Conference Agenda

Hotspot-aware Microfluidic Cooling for High TDP Chips Using Topology Optimization

Athanasios Boutsikakis, Emile Soutter, Miguel A. Salazar de Troya, Nicola Esposito, Dasha Mukasheva, Hanane Bouras, Remco van Erp

Corintis, Switzerland

Optimization of LHP (loop heat pipe) Geometry for Ultra-high Heat Flux Cooling System

Hee Soo Myeong¹, Seok Pil Jang^1,2

¹Department of Smart Air Mobility, Korea Aerospace University, Goyang-si, Korea, Republic of (South Korea); ²Department of Aeropace and Mechanical Engineering, Korea Aerospace University, Goyang-si, Korea, Republic of (South Korea)

Thermal Characterization of Vertical GaN Based Power Devices

Sandra Fischer, Florian Mayer, Verena Leitgeb, Lisa Mitterhuber, Elke Kraker

Materials Center Leoben Forschung GmbH, Leoben, Austria

Thermal Numerical Modelling of Complex Electronic Devices

Sophie Salvadori, Mahmoud Ali, Viraj Singh, Amandine Battentier

Slb, France

Extracting Time-Constant Spectra by the Subspace Barzilai and Borwei Non-Negative Least Square Algorithm

Joosun Yun¹, Byongjin Ma², Guesuk Lee², Taehee Jung², Dong-Soo Shin³, Youngbeom Kim¹, Hyundon Jung¹

¹EtaMax, Korea, Republic of (South Korea); ²KETI, Korea, Republic of (South Korea); ³Hanyang University ERICA,Ansan-si, Republic of (South Korea)

ATARI: Advanced Thermomigration Analysis for Reliability-Aware Interconnects

Olympia Axelou, Eleni Tselepi, George Floros

University of Thessaly, Thessaly, Greece

A Case Study on Exhaust Airflow Rates by the Enclosure Ventilation Fan Structure of a Cast Resin Transformer

Seongeon Kim, Jaeseop Ryu

LS Electric, Korea, Republic of (South Korea)

Modelling Thermal Properties of Power LEDs Module

Krzysztof Górecki, Przemysław Ptak

Gdynia Maritime University, Gdynia, Poland

Numerical Investigation on the Thermal Resistance and Assembly Cost in SSC and DSC Power Modules

Ciro Scognamillo¹, Antonio Pio Catalano¹, Lorenzo Codecasa², Alberto Castellazzi³, Vincenzo d'Alessandro¹

¹University Federico II, Napoli, Italy; ²Politecnico di Milano, Milan, Italy; ³Kyoto University of Advanced Science, Kyoto, Japan

Electro-Thermal Characteristics Comparison for FinFET, NWFET and NSFET Structures

Konstantin O. Petrosyants, Denis S. Silkin, Dmitiy A. Popov

National Research University Higher School of Economics, Moscow, Russia