Thermal and Thermo-mechanical Behavior of Internal Silver-diamond Heat Spreaders for Power Electronic Modules

Aitor Casado Ramoneda^1,2, Yvan Avenas¹, Rabih Khazaka², Cyrille Gautier², Toni Youssef²

1: Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab, 38000 Grenoble, France; 2: Safran Tech, Electrical & Electronic Systems Research Group, 78772 Châteaufort, France

Holistic Thermal Management System Design, Testing, and Modeling for 300 kW IGBT-Based Inverter for Switched Reluctance Motor Drives

Mohamed Hefny¹, Ahmed Zaghlol², Kamal Vaghasiya¹, Rachit Pradhan¹, Mohamed Omar¹, Ali Emadi¹

1: McMaster Automotive Resource Centre (MARC)-McMaster University, Ontario, Canada; 2: Innovative Thermal Solutions (ITS), Ontario, Canada

Precise 3D Modelling of SiC Dies Temperature Oscillations for Lifetime Prediction of Power Modules Used in DC/AC Power Converters

Alexandre Marie¹, Bernardo Cougo², Loic Renaudie¹, Tresor Kaounodji Koladoum¹, Jean-Pierre Fradin¹

1: ICAM School of Engineering, Toulouse, France; 2: IRT Saint-Exupery, Toulouse, France

Thermo-Mechanical Investigations for PCB Assemblies Using Top-side Cooled Power Devices

Philip Matzick, Christian Mentin, Lukas Adelbrecht, Elisa Anes Romero, Roberto Petrella

Silicon Austria Labs, Austria

Numerical Investigation of a Novel Lid Design for Automotive HPC Cooling

Baris Erol¹, Daniel May¹, Bernhard Wunderle^1,2

1: Chemnitz University of Technology, Chemnitz, Germany; 2: Fraunhofer ENAS, Chemnitz, Germany

Experimental Validation of Thermal-Adjoint Topological Optimization for Cooling Plate Design

Federico Piscaglia¹, Emanuele Gallorini¹, Federico Ghioldi¹, Alexandre Marie², Jean-Pierre Fradin², Jerome Helie³

1: Politecnico di Milano, Milan, Italy; 2: ICAM, Toulouse, France; 3: VITESCO Technologies, Toulouse, France

3D-Printed Direct Liquid Multi-Jet Impingement Cooling Solutions for Power Electronics in Electrified Automotive Transportation

Reza Moloudi¹, Bart Vandevelde¹, Willem Verleysen², Silke G. C. Cleuren², Lucie Masquelet³, Maik Sternberg⁴, Adrian Stelzer⁵, Andreas Burghardt⁶, Przemyslaw Jakub Gromala⁶

1: IMEC, Leuven, Belgium; 2: Materialise, Leuven, Belgium; 3: Sadechaf, Turnhout, Belgium; 4: Nanotest, Berlin, Germany; 5: Nano-Join, Berlin, Germany; 6: Bosch, Reutlingen, Germany

Lanczos-based Foster-to-Cauer Transformation for Network Identification by Deconvolution

Nils Jonas Ziegeler^1,2, Stefan Schweizer^1,3

1: South Westphalia University of Applied Sciences, Iserlohn, Germany; 2: Hella GmbH & Co. KGaA, Germany; 3: Fraunhofer Application Center for Inorganic Phosphors, Soest, Germany

Hotspot-aware Microfluidic Cooling for High TDP Chips Using Topology Optimization

Athanasios Boutsikakis, Emile Soutter, Miguel A. Salazar de Troya, Nicola Esposito, Dasha Mukasheva, Hanane Bouras, Remco van Erp

Corintis, Switzerland

Optimization of LHP (loop heat pipe) Geometry for Ultra-high Heat Flux Cooling System

Hee Soo Myeong¹, Seok Pil Jang^1,2

1: Department of Smart Air Mobility, Korea Aerospace University, Goyang-si, Korea, Republic of (South Korea); 2: Department of Aeropace and Mechanical Engineering, Korea Aerospace University, Goyang-si, Korea, Republic of (South Korea)

Thermal Characterization of Vertical GaN Based Power Devices

Sandra Fischer, Florian Mayer, Verena Leitgeb, Lisa Mitterhuber, Elke Kraker

Materials Center Leoben Forschung GmbH, Leoben, Austria

Thermal Numerical Modelling of Complex Electronic Devices

Sophie Salvadori, Mahmoud Ali, Viraj Singh, Amandine Battentier

Slb, France

Extracting Time-Constant Spectra by the Subspace Barzilai and Borwei Non-Negative Least Square Algorithm

