Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
Authors
 
Session Overview
Session
Session 2.2: Thermal Measurement (II)
Time:
Thursday, 26/Sept/2024:
10:50am - 12:10pm

Session Chair: Vadim Tsoi, Huawei Technologies Sweden AB
 Location: Main Conference Room

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Presentations

Sensorless Dual TSEP Implementation for Junction Temperature Measurement in Parallelized SIC Mosfet

Louis Alauzet1,2, Jean-Pierre Fradin1, Patrick Tounsi2

1ICAM School of Engineering, Toulouse, France; 2LAAS-CNRS, Université De Toulouse, CNRS, INSA


Impact of GaN Cap Layer and Carbon-Doped Buffer Layer on Thermal Resistance of HEMTs GaN

Khalil Karrame1, Sujan Sarkar2, Ramdas Khade2, Jean-Christophe Nallatamby1, Maggy Colas3, Amitava DasGupta2, Nandita DasGupta3, Raphael Sommet1

1Xlim, Limoges, France; 2Indian Institute of Technology Madras, Chennai, India; 3Centre Européen de la Céramique, Limoges, France


Transient Electro-thermal Characterisation at Systemlevel for a Easypack-IGBT-Module – Reduced order modelling (ROM) and Junction Temperature Evaluation Based on The on-state Resistance

Gregor Wiedemann, Tino Lamm, Ralph Schacht

Brandenburg Technical University Cottbus-Senftenberg, Cottbus, Germany


Thermal Conductivity Prediction of Composites by Hybrid Physics-Based and Data-Driven Modeling

Rudi Steenbakkers

Dow Benelux B.V., Terneuzen, the Netherlands