Sustainable Immersion Cooling of Servers

Wendy Luiten¹, John Parry², Robin Bornoff²

1: WLC, Breda, The Netherlands; 2: Siemens Digital Industries Software, Newbury, UK

2D Materials for Thermal Raman Measurements on Power Electronic Devices

Dominique Carisetti¹, Julie Cholet¹, Lucie Frogé¹, Eva Desgué¹, Pierre Legagneux¹, Patrick Garabedian¹, Nicolas Sarazin¹, Pierre Seneor², Bruno Dlubak², Etienne Carré², Marie-Blandine Martin², Vincent Renaudin³, Tony Moinet⁴, Raphael Sommet⁵

1: Thales Research and Technology, Palaiseau, France; 2: Laboratoire Albert Fert, Palaiseau, France; 3: STMicroelectronics, Grenoble, France; 4: STMicroelectronics, Tours, France; 5: XLIM, Brive la gaillarde, France

Performance Assessment of an Advanced Direct-to-chip Liquid Cooling Solution in Real Conditions Inside a Data Centre

David Beberide^1,2, Desideri Regany¹, Jaume Camarasa¹, Jérôme Barrau^1,2, Montse Vilarrubí^1,2

1: Universitat de Lleida, Lleida, Spain; 2: Universal Smart Cooling S.L., Lleida, Spain

Sensorless Dual TSEP Implementation for Junction Temperature Measurement in Parallelized SIC Mosfet

Louis Alauzet^1,2, Jean-Pierre Fradin¹, Patrick Tounsi²

1: ICAM School of Engineering, Toulouse, France; 2: LAAS-CNRS, Université De Toulouse, CNRS, INSA

Impact of GaN Cap Layer and Carbon-Doped Buffer Layer on Thermal Resistance of HEMTs GaN

Khalil Karrame¹, Sujan Sarkar², Ramdas Khade², Jean-Christophe Nallatamby¹, Maggy Colas³, Amitava DasGupta², Nandita DasGupta³, Raphael Sommet¹

1: Xlim, Limoges, France; 2: Indian Institute of Technology Madras, Chennai, India; 3: Centre Européen de la Céramique, Limoges, France

Transient Electro-thermal Characterisation at Systemlevel for a Easypack-IGBT-Module – Reduced order modelling (ROM) and Junction Temperature Evaluation Based on The on-state Resistance

Gregor Wiedemann, Tino Lamm, Ralph Schacht

Brandenburg Technical University Cottbus-Senftenberg, Cottbus, Germany

Thermal Conductivity Prediction of Composites by Hybrid Physics-Based and Data-Driven Modeling

Rudi Steenbakkers

Dow Benelux B.V., Terneuzen, the Netherlands

Closed-loop Flow Boiling Cooler Test Stand for Investigations on Future Power Package Designs

Ralph Schacht¹, J. Ben Majed¹, Tobias Gruen², Daniel May^2,3, Mohamad Abo Ras², Bernhard Wunderle³

1: Brandenburg University of Technology Cottbus-Senftenberg, Cottbus, Germany; 2: Berliner Nanotest und Design GmbH, Berlin, Germany; 3: Chemnitz University of Technology, Chemnitz, Germany

Two-phase Pumped Cooling System for Power Electronics; Analyses and Experimental Results

Henk Jan van Gerner¹, Arne K. te Nijenhuis¹, Changmin Cao², Ignacio Castro², Douglas A. Pedroso², Herol Dsouza²

1: NLR - Royal Netherlands Aerospace Centre, The Netherlands; 2: Collins-ART, Cork, Ireland

Enabling Overloadability in Power Semiconductor Modules by Pulsating Heat Pipe Coolers

Reza Soleimanzadeh, Yanfei Zhao, Marcel Fuchs

Hitachi Energy, Switzerland

Investigation of Aqueous Alcoholic Mixtures as Working Fluids in a Two-phase Pumpless Loop