Joosun Yun¹, Byongjin Ma², Guesuk Lee², Taehee Jung², Dong-Soo Shin³, Youngbeom Kim¹, Hyundon Jung¹

1: EtaMax, Korea, Republic of (South Korea); 2: KETI, Korea, Republic of (South Korea); 3: Hanyang University ERICA,Ansan-si, Republic of (South Korea)

ATARI: Advanced Thermomigration Analysis for Reliability-Aware Interconnects

Olympia Axelou, Eleni Tselepi, George Floros

University of Thessaly, Thessaly, Greece

A Case Study on Exhaust Airflow Rates by the Enclosure Ventilation Fan Structure of a Cast Resin Transformer

Seongeon Kim, Jaeseop Ryu

LS Electric, Korea, Republic of (South Korea)

Modelling Thermal Properties of Power LEDs Module

Krzysztof Górecki, Przemysław Ptak

Gdynia Maritime University, Gdynia, Poland

Numerical Investigation on the Thermal Resistance and Assembly Cost in SSC and DSC Power Modules

Ciro Scognamillo¹, Antonio Pio Catalano¹, Lorenzo Codecasa², Alberto Castellazzi³, Vincenzo d'Alessandro¹

1: University Federico II, Napoli, Italy; 2: Politecnico di Milano, Milan, Italy; 3: Kyoto University of Advanced Science, Kyoto, Japan

Electro-Thermal Characteristics Comparison for FinFET, NWFET and NSFET Structures

Konstantin O. Petrosyants, Denis S. Silkin, Dmitiy A. Popov

National Research University Higher School of Economics, Moscow, Russia

THERMEXP: An Efficient Thermal Analysis method via Matrix Exponential

Pavlos Stoikos, George Floros

University of Thessaly, Thessaly, Greece

Transient Thermal Simulation of a SiP FO-WLP Embedding a GaN Power Amplifier

N'doua Luc Arnaud Kakou¹, Raphael Sommet¹, Anass Jakani², Khalil Karrame¹, Laurent Brunel³, Vincent Bortolussi³, Benoit Lambert³, Jean-Christophe Nallatamby¹

1: XLIM; 2: III-V Lab; 3: UMS

Static Thermal Model of a Fibre-Optic Gyroscope

Marcin Janicki, Piotr Zając, Cezary Maj

Lodz University of Technology, Lodz, Poland

Sustainable Immersion Cooling of Servers

Wendy Luiten¹, John Parry², Robin Bornoff²

1: WLC, Breda, The Netherlands; 2: Siemens Digital Industries Software, Newbury, UK

2D Materials for Thermal Raman Measurements on Power Electronic Devices

Dominique Carisetti¹, Julie Cholet¹, Lucie Frogé¹, Eva Desgué¹, Pierre Legagneux¹, Patrick Garabedian¹, Nicolas Sarazin¹, Pierre Seneor², Bruno Dlubak², Etienne Carré², Marie-Blandine Martin², Vincent Renaudin³, Tony Moinet⁴, Raphael Sommet⁵

1: Thales Research and Technology, Palaiseau, France; 2: Laboratoire Albert Fert, Palaiseau, France; 3: STMicroelectronics, Grenoble, France; 4: STMicroelectronics, Tours, France; 5: XLIM, Brive la gaillarde, France

Performance Assessment of an Advanced Direct-to-chip Liquid Cooling Solution in Real Conditions Inside a Data Centre

David Beberide^1,2, Desideri Regany¹, Jaume Camarasa¹, Jérôme Barrau^1,2, Montse Vilarrubí^1,2

1: Universitat de Lleida, Lleida, Spain; 2: Universal Smart Cooling S.L., Lleida, Spain

Sensorless Dual TSEP Implementation for Junction Temperature Measurement in Parallelized SIC Mosfet

Louis Alauzet^1,2, Jean-Pierre Fradin¹, Patrick Tounsi²

1: ICAM School of Engineering, Toulouse, France; 2: LAAS-CNRS, Université De Toulouse, CNRS, INSA

Impact of GaN Cap Layer and Carbon-Doped Buffer Layer on Thermal Resistance of HEMTs GaN

Khalil Karrame¹, Sujan Sarkar², Ramdas Khade², Jean-Christophe Nallatamby¹, Maggy Colas³, Amitava DasGupta², Nandita DasGupta³, Raphael Sommet¹

1: Xlim, Limoges, France; 2: Indian Institute of Technology Madras, Chennai, India; 3: Centre Européen de la Céramique, Limoges, France

Transient Electro-thermal Characterisation at Systemlevel for a Easypack-IGBT-Module – Reduced order modelling (ROM) and Junction Temperature Evaluation Based on The on-state Resistance

