging (FO-WLP) Technology 1: XLIM, UMR7252, Université de Limoges, France; 2: United Monolithic Semiconductor, Villebon sur Yvette, France; 3: 3 - 5 Lab, Palaiseau, France In-chip Liquid Cooling using Directly Integrated Jet Impingement with Enhanced Pin Fins EPFL, Switzerland Improved Thermal Transient Testing of GaN Devices Manufactured with Various Construction Principles 1: SIEMENS DISW, Hungary; 2: Budapest University of Technology and Economics, Hungary Thermal Characterization of a Novel Direct Cooler Design for Modular Power Devices University of Parma, Italy 4H-SiC Power MOSFET Body Diode as a Highly-linear Temperature Sensor for Tj Monitoring 1: University of Napoli Federico II, Italy; 2: Mediterranea University of Reggio Calabria, Italy Thermal analysis of fast-charger contactless power transfer for electric buses University of Napoli Federico II, Italy Prediction of Dynamic Thermal Behavior of Novel Ceramics for Power Devices Using Numerical Simulations Budapest University of Technology and Economics, Hungary Numerical Investigation on Thermal Behaviour of Horizontal Plate Heat Sink with Metal Foam Partially Embedded in PCM for Passive Cooling System Universita' degli Studi della Campania "Luigi Vanvitelli", Italy |
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3:00pm - 4:00pm |
3rd Coffee Break and Poster Viewing Location: Aula Polifunzionale |
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4:00pm - 5:40pm |
3.A: Cooling Approaches for Devices, Packages, and Systems 3 Location: Aula Magna On the Role of Turbulence and Swirl on Heat Transfer Enhancement in Developing Pipe Flow Trinity College Dublin, Ireland Numerical Investigation of Gradient-based Alveoli Microchannel Heat Sinks Embedded with Hotspots for Electronic Cooling Applications IIITDM Kancheepuram, India Stainless-steel Flat Plate Pulsating Heat Pipe: An Alternative for Electronic Cooling 1: Heat Pipe Laboratory, Federal University of Santa Catarina, Florianopolis/SC, Brazil; 2: Department of Civil Engineering and Architecture, University of Pavia, Pavia, Italy A Deep Dive into an Air Cooled Data Centre’s Mechanical Cooling System Energy Consumption 1: School of Mechanical & Design Engineering, College of Engineering & Built Environment, Technological University Dublin, City Campus, Dublin D01 K822, Ireland; 2: Department of Mechanical, Manufacturing & Biomedical Engineering, University of Dublin, Trinity College, Dublin D02 PN40, Ireland Testing of Two-Phase Cooling of Bipolar Plates for Fuel Cells 1: NLR - Royal Netherlands Aerospace Centre, 1059 CM Amsterdam, The Netherlands; 2: Airbus Commercial Aircraft, 22335 Hamburg, Germany; 3: Aerostack GmbH, 72581 Dettingen, Germany |
3.B: Advanced packaging solutions Location: Aula A Thermal Management Investigation of a V-band GaN Amplifier Embedded into an Advanced Package 1: III-V Lab, France; 2: UMS S.A.S, France Thermal Contact Resistance Improvement Between Clip Attached TO- 247 Package and Heat Sink with Insertion of an Ultra-Thin Interlayer Silver Film KTH Royal Institute of Technology, Sweden Laser Powder Bed Fusion of Multi-Material Heat Sink on Silicon Substrate: A Sn-Al Solution for High-power Electronic Heat Dissipation 1: Politecnico di Milano; 2: University of Twente; 3: European Space Agency Pool Boiling Heat Transfer on Directly 3D-printed Metallic Micropillars on Silicon Chips 1: Politecnico di Milano, Italy; 2: University of Pisa, Italy; 3: University of Twente, The Netherlands Graphene Aerogel Enhancement for Next-Generation Ultralight Thermal Management Applications 1: Gyeongsang National University, Korea, Republic of (South Korea); 2: Nanomechatronics, University of Science and Technology (UST); 3: Department of Nanomechanics, Korea Institute of Machinery & Materials (KIMM) |
7:00pm - 9:00pm |
Welcome Cocktail at Circolo Canottieri |