Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Please note that all times are shown in the time zone of the conference. The current conference time is: 13th Oct 2024, 07:49:04pm CEST

 
 
Session Overview
Session
Poster Introduction II
Time:
Thursday, 26/Sept/2024:
3:00pm - 3:40pm

Session Chair: Ahmad Batikh, ICAM Toulouse
Location: Main Conference Room


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Presentations

Channel to Channel Thermal Coupling of Double-Channel GaN-based HEMTs

Shiming Li, Mei Wu, Ling Yang, Hao Lu, Bin Hou, Meng Zhang, Xiaohua Ma, Yue Hao

Xidian University, Xi'An, China, People's Republic of



Transient Thermal Simulation of a SiP FO-WLP Embedding a GaN Power Amplifier

N'doua Luc Arnaud Kakou1, Raphael Sommet1, Anass Jakani2, Khalil Karrame1, Laurent Brunel3, Vincent Bortolussi3, Benoit Lambert3, Jean-Christophe Nallatamby1

1XLIM University of Limoges, UMR7252; 2III-V Lab; 3UMS S.A.S



Electro-thermal Analysis for Automotive LDOs with Reverse Current Protection

Alessandro Battigelli1, Cosmin-Sorin Pleșa2, Marius Neag1, Gabriel Simeon2

1Technical University of Cluj-Napoca, Cluj-Napoca, Romania; 2Infineon Technologies, Bucharest, Romania



Characterization of the External Thermal Resistance of the Condenser Using the Evaporative Cooling with Porous Medium

Sungjun Park1, Seok Pil Jang1,2

1Department of Smart Air Mobility, Korea Aerospace University, Korea, Republic of (South Korea); 2Department of Aerospace and Mechanical Engineering, Korea Aerospace University, Korea, Republic of (South Korea)



Thermofluid-dynamic Performance Improvement of Power Electronics Cooling Systems through CFD Analysis

Radha Russo1, Daniela Cavallaro1, Marco Papaserio1, Emanuela Privitera1, Stefano Mauro2

1STMicroelectronics, Italy; 2University of Catania, Catania, Itlay



Application of Phase Change Material for Thermal Management of Space Electronics

Artur Jurkowski, Radosław Paluch

KP Labs, Gliwice, Poland



Extensive Thermal Evaluation to Select Properly the Package Features to Fit the Product Mechanical and Thermal Requirements

Andrea Garuffo, Donata Gualandris

STMicroelectronics, Italy



Thermal Detection of Degradation in Solder Joints of Passive Components

Nils Jahn, Martin Pfost

TU Dortmund University, Dortmund, Germany



Novel Approach to the Extraction of Sparse Nonlinear Dynamic Compact Thermal Multi-Ports

Lorenzo Codecasa1, Vincenzo d'Alessandro2, Antonio Pio Catalano2, Ciro Scognamillo2, Simone Barcellona1, Dario D'Amore1

1Politecnico di Milano, Milano, Italy; 2Università Federico II, Naples, Naples, Italy



Real-Time State of Charge Estimation of Lithium-Ion Battery Considering Temperature

Simone Barcellona1, Lorenzo Codecasa1, Silvia Colnago2, Dario D'Amore1

1Politecnico di Milano, Milano, Italy; 2Ricerca sul Sistema Energetico, S.p.A.



 
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