Gregor Wiedemann, Tino Lamm, Ralph Schacht

Brandenburg Technical University Cottbus-Senftenberg, Cottbus, Germany

Thermal Conductivity Prediction of Composites by Hybrid Physics-Based and Data-Driven Modeling

Rudi Steenbakkers

Dow Benelux B.V., Terneuzen, the Netherlands

Closed-loop Flow Boiling Cooler Test Stand for Investigations on Future Power Package Designs

Ralph Schacht¹, J. Ben Majed¹, Tobias Gruen², Daniel May^2,3, Mohamad Abo Ras², Bernhard Wunderle³

1: Brandenburg University of Technology Cottbus-Senftenberg, Cottbus, Germany; 2: Berliner Nanotest und Design GmbH, Berlin, Germany; 3: Chemnitz University of Technology, Chemnitz, Germany

Two-phase Pumped Cooling System for Power Electronics; Analyses and Experimental Results

Henk Jan van Gerner¹, Arne K. te Nijenhuis¹, Changmin Cao², Ignacio Castro², Douglas A. Pedroso², Herol Dsouza²

1: NLR - Royal Netherlands Aerospace Centre, The Netherlands; 2: Collins-ART, Cork, Ireland

Enabling Overloadability in Power Semiconductor Modules by Pulsating Heat Pipe Coolers

Reza Soleimanzadeh, Yanfei Zhao, Marcel Fuchs

Hitachi Energy, Switzerland

Investigation of Aqueous Alcoholic Mixtures as Working Fluids in a Two-phase Pumpless Loop

Arunjoy Baruah, Shankar Krishnan

IIT Bombay, Mumbai, India

Channel to Channel Thermal Coupling of Double-Channel GaN-based HEMTs

Shiming Li, Mei Wu, Ling Yang, Hao Lu, Bin Hou, Meng Zhang, Xiaohua Ma, Yue Hao

Xidian University, Xi'An, China, People's Republic of

Transient Thermal Simulation of a SiP FO-WLP Embedding a GaN Power Amplifier

N'doua Luc Arnaud Kakou¹, Raphael Sommet¹, Anass Jakani², Khalil Karrame¹, Laurent Brunel³, Vincent Bortolussi³, Benoit Lambert³, Jean-Christophe Nallatamby¹

1: XLIM University of Limoges, UMR7252; 2: III-V Lab; 3: UMS S.A.S

Electro-thermal Analysis for Automotive LDOs with Reverse Current Protection

Alessandro Battigelli¹, Cosmin-Sorin Pleșa², Marius Neag¹, Gabriel Simeon²

1: Technical University of Cluj-Napoca, Cluj-Napoca, Romania; 2: Infineon Technologies, Bucharest, Romania

Characterization of the External Thermal Resistance of the Condenser Using the Evaporative Cooling with Porous Medium

Sungjun Park¹, Seok Pil Jang^1,2

1: Department of Smart Air Mobility, Korea Aerospace University, Korea, Republic of (South Korea); 2: Department of Aerospace and Mechanical Engineering, Korea Aerospace University, Korea, Republic of (South Korea)

Thermofluid-dynamic Performance Improvement of Power Electronics Cooling Systems through CFD Analysis

Radha Russo¹, Daniela Cavallaro¹, Marco Papaserio¹, Emanuela Privitera¹, Stefano Mauro²

1: STMicroelectronics, Italy; 2: University of Catania, Catania, Itlay

Application of Phase Change Material for Thermal Management of Space Electronics

Artur Jurkowski, Radosław Paluch

KP Labs, Gliwice, Poland

Extensive Thermal Evaluation to Select Properly the Package Features to Fit the Product Mechanical and Thermal Requirements

Andrea Garuffo, Donata Gualandris

STMicroelectronics, Italy

Thermal Detection of Degradation in Solder Joints of Passive Components

Nils Jahn, Martin Pfost

TU Dortmund University, Dortmund, Germany

Novel Approach to the Extraction of Sparse Nonlinear Dynamic Compact Thermal Multi-Ports

Lorenzo Codecasa¹, Vincenzo d'Alessandro², Antonio Pio Catalano², Ciro Scognamillo², Simone Barcellona¹, Dario D'Amore¹

1: Politecnico di Milano, Milano, Italy; 2: Università Federico II, Naples, Naples, Italy

Real-Time State of Charge Estimation of Lithium-Ion Battery Considering Temperature

Simone Barcellona¹, Lorenzo Codecasa¹, Silvia Colnago², Dario D'Amore¹

1: Politecnico di Milano, Milano, Italy; 2: Ricerca sul Sistema Energetico, S.p.A.