Arunjoy Baruah, Shankar Krishnan

IIT Bombay, Mumbai, India

Channel to Channel Thermal Coupling of Double-Channel GaN-based HEMTs

Shiming Li, Mei Wu, Ling Yang, Hao Lu, Bin Hou, Meng Zhang, Xiaohua Ma, Yue Hao

Xidian University, Xi'An, China, People's Republic of

Transient Thermal Simulation of a SiP FO-WLP Embedding a GaN Power Amplifier

N'doua Luc Arnaud Kakou¹, Raphael Sommet¹, Anass Jakani², Khalil Karrame¹, Laurent Brunel³, Vincent Bortolussi³, Benoit Lambert³, Jean-Christophe Nallatamby¹

1: XLIM University of Limoges, UMR7252; 2: III-V Lab; 3: UMS S.A.S

Electro-thermal Analysis for Automotive LDOs with Reverse Current Protection

Alessandro Battigelli¹, Cosmin-Sorin Pleșa², Marius Neag¹, Gabriel Simeon²

1: Technical University of Cluj-Napoca, Cluj-Napoca, Romania; 2: Infineon Technologies, Bucharest, Romania

Characterization of the External Thermal Resistance of the Condenser Using the Evaporative Cooling with Porous Medium

Sungjun Park¹, Seok Pil Jang^1,2

1: Department of Smart Air Mobility, Korea Aerospace University, Korea, Republic of (South Korea); 2: Department of Aerospace and Mechanical Engineering, Korea Aerospace University, Korea, Republic of (South Korea)

Thermofluid-dynamic Performance Improvement of Power Electronics Cooling Systems through CFD Analysis

Radha Russo¹, Daniela Cavallaro¹, Marco Papaserio¹, Emanuela Privitera¹, Stefano Mauro²

1: STMicroelectronics, Italy; 2: University of Catania, Catania, Itlay

Application of Phase Change Material for Thermal Management of Space Electronics

Artur Jurkowski, Radosław Paluch

KP Labs, Gliwice, Poland

Extensive Thermal Evaluation to Select Properly the Package Features to Fit the Product Mechanical and Thermal Requirements

Andrea Garuffo, Donata Gualandris

STMicroelectronics, Italy

Thermal Detection of Degradation in Solder Joints of Passive Components

Nils Jahn, Martin Pfost

TU Dortmund University, Dortmund, Germany

Novel Approach to the Extraction of Sparse Nonlinear Dynamic Compact Thermal Multi-Ports

Lorenzo Codecasa¹, Vincenzo d'Alessandro², Antonio Pio Catalano², Ciro Scognamillo², Simone Barcellona¹, Dario D'Amore¹

1: Politecnico di Milano, Milano, Italy; 2: Università Federico II, Naples, Naples, Italy

Real-Time State of Charge Estimation of Lithium-Ion Battery Considering Temperature

Simone Barcellona¹, Lorenzo Codecasa¹, Silvia Colnago², Dario D'Amore¹

1: Politecnico di Milano, Milano, Italy; 2: Ricerca sul Sistema Energetico, S.p.A.

Raman Thermometry: A Simultaneous Structural And Thermal Characterization Technique For GeSbTe Based Phase Change Materials

Akash Patil^1,2, Tushar Chakrabarty^1,2, Yannick Le-Friec², Jury Sandrini², Roberto Simola³, Simon Jeannot², Philippe Boivin³, Emmanuel Dubois¹, Jean-Francois Robillard¹

1: Univ. Lille, Lille, France; 2: STMicroelectronics, Crolles, France; 3: STMicroelectronics, Rousset, France

Layer Resolved Thermal Impedance Measurement with Laser Stimulated Transient Thermal Analysis of Semiconductor Modules

Hannes Schwan, Maximilian Schmid, Gordon Elger

Technische Hochschule Ingolstadt, Ingolstadt, Germany

Thermal Performance Comparison of an Adjustable Air Amplifier with Rotary Fans

David W. Salter^1,2, Eoin H. Oude Essink^1,2, Gordon O'Brien², Tim Persoons², Sajad Alimohammadi^1,2

1: School of Mechanical Engineering, Technological University Dublin, Ireland; 2: Department of Mechanical, Manufacturing & Biomedical Engineering, Trinity College Dublin, Ireland