| Session | ||
Session 2.2: Thermal Measurement (II)
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| Presentations | ||
Sensorless Dual TSEP Implementation for Junction Temperature Measurement in Parallelized SIC Mosfet 1ICAM School of Engineering, Toulouse, France; 2LAAS-CNRS, Université De Toulouse, CNRS, INSA Impact of GaN Cap Layer and Carbon-Doped Buffer Layer on Thermal Resistance of HEMTs GaN 1Xlim, Limoges, France; 2Indian Institute of Technology Madras, Chennai, India; 3Centre Européen de la Céramique, Limoges, France Transient Electro-thermal Characterisation at Systemlevel for a Easypack-IGBT-Module – Reduced order modelling (ROM) and Junction Temperature Evaluation Based on The on-state Resistance Brandenburg Technical University Cottbus-Senftenberg, Cottbus, Germany Thermal Conductivity Prediction of Composites by Hybrid Physics-Based and Data-Driven Modeling Dow Benelux B.V., Terneuzen, the Netherlands | ||