Raman Thermometry: A Simultaneous Structural And Thermal Characterization Technique For GeSbTe Based Phase Change Materials

Akash Patil^1,2, Tushar Chakrabarty^1,2, Yannick Le-Friec², Jury Sandrini², Roberto Simola³, Simon Jeannot², Philippe Boivin³, Emmanuel Dubois¹, Jean-Francois Robillard¹

1: Univ. Lille, Lille, France; 2: STMicroelectronics, Crolles, France; 3: STMicroelectronics, Rousset, France

Layer Resolved Thermal Impedance Measurement with Laser Stimulated Transient Thermal Analysis of Semiconductor Modules

Hannes Schwan, Maximilian Schmid, Gordon Elger

Technische Hochschule Ingolstadt, Ingolstadt, Germany

Thermal Performance Comparison of an Adjustable Air Amplifier with Rotary Fans

David W. Salter^1,2, Eoin H. Oude Essink^1,2, Gordon O'Brien², Tim Persoons², Sajad Alimohammadi^1,2

1: School of Mechanical Engineering, Technological University Dublin, Ireland; 2: Department of Mechanical, Manufacturing & Biomedical Engineering, Trinity College Dublin, Ireland

Degradation Mechanisms in High-Power LEDs: Thermal Analysis of Failure Modes

Nicola Trivellin^1,2, Alessandro Caria², Riccardo Fraccaroli², Giulia Pierobon², Tomas Castellaro², Ambrogio Huang², Julien Magnien³, Joerdis Rosc³, Gyula Lipak⁴, Gusztáv Hantos⁴, Jozsef Hegedus⁴, Carlo De Santi², Matteo Buffolo^2,5, Enrico Zanoni², Andras Poppe², Gaudenzio Meneghesso², Matteo Meneghini^2,5

1: Department of Industrial Engineering, University of Padova, Padova, Italy; 2: Department of Information Engineering, University of Padova, Padova, Italy; 3: Materials Center Leoben Forschung GmbH, Leoben, Austria; 4: Department of Electron Devices, Budapest University of Technology and Economics, Budapest, Hungary; 5: Department of Physics and Astronomy, University of Padova, Padova, Italy

Reliability Testing of Mid-power LEDs for the Extension of Multi-domain LED Models with Elapsed Lifetime as Parameter

Gusztáv Hantos, János Hegedüs, Gyula Lipák, Márton Németh, András Poppe

Budapest University of Technology and Economics, Budapest, Hungary

Thermal Investigations as Part of a Remote Phosphor Aging Test

János Hegedüs, Dalma Takács, Gusztáv Hantos, Márton Németh, András Poppe

Budapest University of Technology and Economics, Budapest, Hungary

Thermal Performance and Visualization of the Boiling-driven Heat Spreader

Su-Yoon Doh¹, Hyunmuk Lim¹, Seung M. You², Jungho Lee¹

1: Ajou university, Korea, Republic of (South Korea); 2: The University of Texas at Dallas, Texas, USA

Comparison Between Single and Two-phase Cooling in a Variable Density Micro-pin-finned Heat Sink

Jaume Camarasa, Montse Vilarrubí, Desideri Regany, David Beberide, Pol Rosell, Alicia Crespo, Joan Rosell, Manel Ibáñez, Jérôme Barrau

Universitat de Lleida, Lleida, Spain

Enhancing Controllability of Forced Convection Cooling with Minichannel Heatsinks Using Pulsating Flow

Galina Kennedy, Tim Persoons

Trinity College Dublin, Dublin, Ireland

Evaporation Resistance of Grooved Wicks Fabricated Using Laser Powder Bed Fusion

Mohamed Hasan¹, Jason Durfee², Roger Kempers¹

1: York University, Toronto, Canada; 2: Magna International Inc

Investigating the Performance of an Additive Manufactured Lattice Heat Sink Versus a Conventional Straight-fin Heat Sink for Railway Application

Ahmad Batikh¹, Jean-Pierre Fradin¹, Antonio Castro Moreno²

1: Icam School of Engineering, Toulouse, France; 2: IRT Saint Exupéry, Toulouse, France

Thermal Characterisation and Technology of Intercalated Graphene-Based Nano-Laminates

Bernhard Wunderle¹, Marc Stevens³, Daniel May¹, Sascha Hermann³, Corinna Grosse-Kockert², Mohamad Abo Ras²

1: TU Chemnitz, Chemnitz, Germany; 2: Berliner Nanotest & Design GmbH, Berlin, Germany; 3: Fraunhofer ENAS, Chemnitz, Germany