Conference Agenda

Thermal and Thermo-mechanical Behavior of Internal Silver-diamond Heat Spreaders for Power Electronic Modules

Aitor Casado Ramoneda^1,2, Yvan Avenas¹, Rabih Khazaka², Cyrille Gautier², Toni Youssef²

¹Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab, 38000 Grenoble, France; ²Safran Tech, Electrical & Electronic Systems Research Group, 78772 Châteaufort, France

Holistic Thermal Management System Design, Testing, and Modeling for 300 kW IGBT-Based Inverter for Switched Reluctance Motor Drives

Mohamed Hefny¹, Ahmed Zaghlol², Kamal Vaghasiya¹, Rachit Pradhan¹, Mohamed Omar¹, Ali Emadi¹

¹McMaster Automotive Resource Centre (MARC)-McMaster University, Ontario, Canada; ²Innovative Thermal Solutions (ITS), Ontario, Canada

Precise 3D Modelling of SiC Dies Temperature Oscillations for Lifetime Prediction of Power Modules Used in DC/AC Power Converters

Alexandre Marie¹, Bernardo Cougo², Loic Renaudie¹, Tresor Kaounodji Koladoum¹, Jean-Pierre Fradin¹

¹ICAM School of Engineering, Toulouse, France; ²IRT Saint-Exupery, Toulouse, France

Thermo-Mechanical Investigations for PCB Assemblies Using Top-side Cooled Power Devices

Philip Matzick, Christian Mentin, Lukas Adelbrecht, Elisa Anes Romero, Roberto Petrella

Silicon Austria Labs, Austria